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Class Information
Number: 257/E21.583
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo) > Interconnections, comprising conductors and dielectrics, for carrying current between separate components within device (epo) > Characterized by formation and post treatment of dielectrics, e.g., planarizing (epo) > Planarization; smoothing (epo)
Description: This subclass is indented under subclass E21.582. This subclass is substantially the same in scope as ECLA classification H01L21/768C2.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6790763 |
Substrate processing method |
Sep. 14, 2004 |
| 6786996 |
Apparatus and method for edge bead removal |
Sep. 7, 2004 |
| 6787480 |
Manufacturing method of semicondcutor device |
Sep. 7, 2004 |
| 6787472 |
Utilization of disappearing silicon hard mask for fabrication of semiconductor structures |
Sep. 7, 2004 |
| 6787470 |
Sacrificial feature for corrosion prevention during CMP |
Sep. 7, 2004 |
| 6787467 |
Method of forming embedded copper interconnections and embedded copper interconnection structure |
Sep. 7, 2004 |
| 6784093 |
Copper surface passivation during semiconductor manufacturing |
Aug. 31, 2004 |
| 6780772 |
Method and system to provide electroplanarization of a workpiece with a conducting material layer |
Aug. 24, 2004 |
| 6780760 |
Methods for manufacturing semiconductor devices |
Aug. 24, 2004 |
| 6780757 |
Semiconductor integrated circuit device and method for making the same |
Aug. 24, 2004 |
| 6777332 |
Method for forming wiring structure |
Aug. 17, 2004 |
| 6777339 |
Method for planarizing deposited film |
Aug. 17, 2004 |
| 6777807 |
Interconnect integration |
Aug. 17, 2004 |
| 6777812 |
Semiconductor devices having protected plug contacts and upper interconnections |
Aug. 17, 2004 |
| 6774053 |
Method and structure for low-k dielectric constant applications |
Aug. 10, 2004 |
| 6772620 |
Method of generating calibration data for relative height measurement |
Aug. 10, 2004 |
| 6773570 |
Integrated plating and planarization process and apparatus therefor |
Aug. 10, 2004 |
| 6770565 |
System for planarizing metal conductive layers |
Aug. 3, 2004 |
| 6770554 |
On-chip interconnect circuits with use of large-sized copper fill in CMP process |
Aug. 3, 2004 |
| 6767782 |
Manufacturing method of semiconductor device |
Jul. 27, 2004 |
| 6767826 |
Method of manufacturing semiconductor device |
Jul. 27, 2004 |
| 6759322 |
Method for forming wiring structure |
Jul. 6, 2004 |
| 6759330 |
Method of providing a structure using self-aligned features |
Jul. 6, 2004 |
| 6759748 |
Wiring structure of semiconductor device |
Jul. 6, 2004 |
| 6756307 |
Apparatus for electrically planarizing semiconductor wafers |
Jun. 29, 2004 |
| 6756624 |
Encapsulated metal structures for semiconductor devices and MIM capacitors including the same |
Jun. 29, 2004 |
| 6756309 |
Feed forward process control method for adjusting metal line Rs |
Jun. 29, 2004 |
| 6756679 |
Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit device |
Jun. 29, 2004 |
| 6753249 |
Multilayer interface in copper CMP for low K dielectric |
Jun. 22, 2004 |
| 6749486 |
Chemical-mechanical polishing device, damascene wiring forming device, and damascene wiring forming method |
Jun. 15, 2004 |
| 6750144 |
Method for electrochemical metallization and planarization of semiconductor substrates having features of different sizes |
Jun. 15, 2004 |
| 6746958 |
Method of controlling the duration of an endpoint polishing process in a multistage polishing process |
Jun. 8, 2004 |
| 6746962 |
Method for fabricating a semi-conductor device having a tungsten film-filled via hole |
Jun. 8, 2004 |
| 6746951 |
Bond pad of semiconductor device and method of fabricating the same |
Jun. 8, 2004 |
| 6746589 |
Plating method and plating apparatus |
Jun. 8, 2004 |
| 6743723 |
Method for fabricating semiconductor device |
Jun. 1, 2004 |
| 6743641 |
Method of improving surface planarity prior to MRAM bit material deposition |
Jun. 1, 2004 |
| 6743268 |
Chemical-mechanical planarization of barriers or liners for copper metallurgy |
Jun. 1, 2004 |
| 6740591 |
Slurry and method for chemical mechanical polishing of copper |
May. 25, 2004 |
| 6740590 |
AQUEOUS DISPERSION, AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING USED FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, AND METHOD FOR FORMATIO |
May. 25, 2004 |
| 6740588 |
Smooth metal semiconductor surface and method for making the same |
May. 25, 2004 |
| 6737348 |
Method for forming buried interconnect |
May. 18, 2004 |
| 6734103 |
Method of polishing a semiconductor device |
May. 11, 2004 |
| 6734104 |
Method of manufacturing a semiconductor device and a semiconductor device |
May. 11, 2004 |
| 6730931 |
Integrated circuit feature layout for improved chemical mechanical polishing |
May. 4, 2004 |
| 6730594 |
Method for manufacturing semiconductor device |
May. 4, 2004 |
| 6727172 |
Process to reduce chemical mechanical polishing damage of narrow copper lines |
Apr. 27, 2004 |
| 6727589 |
Dual damascene flowable oxide insulation structure and metallic barrier |
Apr. 27, 2004 |
| 6722942 |
Chemical mechanical polishing with electrochemical control |
Apr. 20, 2004 |
| 6722950 |
Method and apparatus for electrodialytic chemical mechanical polishing and deposition |
Apr. 20, 2004 |
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