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Class Information
Number: 257/E21.585
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo) > Interconnections, comprising conductors and dielectrics, for carrying current between separate components within device (epo) > Characterized by formation and post treatment of dielectrics, e.g., planarizing (epo) > Filling of holes, grooves, vias or trenches with conductive material (epo)
Description: This subclass is indented under subclass E21.582. This subclass is substantially the same in scope as ECLA classification H01L21/768C4.










Sub-classes under this class:

Class Number Class Name Patents
257/E21.587 By deposition over sacrificial masking layer, e.g., lift-off (epo) 162
257/E21.586 By selective deposition of conductive material in vias, e.g., selective chemical vapor deposition on semiconductor material, plating (epo) 641
257/E21.588 Reflowing or applying pressure to fill contact hole, e.g., to remove voids (epo) 236


Patents under this class:

Patent Number Title Of Patent Date Issued
8058732 Semiconductor die structures for wafer-level chipscale packaging of power devices, packages and systems for using the same, and methods of making the same Nov. 15, 2011
8053899 Semiconductor devices including damascene trenches with conductive structures Nov. 8, 2011
8053362 Method of forming metal electrode of system in package Nov. 8, 2011
8053360 Semiconductor device and method of manufacturing the same Nov. 8, 2011
8053354 Reduced wafer warpage in semiconductors by stress engineering in the metallization system Nov. 8, 2011
8053272 Semiconductor device fabrication method Nov. 8, 2011
8048804 Method of manufacturing semiconductor package Nov. 1, 2011
8048803 Method for forming contact plug in a semiconductor device Nov. 1, 2011
8048799 Method for forming copper wiring in semiconductor device Nov. 1, 2011
8043963 Semiconductor device manufacturing method and semiconductor device manufacturing apparatus Oct. 25, 2011
8034693 Method for fabricating semiconductor device Oct. 11, 2011
8034684 Semiconductor device with improved overlay margin and method of manufacturing the same Oct. 11, 2011
8034683 Method of forming a phase change material layer, method of forming a phase change memory device using the same, and a phase change memory device so formed Oct. 11, 2011
8034679 Fabrication of field-effect transistor having hypoabrupt body dopant distribution below source/drain zone Oct. 11, 2011
8030211 Methods for forming bit line contacts and bit lines during the formation of a semiconductor device Oct. 4, 2011
8026166 Interconnect structures comprising capping layers with low dielectric constants and methods of making the same Sep. 27, 2011
8021977 Methods of forming contact structures and semiconductor devices fabricated using contact structures Sep. 20, 2011
8017482 Method of manufacturing semiconductor device Sep. 13, 2011
8012872 Planarising damascene structures Sep. 6, 2011
8012796 Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers Sep. 6, 2011
8009477 Integrated circuit and method of forming an integrated circuit Aug. 30, 2011
8008189 Semiconductor device manufacturing method, semiconductor device, and semiconductor wafer structure Aug. 30, 2011
8008187 Method for reducing dielectric overetch using a dielectric etch stop at a planar surface Aug. 30, 2011
8004089 Semiconductor device having wiring line and manufacturing method thereof Aug. 23, 2011
8004084 Semiconductor device and manufacturing method thereof Aug. 23, 2011
8004082 Electronic component formed with barrier-seed layer on base material Aug. 23, 2011
8003535 Semiconductor device manufacturing method and target substrate processing system Aug. 23, 2011
8003532 Method of using an electroless plating for depositing a metal seed layer for the subsequent plated backside metal film Aug. 23, 2011
8003527 Manufacturing method of semiconductor device Aug. 23, 2011
8003525 Semiconductor device and method of manufacturing the same Aug. 23, 2011
8003524 Plating seed layer including an oxygen/nitrogen transition region for barrier enhancement Aug. 23, 2011
7998851 Semiconductor devices having contact plugs with stress buffer spacers and methods of fabricating the same Aug. 16, 2011
7994642 Semiconductor device which includes contact plug and embedded interconnection connected to contact plug Aug. 9, 2011
7994041 Method of manufacturing stacked semiconductor package using improved technique of forming through via Aug. 9, 2011
7989862 Semiconductor device and its manufacturing method Aug. 2, 2011
7989282 Structure and method for latchup improvement using through wafer via latchup guard ring Aug. 2, 2011
7985690 Method for a gate last process Jul. 26, 2011
7985676 Method of making a contact in a semiconductor device Jul. 26, 2011
7982284 Semiconductor component including an isolation structure and a contact to the substrate Jul. 19, 2011
7977766 Trench anti-fuse structures for a programmable integrated circuit Jul. 12, 2011
7977237 Fabricating vias of different size of a semiconductor device by splitting the via patterning process Jul. 12, 2011
7977201 Methods for forming back-end-of-line resistive semiconductor structures Jul. 12, 2011
7972961 Purge step-controlled sequence of processing semiconductor wafers Jul. 5, 2011
7972956 Method for manufacturing a wire structure of a semiconductor device Jul. 5, 2011
7972918 Fabrication of semiconductor architecture having field-effect transistors especially suitable for analog applications Jul. 5, 2011
7968447 Semiconductor device and methods of manufacturing the same Jun. 28, 2011
7964966 Via gouged interconnect structure and method of fabricating same Jun. 21, 2011
7964505 Atomic layer deposition of tungsten materials Jun. 21, 2011
7964472 Method of producing semiconductor device Jun. 21, 2011
7964437 Memory device having wide area phase change element and small electrode contact area Jun. 21, 2011











 
 
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