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Class Information
Number: 257/E21.583
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo) > Interconnections, comprising conductors and dielectrics, for carrying current between separate components within device (epo) > Characterized by formation and post treatment of dielectrics, e.g., planarizing (epo) > Planarization; smoothing (epo)
Description: This subclass is indented under subclass E21.582. This subclass is substantially the same in scope as ECLA classification H01L21/768C2.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7582565 |
Method and apparatus for semiconductor wafer planarization |
Sep. 1, 2009 |
| 7566653 |
Interconnect structure with grain growth promotion layer and method for forming the same |
Jul. 28, 2009 |
| 7560380 |
Chemical dissolution of barrier and adhesion layers |
Jul. 14, 2009 |
| 7557025 |
Method of etching a dielectric layer to form a contact hole and a via hole and damascene method |
Jul. 7, 2009 |
| 7550748 |
Apparatus and methods for systematic non-uniformity correction using a gas cluster ion beam |
Jun. 23, 2009 |
| 7541279 |
Method for manufacturing semiconductor device |
Jun. 2, 2009 |
| 7541625 |
Semiconductor integrated circuit |
Jun. 2, 2009 |
| 7510972 |
Method of processing substrate, post-chemical mechanical polishing cleaning method, and method of and program for manufacturing electronic device |
Mar. 31, 2009 |
| 7507657 |
Method for fabricating storage node contact in semiconductor device |
Mar. 24, 2009 |
| 7452816 |
Semiconductor processing method and chemical mechanical polishing methods |
Nov. 18, 2008 |
| 7453152 |
Device having reduced chemical mechanical planarization |
Nov. 18, 2008 |
| 7446415 |
Method for filling electrically different features |
Nov. 4, 2008 |
| 7439125 |
Contact structure for a stack DRAM storage capacitor |
Oct. 21, 2008 |
| 7427561 |
Method for manufacturing semiconductor device |
Sep. 23, 2008 |
| 7422982 |
Method and apparatus for electroprocessing a substrate with edge profile control |
Sep. 9, 2008 |
| 7417321 |
Via structure and process for forming the same |
Aug. 26, 2008 |
| 7381638 |
Fabrication technique using sputter etch and vacuum transfer |
Jun. 3, 2008 |
| 7348676 |
Semiconductor device having a metal wiring structure |
Mar. 25, 2008 |
| 7300877 |
Method of manufacturing a semiconductor device |
Nov. 27, 2007 |
| 7211512 |
Selective electroless-plated copper metallization |
May. 1, 2007 |
| 7208831 |
Semiconductor device having multilayer wiring structure and method, wherein connecting portion and wiring layer are formed of same layer |
Apr. 24, 2007 |
| 7205208 |
Method of manufacturing a semiconductor device |
Apr. 17, 2007 |
| 7195700 |
Method of electroplating copper layers with flat topography |
Mar. 27, 2007 |
| 7186574 |
CMP process metrology test structures |
Mar. 6, 2007 |
| 7163894 |
Semiconductor device having a wiring layer of damascene structure and method for manufacturing the same |
Jan. 16, 2007 |
| 7138340 |
Method for fabricating semiconductor device without damaging hard mask during contact formation process |
Nov. 21, 2006 |
| 7105925 |
Differential planarization |
Sep. 12, 2006 |
| 7071108 |
Chemical mechanical polishing slurry containing abrasive particles exhibiting photocatalytic function |
Jul. 4, 2006 |
| 7071539 |
Chemical planarization performance for copper/low-k interconnect structures |
Jul. 4, 2006 |
| 7067920 |
Semiconductor device and method of fabricating the same |
Jun. 27, 2006 |
| 7067919 |
Semiconductor device |
Jun. 27, 2006 |
| 7064057 |
Method and apparatus for localized material removal by electrochemical polishing |
Jun. 20, 2006 |
| 7064053 |
Process for fabricating an electrical circuit comprising a polishing step |
Jun. 20, 2006 |
| 7064068 |
Method to improve planarity of electroplated copper |
Jun. 20, 2006 |
| 7060606 |
Method and apparatus for chemical mechanical polishing of semiconductor substrates |
Jun. 13, 2006 |
| 7060619 |
Reduction of the shear stress in copper via's in organic interlayer dielectric material |
Jun. 13, 2006 |
| RE39126 |
Two-step chemical mechanical polishing process for producing flush and protruding tungsten plugs |
Jun. 13, 2006 |
| 7060618 |
Semiconductor device, method for manufacturing the same, and plating solution |
Jun. 13, 2006 |
| 7056826 |
Method of forming copper interconnects |
Jun. 6, 2006 |
| 7053462 |
Planarization of metal container structures |
May. 30, 2006 |
| 7049237 |
Methods for planarization of Group VIII metal-containing surfaces using oxidizing gases |
May. 23, 2006 |
| 7045454 |
Chemical mechanical planarization of conductive material |
May. 16, 2006 |
| 7045898 |
Semiconductor device and manufacturing method thereof |
May. 16, 2006 |
| 7045450 |
Method of manufacturing semiconductor device |
May. 16, 2006 |
| 7041586 |
Semiconductor device having a multilayer interconnection structure |
May. 9, 2006 |
| 7042099 |
Semiconductor device containing a dummy wire |
May. 9, 2006 |
| 7029591 |
Planarization with reduced dishing |
Apr. 18, 2006 |
| 7030044 |
Method of forming a cap layer having anti-reflective characteristics on top of a low-k dielectric |
Apr. 18, 2006 |
| 7022598 |
Method of producing multilayer interconnection structure |
Apr. 4, 2006 |
| 7018924 |
CMP slurry compositions for oxide films and methods for forming metal line contact plugs using the same |
Mar. 28, 2006 |
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