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Class Information
Number: 257/E21.581
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo) > Interconnections, comprising conductors and dielectrics, for carrying current between separate components within device (epo) > Characterized by formation and post treatment of dielectrics, e.g., planarizing (epo) > Dielectric comprising air gaps (epo)
Description: This subclass is indented under subclass E21.576. This subclass is substantially the same in scope as ECLA classification H01L21/768B6.

Patents under this class:
1 2 3 4 5 6 7 8 9 10 11

Patent Number Title Of Patent Date Issued
8674473 Semiconductor cell and method for forming the same Mar. 18, 2014
8659115 Airgap-containing interconnect structure with improved patternable low-K material and method of fabricating Feb. 25, 2014
8629561 Air gap-containing interconnect structure having photo-patternable low k material Jan. 14, 2014
8609507 Semiconductor device and method of manufacturing the same Dec. 17, 2013
8518794 Semiconductor devices and methods of forming thereof Aug. 27, 2013
8492904 Semiconductor device and manufacturing method of the same Jul. 23, 2013
8476118 Semiconductor device and fabrication mehtod of the semiconductor device Jul. 2, 2013
8440538 Method of manufacturing airbridge May. 14, 2013
8436410 Semiconductor devices comprising a plurality of gate structures May. 7, 2013
8420528 Manufacturing method of a semiconductor device having wirings Apr. 16, 2013
8399350 Formation of air gap with protection of metal lines Mar. 19, 2013
8399349 Materials and methods of forming controlled void Mar. 19, 2013
8377731 Micro electro-mechanical sensor (MEMS) fabricated with ribbon wire bonds Feb. 19, 2013
8362542 Semiconductor devices comprising a plurality of gate structures Jan. 29, 2013
8343880 Process for preparing a dielectric interlayer film containing silicon beta zeolite Jan. 1, 2013
8324093 Methods for fabricating semiconductor devices including azeotropic drying processes Dec. 4, 2012
8310053 Method of manufacturing a device with a cavity Nov. 13, 2012
8247902 Semiconductor device and manufacturing method of the same Aug. 21, 2012
8241989 Integrated circuit with stacked devices Aug. 14, 2012
8241990 Air gap fabricating method Aug. 14, 2012
8241991 Method for forming interconnect structure having airgap Aug. 14, 2012
8242014 Method for manufacturing a semiconductor device having an interconnect structure and a reinforcing insulating film Aug. 14, 2012
8232653 Wiring structures Jul. 31, 2012
8168742 Crosslinkable fluorinated aromatic prepolymer and its uses May. 1, 2012
8153503 Protection of cavities opening onto a face of a microstructured element Apr. 10, 2012
8148235 Methods of manufacturing semiconductor devices Apr. 3, 2012
8148789 Non-volatile semiconductor storage device and method of manufacturing the same Apr. 3, 2012
8110498 Method for passivating exposed copper surfaces in a metallization layer of a semiconductor device Feb. 7, 2012
8097932 Ultra low .kappa. plasma enhanced chemical vapor deposition processes using a single bifunctional precursor containing both a SiCOH matrix functionality and organic porogen functionality Jan. 17, 2012
8097949 Control of localized air gap formation in an interconnect stack Jan. 17, 2012
8084355 Methods of forming copper-comprising conductive lines in the fabrication of integrated circuitry Dec. 27, 2011
8084352 Method of manufacturing semiconductor device Dec. 27, 2011
8048760 Semiconductor structure and method of manufacture Nov. 1, 2011
8026165 Process for producing air gaps in microstructures, especially of the air gap interconnect structure type for integrated circuits Sep. 27, 2011
8022485 Transistor structure having reduced input capacitance Sep. 20, 2011
8022501 Semiconductor device and method for isolating the same Sep. 20, 2011
7998855 Solving via-misalignment issues in interconnect structures having air-gaps Aug. 16, 2011
7998880 Low k dielectric CVD film formation process with in-situ imbedded nanolayers to improve mechanical properties Aug. 16, 2011
7994069 Semiconductor wafer with low-K dielectric layer and process for fabrication thereof Aug. 9, 2011
7977239 Semiconductor device and method for fabricating the same Jul. 12, 2011
7960275 Method for manufacturing an interconnection structure with cavities for an integrated circuit Jun. 14, 2011
7956466 Structure for interconnect structure containing various capping materials for electrical fuse and other related applications Jun. 7, 2011
7952146 Grain growth promotion layer for semiconductor interconnect structures May. 31, 2011
7943518 Semiconductor chip, semiconductor mounting module, mobile communication device, and process for producing semiconductor chip May. 17, 2011
7923820 Method of producing a porous dielectric element and corresponding dielectric element Apr. 12, 2011
7879683 Methods and apparatus of creating airgap in dielectric layers for the reduction of RC delay Feb. 1, 2011
7875548 Method for making semiconductor structures implementing sacrificial material Jan. 25, 2011
7871922 Methods for forming interconnect structures that include forming air gaps between conductive structures Jan. 18, 2011
7872318 Sensing devices and methods for forming the same Jan. 18, 2011
7867870 Semiconductor device and method for forming device isolation film of semiconductor device Jan. 11, 2011

1 2 3 4 5 6 7 8 9 10 11

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