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Class Information
Number: 257/E21.58
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo) > Interconnections, comprising conductors and dielectrics, for carrying current between separate components within device (epo) > Characterized by formation and post treatment of dielectrics, e.g., planarizing (epo) > Planarizing dielectric (epo)
Description: This subclass is indented under subclass E21.576. This subclass is substantially the same in scope as ECLA classification H01L21/768B4.

Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12

Patent Number Title Of Patent Date Issued
8653664 Barrier layers for copper interconnect Feb. 18, 2014
8518818 Reverse damascene process Aug. 27, 2013
8501576 Dummy structures and methods Aug. 6, 2013
8481399 Method of manufacturing semiconductor device including capacitor element provided above wiring layer that includes wiring with an upper surface having protruding portion Jul. 9, 2013
8293644 Methods of manufacturing a semiconductor memory device Oct. 23, 2012
8129268 Self-aligned lower bottom electrode Mar. 6, 2012
8124527 CMP process flow for MEMS Feb. 28, 2012
8114741 Oxygen-rich layers underlying BPSG Feb. 14, 2012
8072070 Low fabrication cost, fine pitch and high reliability solder bump Dec. 6, 2011
8071468 Semiconductor device and method of manufacturing semiconductor device Dec. 6, 2011
8043959 Method of forming a low-k dielectric layer with improved damage resistance and chemical integrity Oct. 25, 2011
8008187 Method for reducing dielectric overetch using a dielectric etch stop at a planar surface Aug. 30, 2011
8003516 BEOL interconnect structures and related fabrication methods Aug. 23, 2011
7985685 Method of manufacturing semiconductor device Jul. 26, 2011
7981790 Semiconductor device and method of fabricating the same Jul. 19, 2011
7964900 Semiconductor device with semi-insulating substrate portions Jun. 21, 2011
7956466 Structure for interconnect structure containing various capping materials for electrical fuse and other related applications Jun. 7, 2011
7867870 Semiconductor device and method for forming device isolation film of semiconductor device Jan. 11, 2011
7790607 Method for reducing dielectric overetch using a dielectric etch stop at a planar surface Sep. 7, 2010
7781281 Method of fabricating self-aligned contact pad using chemical mechanical polishing process Aug. 24, 2010
7749894 Integrated circuit processing system Jul. 6, 2010
7670924 Air gap integration scheme Mar. 2, 2010
7670961 Reduction of cracking in low-k spin-on dielectric films Mar. 2, 2010
7651942 Metal interconnect structure and method Jan. 26, 2010
7642197 Method to improve performance of secondary active components in an esige CMOS technology Jan. 5, 2010
7633131 MEMS semiconductor sensor device Dec. 15, 2009
7632730 CMOS image sensor and method for manufacturing the same Dec. 15, 2009
7626267 Semiconductor integrated circuit device including wiring lines and interconnections Dec. 1, 2009
7622358 Semiconductor device with semi-insulating substrate portions and method for forming the same Nov. 24, 2009
7622385 Wiring pattern forming method, film pattern forming method, semiconductor device, electro-optical device, and electronic equipment Nov. 24, 2009
7595217 Method of manufacturing a CMOS image sensor Sep. 29, 2009
7589013 Electrode structure and method of manufacturing the same, phase-change memory device having the electrode structure and method of manufacturing the same Sep. 15, 2009
7545016 Integrated layer stack arrangement, optical sensor and method for producing an integrated layer stack arrangement Jun. 9, 2009
7510972 Method of processing substrate, post-chemical mechanical polishing cleaning method, and method of and program for manufacturing electronic device Mar. 31, 2009
7494882 Manufacturing a semiconductive device using a controlled atomic layer removal process Feb. 24, 2009
7419909 Methods of forming a semiconductor device that allow patterns in different regions that have different pitches to be connected Sep. 2, 2008
7338905 Semiconductor device manufacture method Mar. 4, 2008
7163881 Method for forming CMOS structure with void-free dielectric film Jan. 16, 2007
7151023 Metal gate MOSFET by full semiconductor metal alloy conversion Dec. 19, 2006
7105452 Method of planarizing a semiconductor substrate with an etching chemistry Sep. 12, 2006
7105925 Differential planarization Sep. 12, 2006
7064053 Process for fabricating an electrical circuit comprising a polishing step Jun. 20, 2006
RE39126 Two-step chemical mechanical polishing process for producing flush and protruding tungsten plugs Jun. 13, 2006
7061056 High f.sub.MAX deep submicron MOSFET Jun. 13, 2006
7052997 Method to form etch and/or CMP stop layers May. 30, 2006
7026717 Fill pattern generation for spin-on glass and related self-planarization deposition Apr. 11, 2006
7022599 Method of manufacturing semiconductor devices Apr. 4, 2006
7015567 Method for fabricating a semiconductor structure using a protective layer, and semiconductor structure Mar. 21, 2006
7012021 Method for end point detection polysilicon chemical mechanical polishing in an anti-fuse memory device Mar. 14, 2006
6998716 Diamond metal-filled patterns achieving low parasitic coupling capacitance Feb. 14, 2006

1 2 3 4 5 6 7 8 9 10 11 12

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