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Class Information
Number: 257/E21.585
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo) > Interconnections, comprising conductors and dielectrics, for carrying current between separate components within device (epo) > Characterized by formation and post treatment of dielectrics, e.g., planarizing (epo) > Filling of holes, grooves, vias or trenches with conductive material (epo)
Description: This subclass is indented under subclass E21.582. This subclass is substantially the same in scope as ECLA classification H01L21/768C4.










Sub-classes under this class:

Class Number Class Name Patents
257/E21.587 By deposition over sacrificial masking layer, e.g., lift-off (epo) 162
257/E21.586 By selective deposition of conductive material in vias, e.g., selective chemical vapor deposition on semiconductor material, plating (epo) 641
257/E21.588 Reflowing or applying pressure to fill contact hole, e.g., to remove voids (epo) 236


Patents under this class:
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Patent Number Title Of Patent Date Issued
6787913 Ohmic contact plug having an improved crack free TiN barrier metal in a contact hole and method of forming the same Sep. 7, 2004
6787914 Tungsten-based interconnect that utilizes thin titanium nitride layer Sep. 7, 2004
6784045 Microchannel formation for fuses, interconnects, capacitors, and inductors Aug. 31, 2004
6784052 Method of forming a capacitor with two diffusion barrier layers formed in the same step Aug. 31, 2004
6784102 Laterally interconnecting structures Aug. 31, 2004
6784501 Process for forming metalized contacts to periphery transistors Aug. 31, 2004
6784550 Thermal processing of metal alloys for an improved CMP process in integrated circuit fabrication Aug. 31, 2004
6780752 Metal thin film of semiconductor device and method for forming same Aug. 24, 2004
6780763 Method for fabricating semiconductor device capable of improving gap-fill property Aug. 24, 2004
6780765 Integrated circuit trenched features and method of producing same Aug. 24, 2004
6780777 Method for forming metal layer of semiconductor device Aug. 24, 2004
6781235 Three-level unitary interconnect structure Aug. 24, 2004
6776622 Conductive contact structure and process for producing the same Aug. 17, 2004
6777289 Processing methods of forming an electrically conductive plug to a node location Aug. 17, 2004
6777305 Method for fabricating semiconductor device Aug. 17, 2004
6777332 Method for forming wiring structure Aug. 17, 2004
6777738 Semiconductor integrated circuit Aug. 17, 2004
6774035 Thermal processing of metal alloys for an improved CMP process in integrated circuit fabrication Aug. 10, 2004
6774036 Integrated circuit trenched features and method of producing same Aug. 10, 2004
6774487 Small grain size, conformal aluminum interconnects and method for their formation Aug. 10, 2004
6774488 Low leakage and low resistance for memory and the manufacturing method for the plugs Aug. 10, 2004
6770557 Semiconductor device and method of fabricating the same Aug. 3, 2004
6770560 Method of forming metal wiring Aug. 3, 2004
6767582 Method of modifying source chemicals in an ald process Jul. 27, 2004
6762482 Memory device with composite contact plug and method for manufacturing the same Jul. 13, 2004
6757971 Filling plugs through chemical mechanical polish Jul. 6, 2004
6758947 Damage-free sculptured coating deposition Jul. 6, 2004
6759332 Method for producing dual damascene interconnections and structure produced thereby Jul. 6, 2004
6759333 Semiconductor device and method of manufacturing the same Jul. 6, 2004
6759748 Wiring structure of semiconductor device Jul. 6, 2004
6755945 Ionized PVD with sequential deposition and etching Jun. 29, 2004
6753251 Method for filling recessed micro-structures with metallization in the production of a microelectronic device Jun. 22, 2004
6753254 Method for forming a metallization layer Jun. 22, 2004
6750089 Methods of forming conductive interconnects Jun. 15, 2004
6750137 Method and apparatus for forming an interlayer insulating film and semiconductor device Jun. 15, 2004
6750143 Method for forming a plating film, and device for forming the same Jun. 15, 2004
6746589 Plating method and plating apparatus Jun. 8, 2004
6746591 ECP gap fill by modulating the voltate on the seed layer to increase copper concentration inside feature Jun. 8, 2004
6746947 Post-fuse blow corrosion prevention structure for copper fuses Jun. 8, 2004
6746950 Low temperature aluminum planarization process Jun. 8, 2004
6746962 Method for fabricating a semi-conductor device having a tungsten film-filled via hole Jun. 8, 2004
6743395 Composite metallic ultrafine particles and process for producing the same Jun. 1, 2004
6743692 Semiconductor device manufacturing method Jun. 1, 2004
6743714 Low temperature integrated metallization process and apparatus Jun. 1, 2004
6743718 Process for producing barrier film and barrier film thus produced Jun. 1, 2004
6743719 Method for forming a conductive copper structure Jun. 1, 2004
6744092 Semiconductor memory device capable of preventing oxidation of plug and method for fabricating the same Jun. 1, 2004
6740221 Method of forming copper interconnects May. 25, 2004
6740564 Method for manufacturing a semiconductor device May. 25, 2004
6740976 Semiconductor device including via contact plug with a discontinuous barrier layer May. 25, 2004

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