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Class Information
Number: 257/E21.585
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo) > Interconnections, comprising conductors and dielectrics, for carrying current between separate components within device (epo) > Characterized by formation and post treatment of dielectrics, e.g., planarizing (epo) > Filling of holes, grooves, vias or trenches with conductive material (epo)
Description: This subclass is indented under subclass E21.582. This subclass is substantially the same in scope as ECLA classification H01L21/768C4.










Sub-classes under this class:

Class Number Class Name Patents
257/E21.587 By deposition over sacrificial masking layer, e.g., lift-off (epo) 162
257/E21.586 By selective deposition of conductive material in vias, e.g., selective chemical vapor deposition on semiconductor material, plating (epo) 641
257/E21.588 Reflowing or applying pressure to fill contact hole, e.g., to remove voids (epo) 236


Patents under this class:

Patent Number Title Of Patent Date Issued
8198174 Air channel interconnects for 3-D integration Jun. 12, 2012
8193088 Method of forming metal lines of semiconductor device Jun. 5, 2012
8187969 Method for manufacturing semiconductor device May. 29, 2012
8187968 Methods of post-contact back end of line through-hole via integration May. 29, 2012
8187966 Manufacturing method for semiconductor integrated circuit device May. 29, 2012
8187918 Methods of forming multi-level cell of semiconductor memory May. 29, 2012
8183160 Method for manufacturing a semiconductor device and semiconductor device obtainable with such a method May. 22, 2012
8178441 Semiconductor device and method for manufacturing the same May. 15, 2012
8174124 Dummy pattern in wafer backside routing May. 8, 2012
8173539 Method for fabricating metal redistribution layer May. 8, 2012
8168535 Method fabricating semiconductor device using multiple polishing processes May. 1, 2012
8168528 Restoration method using metal for better CD controllability and Cu filing May. 1, 2012
8164193 Metal wiring of semiconductor device and forming method thereof Apr. 24, 2012
8158515 Method of making 3D integrated circuits Apr. 17, 2012
8153522 Patterning mask and method of formation of mask using step double patterning Apr. 10, 2012
8148257 Semiconductor structure and method for making same Apr. 3, 2012
8138095 Method of substrate treatment, process for producing semiconductor device, substrate treating apparatus, and recording medium Mar. 20, 2012
8138084 Electroless Cu plating for enhanced self-forming barrier layers Mar. 20, 2012
8138082 Method for forming metal interconnects in a dielectric material Mar. 20, 2012
8138036 Through silicon via and method of fabricating same Mar. 20, 2012
8134234 Application of Mn for damage restoration after etchback Mar. 13, 2012
8133812 Methods and systems for barrier layer surface passivation Mar. 13, 2012
8133777 Method of fabricating memory Mar. 13, 2012
8129791 Semiconductor device having a contact plug and manufacturing method thereof Mar. 6, 2012
8129268 Self-aligned lower bottom electrode Mar. 6, 2012
8124527 CMP process flow for MEMS Feb. 28, 2012
8119519 Semiconductor device manufacturing method Feb. 21, 2012
8119486 Methods of manufacturing semiconductor devices having a recessed-channel Feb. 21, 2012
8119448 Semiconductor chip, wafer stack package using the same, and methods of manufacturing the same Feb. 21, 2012
8114736 Integrated circuit system with memory system Feb. 14, 2012
8110477 Semiconductor device and method of forming high-frequency circuit structure and method thereof Feb. 7, 2012
8106515 Local metallization and use thereof in semiconductor devices Jan. 31, 2012
8105941 Through-wafer interconnection Jan. 31, 2012
8105907 Manufacturing method of semiconductor memory device Jan. 31, 2012
8097536 Reducing metal voids in a metallization layer stack of a semiconductor device by providing a dielectric barrier layer Jan. 17, 2012
8097492 Method and manufacture of silicon based package and devices manufactured thereby Jan. 17, 2012
8088685 Integration of bottom-up metal film deposition Jan. 3, 2012
8084352 Method of manufacturing semiconductor device Dec. 27, 2011
8080875 Interconnection substrate and semiconductor device, manufacturing method of interconnection substrate Dec. 20, 2011
8080459 Self aligned contact in a semiconductor device and method of fabricating the same Dec. 20, 2011
8076239 Semiconductor device and method of manufacturing the same Dec. 13, 2011
8076237 Method and apparatus for 3D interconnect Dec. 13, 2011
8076230 Method of forming self-aligned contacts and local interconnects Dec. 13, 2011
8076203 Semiconductor device and method of manufacturing the same Dec. 13, 2011
8072070 Low fabrication cost, fine pitch and high reliability solder bump Dec. 6, 2011
8072036 Micro-electromechanical system microphone structure Dec. 6, 2011
8071481 Method for forming highly strained source/drain trenches Dec. 6, 2011
8071445 Method for manufacturing semiconductor device, and semiconductor device Dec. 6, 2011
8071412 Method of fabricating micro-electromechanical system microphone structure Dec. 6, 2011
8062971 Dual damascene process Nov. 22, 2011











 
 
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