Resources Contact Us Home
Browse by Category: Main > Physics
Class Information
Number: 257/E21.585
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo) > Interconnections, comprising conductors and dielectrics, for carrying current between separate components within device (epo) > Characterized by formation and post treatment of dielectrics, e.g., planarizing (epo) > Filling of holes, grooves, vias or trenches with conductive material (epo)
Description: This subclass is indented under subclass E21.582. This subclass is substantially the same in scope as ECLA classification H01L21/768C4.

Sub-classes under this class:

Class Number Class Name Patents
257/E21.587 By deposition over sacrificial masking layer, e.g., lift-off (epo) 162
257/E21.586 By selective deposition of conductive material in vias, e.g., selective chemical vapor deposition on semiconductor material, plating (epo) 641
257/E21.588 Reflowing or applying pressure to fill contact hole, e.g., to remove voids (epo) 236

Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Next

Patent Number Title Of Patent Date Issued
7060609 Method of manufacturing a semiconductor device Jun. 13, 2006
7060617 Method of protecting a seed layer for electroplating Jun. 13, 2006
7060619 Reduction of the shear stress in copper via's in organic interlayer dielectric material Jun. 13, 2006
7051934 Methods of forming metal layers in integrated circuit devices using selective deposition on edges of recesses May. 30, 2006
7053002 Plasma preclean with argon, helium, and hydrogen gases May. 30, 2006
7053487 Semiconductor device May. 30, 2006
7049223 Paste including a mixture of powders, connection plug, burying method, and semiconductor device manufacturing method May. 23, 2006
7049230 Method of forming a contact plug in a semiconductor device May. 23, 2006
7049702 Damascene structure at semiconductor substrate level May. 23, 2006
7045071 Method for fabricating ferroelectric random access memory device May. 16, 2006
7047154 Interconnection pattern inspection method, manufacturing method of semiconductor device and inspection apparatus May. 16, 2006
7041201 Sidewall magnet improving uniformity of inductively coupled plasma and shields used therewith May. 9, 2006
7041585 Process for producing an integrated electronic component May. 9, 2006
7041592 Method for forming a metal interconnection layer of a semiconductor device using a modified dual damascene process May. 9, 2006
7037835 Interconnections having double capping layer and method for forming the same May. 2, 2006
7033463 Substrate plating method and apparatus Apr. 25, 2006
7033928 Method of fabricating semiconductor device Apr. 25, 2006
7034398 Semiconductor device having contact plug and buried conductive film therein Apr. 25, 2006
7030011 Method for avoiding short-circuit of conductive wires Apr. 18, 2006
7030044 Method of forming a cap layer having anti-reflective characteristics on top of a low-k dielectric Apr. 18, 2006
7030168 Supercritical fluid-assisted deposition of materials on semiconductor substrates Apr. 18, 2006
7026236 Method of forming multilayer interconnection structure, method of manufacturing circuit board, and method of manufacturing device Apr. 11, 2006
7026238 Reliability barrier integration for Cu application Apr. 11, 2006
7026242 Method for filling a hole with a metal Apr. 11, 2006
7022598 Method of producing multilayer interconnection structure Apr. 4, 2006
7015533 Capacitor constructions, semiconductor constructions, and methods of forming electrical contacts and semiconductor constructions Mar. 21, 2006
7008871 Selective capping of copper wiring Mar. 7, 2006
7001471 Method and apparatus for low-temperature annealing of metallization microstructures in the production of a microelectronic device Feb. 21, 2006
7001492 Systems for electroplating metal onto a layer of low conductivity material Feb. 21, 2006
7001841 Production method of semiconductor device Feb. 21, 2006
6998345 Methods of forming via plugs using an aerosol stream of particles to deposit conductive material Feb. 14, 2006
6994776 Method and apparatus for low temperature annealing of metallization micro-structure in the production of a microelectronic device Feb. 7, 2006
6995457 Wiring structure and manufacturing method therefor, semiconductor device including wiring structure and wiring board Feb. 7, 2006
6991981 Processing methods of forming an electrically conductive plug to a node location Jan. 31, 2006
6992012 Method and apparatus for forming improved metal interconnects Jan. 31, 2006
6992018 Chemical fluid deposition for the formation of metal and metal alloy films on patterned and unpatterned substrates Jan. 31, 2006
6989328 Method of manufacturing semiconductor device having damascene interconnection Jan. 24, 2006
6989601 Copper damascene with low-k capping layer and improved electromigration reliability Jan. 24, 2006
6984568 Semiconductor memory device having multi-layered storage node contact plug and method for fabricating the same Jan. 10, 2006
6984891 Methods for making copper and other metal interconnections in integrated circuits Jan. 10, 2006
6979370 Methods, complexes, and system for forming metal-containing films Dec. 27, 2005
6979611 Method for fabricating semiconductor device Dec. 27, 2005
6979642 Method of self-annealing conductive lines that separates grain size effects from alloy mobility Dec. 27, 2005
6979643 Interlayer connections for layered electronic devices Dec. 27, 2005
6977035 Method for electrolytic copper plating Dec. 20, 2005
6977220 Copper alloys for interconnections having improved electromigration characteristics and methods of making same Dec. 20, 2005
6969301 Filling plugs through chemical mechanical polish Nov. 29, 2005
6964874 Void formation monitoring in a damascene process Nov. 15, 2005
6964922 Methods for forming metal interconnections for semiconductor devices having multiple metal depositions Nov. 15, 2005
6960832 Semiconductor device and its production process Nov. 1, 2005

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Next

  Recently Added Patents
Graphical user interfaces and occlusion prevention for fisheye lenses with line segment foci
Method of allocating IP address of image forming apparatus using DHCP, image forming apparatus and system of allocating IP address using DHCP
Redistribution layer (RDL) with variable offset bumps
Encoding method and encoding device, decoding method and decoding device and transcoding method and transcoder for multi-object audio signals
Decentralized processing network
Computer server capable of supporting CPU virtualization
Method and system for determining an optimal missile intercept approach direction for correct remote sensor-to-seeker handover
  Randomly Featured Patents
Ballistic impact sensing and display system
Thin, Planar shaped carrier with wiegand wires
Shaving kit with replacement indicator
Mosquito misting system
Method of improving the spent nuclear fuel burnup credit
Non-aqueous electrolyte secondary cell, negative electrode therefor, and method of producing negative electrode
Method and device for picking up stacks of blanks
Drive system for liquid crystal display device
Intermediates and methods of preparation of intermediates in the enantiomeric synthesis of (20R)homocamptothecins and the enantiomeric synthesis of (20R)homocamptothecins
Macro-cell flip-flop with scan-in input