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Class Information
Number: 257/E21.584
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo) > Interconnections, comprising conductors and dielectrics, for carrying current between separate components within device (epo) > Characterized by formation and post treatment of dielectrics, e.g., planarizing (epo) > Barrier, adhesion or liner layer (epo)
Description: This subclass is indented under subclass E21.582. This subclass is substantially the same in scope as ECLA classification H01L21/768C3.










Patents under this class:

Patent Number Title Of Patent Date Issued
8710673 Wiring structure in a semiconductor device, method of forming the wiring structure, semiconductor device including the wiring structure and method of manufacturing the semiconductor device Apr. 29, 2014
8710660 Hybrid interconnect scheme including aluminum metal line in low-k dielectric Apr. 29, 2014
8685854 Method of forming a via in a semiconductor device Apr. 1, 2014
8685851 MOS device with memory function and manufacturing method thereof Apr. 1, 2014
8680682 Barrier for through-silicon via Mar. 25, 2014
8680599 Semiconductor device and method of manufacturing the same Mar. 25, 2014
8673773 Method for producing a nanoporous layer Mar. 18, 2014
8669177 Semiconductor device and method for manufacturing semiconductor device Mar. 11, 2014
8669176 BEOL integration scheme for copper CMP to prevent dendrite formation Mar. 11, 2014
8664115 Copper interconnect with metal hardmask removal Mar. 4, 2014
8658533 Semiconductor interconnect structure with multi-layered seed layer providing enhanced reliability and minimizing electromigration Feb. 25, 2014
8652966 Semiconductor device manufacturing method and semiconductor device Feb. 18, 2014
8652950 C-rich carbon boron nitride dielectric films for use in electronic devices Feb. 18, 2014
8648465 Semiconductor interconnect structure having enhanced performance and reliability Feb. 11, 2014
8633101 Semiconductor device and manufacturing method of semiconductor device Jan. 21, 2014
8623759 Method for manufacturing semiconductor device Jan. 7, 2014
8618661 Die having coefficient of thermal expansion graded layer Dec. 31, 2013
8617984 Tungsten metallization: structure and fabrication of same Dec. 31, 2013
8592306 Redundant metal barrier structure for interconnect applications Nov. 26, 2013
8586485 Molecular self-assembly in substrate processing Nov. 19, 2013
8586473 Methods for fabricating integrated circuits with ruthenium-lined copper Nov. 19, 2013
8586133 Method for strengthening adhesion between dielectric layers formed adjacent to metal layers Nov. 19, 2013
8575027 Sputtering and aligning multiple layers having different boundaries Nov. 5, 2013
8569888 Wiring structure and method of forming the structure Oct. 29, 2013
8569165 Self-aligned barrier and capping layers for interconnects Oct. 29, 2013
8564133 Chip package and method for forming the same Oct. 22, 2013
8564132 Tungsten metallization: structure and fabrication of same Oct. 22, 2013
8563428 Methods for depositing metal in high aspect ratio features Oct. 22, 2013
8558381 Semiconductor device Oct. 15, 2013
8552559 Very thick metal interconnection scheme in IC chips Oct. 8, 2013
8551879 Semiconductor device and method for manufacturing semiconductor device Oct. 8, 2013
8541303 Method for fabricating MOS transistor Sep. 24, 2013
8536706 Method for fabricating semiconductor device and semiconductor device Sep. 17, 2013
8536704 Semiconductor device and method for fabricating the same Sep. 17, 2013
8536058 Method of growing electrical conductors Sep. 17, 2013
8524512 Method for repairing copper diffusion barrier layers on a semiconductor solid substrate and repair kit for implementing this method Sep. 3, 2013
8518818 Reverse damascene process Aug. 27, 2013
8502381 Barrier layer configurations and methods for processing microelectronic topographies having barrier layers Aug. 6, 2013
8492265 Pad bonding employing a self-aligned plated liner for adhesion enhancement Jul. 23, 2013
8487386 Method for forming MEMS devices having low contact resistance and devices obtained thereof Jul. 16, 2013
8486832 Method for fabricating semiconductor device Jul. 16, 2013
8481425 Method for fabricating through-silicon via structure Jul. 9, 2013
8476743 C-rich carbon boron nitride dielectric films for use in electronic devices Jul. 2, 2013
8476162 Methods of forming layers on substrates Jul. 2, 2013
8466052 Method of fabricating semiconductor device having buried wiring Jun. 18, 2013
8461684 Cobalt nitride layers for copper interconnects and methods for forming them Jun. 11, 2013
8456017 Filled through-silicon via with conductive composite material Jun. 4, 2013
8450206 Method of forming a semiconductor device including a stress buffer material formed above a low-k metallization system May. 28, 2013
8450205 Redundancy design with electro-migration immunity and method of manufacture May. 28, 2013
8445378 Method of manufacturing a CMOS device including molecular storage elements in a via level May. 21, 2013











 
 
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