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Class Information
Number: 257/E21.585
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo) > Interconnections, comprising conductors and dielectrics, for carrying current between separate components within device (epo) > Characterized by formation and post treatment of dielectrics, e.g., planarizing (epo) > Filling of holes, grooves, vias or trenches with conductive material (epo)
Description: This subclass is indented under subclass E21.582. This subclass is substantially the same in scope as ECLA classification H01L21/768C4.

Sub-classes under this class:

Class Number Class Name Patents
257/E21.587 By deposition over sacrificial masking layer, e.g., lift-off (epo) 162
257/E21.586 By selective deposition of conductive material in vias, e.g., selective chemical vapor deposition on semiconductor material, plating (epo) 641
257/E21.588 Reflowing or applying pressure to fill contact hole, e.g., to remove voids (epo) 236

Patents under this class:
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Patent Number Title Of Patent Date Issued
6958247 Method of electroplating copper over a patterned dielectric layer to enhance process uniformity of a subsequent CMP process Oct. 25, 2005
6958290 Method and apparatus for improving adhesion between layers in integrated devices Oct. 25, 2005
6958501 Contact-making structure for a ferroelectric storage capacitor and method for fabricating the structure Oct. 25, 2005
6958540 Dual damascene interconnect structures having different materials for line and via conductors Oct. 25, 2005
6953741 Methods of fabricating contacts for semiconductor devices utilizing a pre-flow process Oct. 11, 2005
6951814 Methods for forming a metal wiring layer on an integrated circuit device at reduced temperatures Oct. 4, 2005
6949832 Semiconductor device including dissimilar element-diffused metal layer and manufacturing method thereof Sep. 27, 2005
6946066 Multi step electrodeposition process for reducing defects and minimizing film thickness Sep. 20, 2005
6946387 Semiconductor device and method for manufacturing the same Sep. 20, 2005
6946392 Filling plugs through chemical mechanical polish Sep. 20, 2005
6946393 Small grain size, conformal aluminum interconnects and method for their formation Sep. 20, 2005
6946401 Plasma treatment for copper oxide reduction Sep. 20, 2005
6946716 Electroplated interconnection structures on integrated circuit chips Sep. 20, 2005
6946735 Side-wall barrier structure and method of fabrication Sep. 20, 2005
6942780 Method and apparatus for processing a substrate with minimal edge exclusion Sep. 13, 2005
6943105 Soft metal conductor and method of making Sep. 13, 2005
6943109 Method of manufacturing a semiconductor element Sep. 13, 2005
6943112 Defect-free thin and planar film processing Sep. 13, 2005
6943446 Via construction for structural support Sep. 13, 2005
6939799 Method of forming a field effect transistor and methods of forming integrated circuitry Sep. 6, 2005
6939804 Formation of composite tungsten films Sep. 6, 2005
6936538 Method and apparatus for depositing tungsten after surface treatment to improve film characteristics Aug. 30, 2005
6936544 Method of removing metal etching residues following a metal etchback process to improve a CMP process Aug. 30, 2005
6936926 Wiring structure in a semiconductor device Aug. 30, 2005
6932896 Method and apparatus for avoiding particle accumulation in electrodeposition Aug. 23, 2005
6933190 Semiconductor device having a capacitor with rare metal electrode Aug. 23, 2005
6933609 Interconnection structure and interconnection structure formation method Aug. 23, 2005
6929722 Substrate plating apparatus Aug. 16, 2005
6930391 Method for alloy-electroplating group IB metals with refractory metals for interconnections Aug. 16, 2005
6926057 Thin film forming apparatus and thin film forming method Aug. 9, 2005
6923891 Copper interconnects Aug. 2, 2005
6921551 Plating method and apparatus for controlling deposition on predetermined portions of a workpiece Jul. 26, 2005
6919268 Method of manufacturing a WN contact plug Jul. 19, 2005
6919275 Method of preventing diffusion of copper through a tantalum-comprising barrier layer Jul. 19, 2005
6917111 Semiconductor device having cell plugs Jul. 12, 2005
6913680 Method of application of electrical biasing to enhance metal deposition Jul. 5, 2005
6913996 Method of forming metal wiring and semiconductor manufacturing apparatus for forming metal wiring Jul. 5, 2005
6911136 Method for regulating the electrical power applied to a substrate during an immersion process Jun. 28, 2005
6911394 Semiconductor devices and methods of manufacturing such semiconductor devices Jun. 28, 2005
6911396 Method of producing metallic film Jun. 28, 2005
6908534 Substrate plating method and apparatus Jun. 21, 2005
6908802 Ferroelectric circuit element that can be fabricated at low temperatures and method for making the same Jun. 21, 2005
6908847 Method of manufacturing a semiconductor device having an interconnect embedded in an insulating film Jun. 21, 2005
6908849 High aspect ratio contact structure with reduced silicon consumption Jun. 21, 2005
6903000 System for improving thermal stability of copper damascene structure Jun. 7, 2005
6903009 Methods for fabricating a contact for an integrated circuit Jun. 7, 2005
6899796 Partially filling copper seed layer May. 31, 2005
6899799 Method and apparatus for improving sidewall coverage during sputtering in a chamber having an inductively coupled plasma May. 31, 2005
6900106 Methods of forming capacitor constructions May. 31, 2005
6900119 Agglomeration control using early transition metal alloys May. 31, 2005

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