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Class Information
Number: 257/E21.579
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo) > Interconnections, comprising conductors and dielectrics, for carrying current between separate components within device (epo) > Characterized by formation and post treatment of dielectrics, e.g., planarizing (epo) > By forming via holes (epo) > For "dual damascene" type structures (epo)
Description: This subclass is indented under subclass E21.577. This subclass is substantially the same in scope as ECLA classification H01L21/768B2D.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6977229 |
Manufacturing method for semiconductor devices |
Dec. 20, 2005 |
| 6977438 |
Dual damascene circuit with upper wiring and interconnect line positioned in regions formed as two layers including organic polymer layer and low-permittivity layer |
Dec. 20, 2005 |
| 6974762 |
Adhesion of carbon doped oxides by silanization |
Dec. 13, 2005 |
| 6974766 |
In situ deposition of a low .kappa. dielectric layer, barrier layer, etch stop, and anti-reflective coating for damascene application |
Dec. 13, 2005 |
| 6975033 |
Semiconductor device and method for manufacturing the same |
Dec. 13, 2005 |
| RE38914 |
Dual damascene patterned conductor layer formation method without etch stop layer |
Dec. 6, 2005 |
| 6972251 |
Method for fabricating copper damascene structures in porous dielectric materials |
Dec. 6, 2005 |
| 6972253 |
Method for forming dielectric barrier layer in damascene structure |
Dec. 6, 2005 |
| 6972254 |
Manufacturing a conformal atomic liner layer in an integrated circuit interconnect |
Dec. 6, 2005 |
| 6972258 |
Method for selectively controlling damascene CD bias |
Dec. 6, 2005 |
| 6972259 |
Method for forming openings in low dielectric constant material layer |
Dec. 6, 2005 |
| 6969683 |
Method of preventing resist poisoning in dual damascene structures |
Nov. 29, 2005 |
| 6967156 |
Method to fabricate aligned dual damascene openings |
Nov. 22, 2005 |
| 6967165 |
Method for fabricating multilayer interconnect and method for checking the same |
Nov. 22, 2005 |
| 6967407 |
Semiconductor device and method of manufacturing the semiconductor device |
Nov. 22, 2005 |
| 6964874 |
Void formation monitoring in a damascene process |
Nov. 15, 2005 |
| 6964919 |
Low-k dielectric film with good mechanical strength |
Nov. 15, 2005 |
| 6965165 |
Top layers of metal for high performance IC's |
Nov. 15, 2005 |
| 6962727 |
Organosiloxanes |
Nov. 8, 2005 |
| 6962870 |
Method of manufacturing semiconductor device and semiconductor device |
Nov. 8, 2005 |
| 6962874 |
Method for fabricating semiconductor device |
Nov. 8, 2005 |
| 6962879 |
Method of plasma etching silicon nitride |
Nov. 8, 2005 |
| 6958294 |
Method for photoresist strip, sidewall polymer removal and passivation for aluminum metallization |
Oct. 25, 2005 |
| 6958547 |
Interconnect structures containing conductive electrolessly deposited etch stop layers, liner layers, and via plugs |
Oct. 25, 2005 |
| 6951809 |
Method for manufacturing semiconductor device |
Oct. 4, 2005 |
| 6951826 |
Silicon carbide deposition for use as a low dielectric constant anti-reflective coating |
Oct. 4, 2005 |
| 6949203 |
System level in-situ integrated dielectric etch process particularly useful for copper dual damascene |
Sep. 27, 2005 |
| 6949456 |
Method for manufacturing semiconductor device having porous structure with air-gaps |
Sep. 27, 2005 |
| 6949829 |
Semiconductor device and fabrication method therefor |
Sep. 27, 2005 |
| 6949830 |
Silicon oxycarbide, growth method of silicon oxycarbide layer, semiconductor device and manufacture method for semiconductor device |
Sep. 27, 2005 |
| 6946381 |
Method of forming insulating film in semiconductor device |
Sep. 20, 2005 |
| 6946383 |
Method for forming wiring structure which includes annealing conductive film before and after removal of a portion of the conductive film |
Sep. 20, 2005 |
| 6946385 |
Production method for semiconductor device |
Sep. 20, 2005 |
| 6946391 |
Method for forming dual damascenes |
Sep. 20, 2005 |
| 6946401 |
Plasma treatment for copper oxide reduction |
Sep. 20, 2005 |
| 6943121 |
Selectively converted inter-layer dielectric |
Sep. 13, 2005 |
| 6943431 |
Semiconductor device using low-k material as interlayer insulating film and including a surface modifying layer |
Sep. 13, 2005 |
| 6939793 |
Dual damascene integration scheme for preventing copper contamination of dielectric layer |
Sep. 6, 2005 |
| 6939797 |
Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof |
Sep. 6, 2005 |
| 6939798 |
Method for forming T-shaped conductor wires of semiconductor device |
Sep. 6, 2005 |
| 6940170 |
Techniques for triple and quadruple damascene fabrication |
Sep. 6, 2005 |
| 6936408 |
Partially photoexposed positive photoresist layer blocking method for regio-selectively processing a microelectronic layer |
Aug. 30, 2005 |
| 6936531 |
Process of fabricating a chip structure |
Aug. 30, 2005 |
| 6936533 |
Method of fabricating semiconductor devices having low dielectric interlayer insulation layer |
Aug. 30, 2005 |
| 6936534 |
Method for the post-etch cleaning of multi-level damascene structures having underlying copper metallization |
Aug. 30, 2005 |
| 6933230 |
Method for making interconnects and diffusion barriers in integrated circuits |
Aug. 23, 2005 |
| 6933586 |
Porous low-k dielectric interconnects with improved adhesion produced by partial burnout of surface porogens |
Aug. 23, 2005 |
| 6930033 |
Treating surface of low-dielectric constant material to achieve good mechanical strength |
Aug. 16, 2005 |
| 6930034 |
Robust ultra-low k interconnect structures using bridge-then-metallization fabrication sequence |
Aug. 16, 2005 |
| 6930036 |
Semiconductor device and method of manufacturing the same |
Aug. 16, 2005 |
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