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Class Information
Number: 257/E21.585
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo) > Interconnections, comprising conductors and dielectrics, for carrying current between separate components within device (epo) > Characterized by formation and post treatment of dielectrics, e.g., planarizing (epo) > Filling of holes, grooves, vias or trenches with conductive material (epo)
Description: This subclass is indented under subclass E21.582. This subclass is substantially the same in scope as ECLA classification H01L21/768C4.










Sub-classes under this class:

Class Number Class Name Patents
257/E21.587 By deposition over sacrificial masking layer, e.g., lift-off (epo) 162
257/E21.586 By selective deposition of conductive material in vias, e.g., selective chemical vapor deposition on semiconductor material, plating (epo) 641
257/E21.588 Reflowing or applying pressure to fill contact hole, e.g., to remove voids (epo) 236


Patents under this class:

Patent Number Title Of Patent Date Issued
7960800 Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same Jun. 14, 2011
7960290 Method of fabricating a semiconductor device Jun. 14, 2011
7960277 Electronic device and method of manufacturing the same Jun. 14, 2011
7956466 Structure for interconnect structure containing various capping materials for electrical fuse and other related applications Jun. 7, 2011
7956416 Integrated circuitry Jun. 7, 2011
7955979 Method of growing electrical conductors Jun. 7, 2011
7952162 Semiconductor device and method for manufacturing the same May. 31, 2011
7952146 Grain growth promotion layer for semiconductor interconnect structures May. 31, 2011
7951683 In-situ process layer using silicon-rich-oxide for etch selectivity in high AR gapfill May. 31, 2011
7943509 Method of making an interconnect structure May. 17, 2011
7943503 Trench interconnect structure and formation method May. 17, 2011
7943465 Method for manufacturing a semiconductor component May. 17, 2011
7943416 Local heterostructure contacts May. 17, 2011
7939449 Methods of forming hybrid conductive vias including small dimension active surface ends and larger dimension back side ends May. 10, 2011
7932172 Semiconductor chip and process for forming the same Apr. 26, 2011
7928507 Polysilicon control etch-back indicator Apr. 19, 2011
7928008 Method for fabricating semiconductor device Apr. 19, 2011
7927967 Method for manufacturing semiconductor memory device Apr. 19, 2011
7923370 Method for stacking serially-connected integrated circuits and multi-chip device made from same Apr. 12, 2011
7919404 Method of manufacturing semiconductor device including forming a t-shape gate electrode Apr. 5, 2011
7915164 Method for forming doped polysilicon via connecting polysilicon layers Mar. 29, 2011
7915163 Method for forming doped polysilicon via connecting polysilicon layers Mar. 29, 2011
7915139 CVD flowable gap fill Mar. 29, 2011
7910480 Method for insulating wires of semiconductor device Mar. 22, 2011
7906347 Magnetic storage device and method of manufacturing the same Mar. 15, 2011
7902613 Self-alignment for semiconductor patterns Mar. 8, 2011
7902069 Small area, robust silicon via structure and process Mar. 8, 2011
7897484 Fabricating a top conductive layer in a semiconductor die Mar. 1, 2011
7892974 Method of forming vias in silicon carbide and resulting devices and circuits Feb. 22, 2011
7892973 Method for manufacturing a semiconductor device Feb. 22, 2011
7892967 Semiconductor device and method for manufacturing the same Feb. 22, 2011
7892918 Method of fabricating a semiconductor device including formation of contact holes Feb. 22, 2011
7884488 Semiconductor component with improved contact pad and method for forming the same Feb. 8, 2011
7884005 Method of manufacturing a semiconductor device Feb. 8, 2011
7879714 Semiconductor device manufacturing method Feb. 1, 2011
7879679 Electronic component manufacturing method Feb. 1, 2011
7879263 Method and solution to grow charge-transfer complex salts Feb. 1, 2011
7875553 Method of manufacturing semiconductor package Jan. 25, 2011
7867889 Method of forming an interconnect structure on an integrated circuit die Jan. 11, 2011
7863189 Methods for fabricating silicon carriers with conductive through-vias with low stress and low defect density Jan. 4, 2011
7859114 IC chip and design structure with through wafer vias dishing correction Dec. 28, 2010
7859113 Structure including via having refractory metal collar at copper wire and dielectric layer liner-less interface and related method Dec. 28, 2010
7855141 Semiconductor device having multiple wiring layers and method of producing the same Dec. 21, 2010
7854804 Nitride crystal, nitride crystal substrate, epilayer-containing nitride crystal substrate, semiconductor device and method of manufacturing the same Dec. 21, 2010
7851353 Method of forming a metal silicide layer, devices incorporating metal silicide layers and design structures for the devices Dec. 14, 2010
7851342 In-situ formation of conductive filling material in through-silicon via Dec. 14, 2010
7847339 Semiconductor integrated circuit devices having conductive patterns that are electrically connected to junction regions Dec. 7, 2010
7846777 Semiconductor device package and fabricating method thereof Dec. 7, 2010
7843072 Semiconductor package having through holes Nov. 30, 2010
7842610 Semiconductor device Nov. 30, 2010











 
 
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