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Class Information
Number: 257/E21.582
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo) > Interconnections, comprising conductors and dielectrics, for carrying current between separate components within device (epo) > Characterized by formation and post treatment of dielectrics, e.g., planarizing (epo) > Characterized by formation and post treatment of conductors, e.g., patterning (epo)
Description: This subclass is indented under subclass E21.575. This subclass is substantially the same in scope as ECLA classification H01L21/768C.

Patents under this class:

Patent Number Title Of Patent Date Issued
8691689 Methods for fabricating integrated circuits having low resistance device contacts Apr. 8, 2014
8669181 Diffusion barrier and etch stop films Mar. 11, 2014
8629508 Semiconductor device and method of manufacture Jan. 14, 2014
8614146 Semiconductor device manufacture method and semiconductor device Dec. 24, 2013
8614107 Liner-free tungsten contact Dec. 24, 2013
8614106 Liner-free tungsten contact Dec. 24, 2013
8609531 Methods of selectively forming ruthenium liner layer Dec. 17, 2013
8586478 Method of making a semiconductor device Nov. 19, 2013
8586471 Seed layers for metallic interconnects and products Nov. 19, 2013
8575761 Segmented supply rail configuration for a digital integrated circuit Nov. 5, 2013
8551878 Metal interconnection method of semiconductor device Oct. 8, 2013
8546196 Non-volatile memory device and manufacturing method thereof Oct. 1, 2013
8541257 Aligned polymers for an organic TFT Sep. 24, 2013
8535966 Horizontal coplanar switches and methods of manufacture Sep. 17, 2013
8518816 Method for making electrical interconnections with carbon nanotubes Aug. 27, 2013
8492278 Method of forming a plurality of spaced features Jul. 23, 2013
8456011 Method to control metal semiconductor micro-structure Jun. 4, 2013
8445335 Method of forming pixel structure May. 21, 2013
8431486 Interconnect structure for improved time dependent dielectric breakdown Apr. 30, 2013
8431482 Integrated circuits and methods for processing integrated circuits with embedded features Apr. 30, 2013
8420529 Copper wiring surface protective liquid and method for manufacturing semiconductor circuit Apr. 16, 2013
8399894 Semiconductor light emitting device Mar. 19, 2013
8389406 Method of manufacturing semiconductor device Mar. 5, 2013
8367547 Method for creating a metal crystalline region, in particular in an integrated circuit Feb. 5, 2013
8354334 Power semiconductor chip with a formed patterned thick metallization atop Jan. 15, 2013
8349719 Semiconductor device and method for fabricating the same Jan. 8, 2013
8338291 Producing transistor including multiple reentrant profiles Dec. 25, 2012
8288273 Method for forming a patterned thick metallization atop a power semiconductor chip Oct. 16, 2012
8283247 Semiconductor device including a die region designed for aluminum-free solder bump connection and a test structure designed for aluminum-free wire bonding Oct. 9, 2012
8258628 System and method for integrated circuit arrangement having a plurality of conductive structure levels Sep. 4, 2012
8242000 Method for making nanowire element Aug. 14, 2012
8216938 Method for forming semiconductor device Jul. 10, 2012
8187927 Liquid crystal display and fabrication method thereof May. 29, 2012
8158505 Method for manufacturing a semiconductor device, semiconductor chip and semiconductor wafer Apr. 17, 2012
8110497 Method for manufacturing semiconductor device Feb. 7, 2012
8102005 Wiring substrate, semiconductor device and manufacturing method thereof Jan. 24, 2012
8101519 Mold, manufacturing method of mold, method for forming patterns using mold, and display substrate and display device manufactured by using method for forming patterns Jan. 24, 2012
8097491 Chip structure having redistribution layer and fabrication method thereof Jan. 17, 2012
8076778 Method for preventing Al-Cu bottom damage using TiN liner Dec. 13, 2011
8072070 Low fabrication cost, fine pitch and high reliability solder bump Dec. 6, 2011
8071468 Semiconductor device and method of manufacturing semiconductor device Dec. 6, 2011
8053357 Prevention of post CMP defects in CU/FSG process Nov. 8, 2011
8043959 Method of forming a low-k dielectric layer with improved damage resistance and chemical integrity Oct. 25, 2011
8039379 Nanoparticle cap layer Oct. 18, 2011
8017956 Semiconductor light emitting device Sep. 13, 2011
8013385 Semiconductor device Sep. 6, 2011
8003527 Manufacturing method of semiconductor device Aug. 23, 2011
7989351 Method for manufacturing a wiring over a substrate Aug. 2, 2011
7981792 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument Jul. 19, 2011
7955872 Manufacturing method of semiconductor integrated circuit device using magnetic memory Jun. 7, 2011

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