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Class Information
Number: 257/E21.585
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo) > Interconnections, comprising conductors and dielectrics, for carrying current between separate components within device (epo) > Characterized by formation and post treatment of dielectrics, e.g., planarizing (epo) > Filling of holes, grooves, vias or trenches with conductive material (epo)
Description: This subclass is indented under subclass E21.582. This subclass is substantially the same in scope as ECLA classification H01L21/768C4.

Sub-classes under this class:

Class Number Class Name Patents
257/E21.587 By deposition over sacrificial masking layer, e.g., lift-off (epo) 162
257/E21.586 By selective deposition of conductive material in vias, e.g., selective chemical vapor deposition on semiconductor material, plating (epo) 641
257/E21.588 Reflowing or applying pressure to fill contact hole, e.g., to remove voids (epo) 236

Patents under this class:

Patent Number Title Of Patent Date Issued
8368196 Micro device having a movable structure Feb. 5, 2013
8367500 Method of forming self aligned contacts for a power MOSFET Feb. 5, 2013
8362621 Microelectronic devices including multiple through-silicon via structures on a conductive pad and methods of fabricating the same Jan. 29, 2013
8362619 Nonvolatile memory device and method of manufacturing the same Jan. 29, 2013
8358007 Integrated circuit system employing low-k dielectrics and method of manufacture thereof Jan. 22, 2013
8357613 Methods of fabricating semiconductor devices and semiconductor devices including a contact plug processed by rapid thermal annealing Jan. 22, 2013
8354737 Small area, robust silicon via structure and process Jan. 15, 2013
8349733 Manufacturing method of substrate with through electrode Jan. 8, 2013
8349724 Method for improving electromigration lifetime of copper interconnection by extended post anneal Jan. 8, 2013
8349639 Method for manufacturing image sensor Jan. 8, 2013
8344512 Three-dimensional silicon interposer for low voltage low power systems Jan. 1, 2013
8344478 Inductors having inductor axis parallel to substrate surface Jan. 1, 2013
8338296 Method for forming a catalyst suitable for growth of carbon nanotubes Dec. 25, 2012
8334196 Methods of forming conductive contacts in the fabrication of integrated circuitry Dec. 18, 2012
8324098 Via and method of forming the via with a substantially planar top surface that is suitable for carbon nanotube applications Dec. 4, 2012
8318593 Method for electron beam induced deposition of conductive material Nov. 27, 2012
8314494 Metal cap layer of increased electrode potential for copper-based metal regions in semiconductor devices Nov. 20, 2012
8309993 Pixel of image sensor and method for fabricating the same Nov. 13, 2012
8298912 Semiconductor structure and method of manufacturing same Oct. 30, 2012
8298911 Methods of forming wiring structures Oct. 30, 2012
8298848 Method of generating electrical energy in an integrated circuit during the operation of the latter, corresponding integrated circuit and method of fabrication Oct. 30, 2012
8293603 Methods of fabricating semiconductor devices Oct. 23, 2012
8288283 Aluminum enhanced palladium CMP process Oct. 16, 2012
8278614 Image sensor and method for manufacturing the same Oct. 2, 2012
8278220 Method to direct pattern metals on a substrate Oct. 2, 2012
8278157 Methods for fabricating array substrates Oct. 2, 2012
8273655 Semiconductor device and method of manufacturing the same Sep. 25, 2012
8258057 Copper-filled trench contact for transistor performance improvement Sep. 4, 2012
8258026 Fabrication of semiconductor architecture having field-effect transistors especially suitable for analog applications Sep. 4, 2012
8252693 Self-alignment for semiconductor patterns Aug. 28, 2012
8252679 Semiconductor process Aug. 28, 2012
8242013 Virtually substrate-less composite power semiconductor device and method Aug. 14, 2012
8237284 Contact plug of semiconductor device and method of forming the same Aug. 7, 2012
8236682 Method of forming contact structure Aug. 7, 2012
8236681 Manufacturing method of semiconductor integrated circuit device Aug. 7, 2012
8232646 Interconnect structure for integrated circuits having enhanced electromigration resistance Jul. 31, 2012
8232204 Method of forming borderless contact for transistor Jul. 31, 2012
8232203 Methods of manufacturing memory devices Jul. 31, 2012
8232198 Self-aligned permanent on-chip interconnect structure formed by pitch splitting Jul. 31, 2012
8232195 Method for fabricating back end of the line structures with liner and seed materials Jul. 31, 2012
8227922 Semiconductor device having a multilayer interconnection structure that includes an etching stopper film Jul. 24, 2012
8227853 Semiconductor integrated circuit devices having conductive patterns that are electrically connected to junction regions Jul. 24, 2012
8227323 Method for manufacturing semiconductor device Jul. 24, 2012
8227292 Process for the production of a MWT silicon solar cell Jul. 24, 2012
8216936 Low capacitance electrical connection via Jul. 10, 2012
8212355 Semiconductor package and manufacturing method of the semiconductor package Jul. 3, 2012
8211799 Atomic layer deposition of tungsten materials Jul. 3, 2012
8211797 Metal wiring layer and method of fabricating the same Jul. 3, 2012
8207041 Semiconductor processing methods Jun. 26, 2012
8202766 Method for fabricating through-silicon via structure Jun. 19, 2012

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