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Class Information
Number: 257/E21.585
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo) > Interconnections, comprising conductors and dielectrics, for carrying current between separate components within device (epo) > Characterized by formation and post treatment of dielectrics, e.g., planarizing (epo) > Filling of holes, grooves, vias or trenches with conductive material (epo)
Description: This subclass is indented under subclass E21.582. This subclass is substantially the same in scope as ECLA classification H01L21/768C4.










Sub-classes under this class:

Class Number Class Name Patents
257/E21.587 By deposition over sacrificial masking layer, e.g., lift-off (epo) 162
257/E21.586 By selective deposition of conductive material in vias, e.g., selective chemical vapor deposition on semiconductor material, plating (epo) 641
257/E21.588 Reflowing or applying pressure to fill contact hole, e.g., to remove voids (epo) 236


Patents under this class:

Patent Number Title Of Patent Date Issued
7625819 Interconnection process Dec. 1, 2009
7625818 Method for forming vias in a substrate Dec. 1, 2009
7622375 Conductive member and process of producing the same Nov. 24, 2009
7615486 Apparatus and method for integrated surface treatment and deposition for copper interconnect Nov. 10, 2009
7615475 Method for fabricating landing polysilicon contact structures for semiconductor devices Nov. 10, 2009
7611985 Formation of holes in substrates using dewetting coatings Nov. 3, 2009
7602055 Semiconductor device and method for fabricating the same Oct. 13, 2009
7601637 Atomic layer deposited tantalum containing adhesion layer Oct. 13, 2009
7595556 Semiconductor device and method for manufacturing the same Sep. 29, 2009
7595529 Semiconductor integrated circuit devices having upper pattern aligned with lower pattern molded by semiconductor substrate and methods of forming the same Sep. 29, 2009
7592267 Method for manufacturing semiconductor silicon substrate and apparatus for manufacturing the same Sep. 22, 2009
7592259 Methods and systems for barrier layer surface passivation Sep. 22, 2009
7592258 Metallization layer of a semiconductor device having differently thick metal lines and a method of forming the same Sep. 22, 2009
7592248 Method of forming semiconductor device having nanotube structures Sep. 22, 2009
7592245 Poly filled substrate contact on SOI structure Sep. 22, 2009
7589014 Semiconductor device having multiple wiring layers and method of producing the same Sep. 15, 2009
7582566 Method for redirecting void diffusion away from vias in an integrated circuit design Sep. 1, 2009
7576004 Semiconductor chip and method of manufacturing semiconductor chip Aug. 18, 2009
7576002 Multi-step barrier deposition method Aug. 18, 2009
7572717 Method of manufacturing semiconductor device Aug. 11, 2009
7566653 Interconnect structure with grain growth promotion layer and method for forming the same Jul. 28, 2009
7566621 Method for forming semiconductor device having fin structure Jul. 28, 2009
7563719 Dual damascene process Jul. 21, 2009
7557039 Method for fabricating contact hole of semiconductor device Jul. 7, 2009
7557036 Method, system, and apparatus for filling vias Jul. 7, 2009
7557034 Semiconductor device and a method of manufacturing the same Jul. 7, 2009
7553763 Salicide process utilizing a cluster ion implantation process Jun. 30, 2009
7553743 Wafer bonding method of system in package Jun. 30, 2009
7550386 Advanced seed layers for interconnects Jun. 23, 2009
7547972 Laminated structure, very-large-scale integrated circuit wiring board, and method of formation thereof Jun. 16, 2009
7547628 Method for manufacturing capacitor Jun. 16, 2009
7541279 Method for manufacturing semiconductor device Jun. 2, 2009
7531896 Semiconductor device having a minimal via resistance created by applying a nitrogen plasma to a titanium via liner May. 12, 2009
7524742 Structure of metal interconnect and fabrication method thereof Apr. 28, 2009
7524716 Fabricating method of semiconductor structure Apr. 28, 2009
7521368 Method for manufacturing semiconductor device Apr. 21, 2009
7521352 Method for manufacturing a semiconductor device Apr. 21, 2009
7517782 Method of forming a metal layer over a patterned dielectric by wet chemical deposition including an electroless and a powered phase Apr. 14, 2009
7514309 Methods to selectively protect NMOS regions, PMOS regions, and gate layers during EPI process Apr. 7, 2009
7501687 Method of forming isolation structure of semiconductor device for preventing excessive loss during recess gate formation Mar. 10, 2009
7501342 Device having high aspect-ratio via structure in low-dielectric material and method for manufacturing the same Mar. 10, 2009
7498260 Pass through via technology for use during the manufacture of a semiconductor device Mar. 3, 2009
7498254 Plating seed layer including an oxygen/nitrogen transition region for barrier enhancement Mar. 3, 2009
7498253 Local interconnection method and structure for use in semiconductor device Mar. 3, 2009
7498252 Dual layer dielectric stack for microelectronics having thick metal lines Mar. 3, 2009
7494927 Method of growing electrical conductors Feb. 24, 2009
7491560 Fabricating method of flat panel display device Feb. 17, 2009
7485560 Method for fabricating crystalline silicon thin films Feb. 3, 2009
7482694 Semiconductor device and its manufacturing method Jan. 27, 2009
7482198 Method for producing through-contacts and a semiconductor component with through-contacts Jan. 27, 2009











 
 
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