| |
 |
|
Class Information
Number: 257/E21.579
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo) > Interconnections, comprising conductors and dielectrics, for carrying current between separate components within device (epo) > Characterized by formation and post treatment of dielectrics, e.g., planarizing (epo) > By forming via holes (epo) > For "dual damascene" type structures (epo)
Description: This subclass is indented under subclass E21.577. This subclass is substantially the same in scope as ECLA classification H01L21/768B2D.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 6417092 |
Low dielectric constant etch stop films |
Jul. 9, 2002 |
| 6417094 |
Dual-damascene interconnect structures and methods of fabricating same |
Jul. 9, 2002 |
| 6417096 |
Method for avoiding photo residue in dual damascene with acid treatment |
Jul. 9, 2002 |
| 6417098 |
Enhanced surface modification of low K carbon-doped oxide |
Jul. 9, 2002 |
| 6417112 |
Post etch cleaning composition and process for dual damascene system |
Jul. 9, 2002 |
| 6414392 |
Integrated circuit contact |
Jul. 2, 2002 |
| 6413583 |
Formation of a liquid-like silica layer by reaction of an organosilicon compound and a hydroxyl forming compound |
Jul. 2, 2002 |
| 6413815 |
Method of forming a MIM capacitor |
Jul. 2, 2002 |
| 6413856 |
Method of fabricating dual damascene structure |
Jul. 2, 2002 |
| 6410386 |
Method for forming a metal capacitor in a damascene process |
Jun. 25, 2002 |
| 6410425 |
Integrated circuit with stop layer and method of manufacturing the same |
Jun. 25, 2002 |
| 6410426 |
Damascene cap layer process for integrated circuit interconnects |
Jun. 25, 2002 |
| 6410437 |
Method for etching dual damascene structures in organosilicate glass |
Jun. 25, 2002 |
| 6410453 |
Method of processing a substrate |
Jun. 25, 2002 |
| 6406992 |
Fabrication method for a dual damascene structure |
Jun. 18, 2002 |
| 6406995 |
Pattern-sensitive deposition for damascene processing |
Jun. 18, 2002 |
| 6407011 |
Low dielectric constant insulating films with laminated carbon-containing silicon oxide and organic layers |
Jun. 18, 2002 |
| 6407453 |
Semiconductor device and method of manufacturing the same |
Jun. 18, 2002 |
| 6407455 |
Local interconnect using spacer-masked contact etch |
Jun. 18, 2002 |
| 6403424 |
Method for forming self-aligned mask read only memory by dual damascene trenches |
Jun. 11, 2002 |
| 6403461 |
Method to reduce capacitance between metal lines |
Jun. 11, 2002 |
| 6403470 |
Method for fabricating a dual damascene structure |
Jun. 11, 2002 |
| 6403471 |
Method of forming a dual damascene structure including smoothing the top part of a via |
Jun. 11, 2002 |
| 6403491 |
Etch method using a dielectric etch chamber with expanded process window |
Jun. 11, 2002 |
| 6399424 |
Method of manufacturing contact structure |
Jun. 4, 2002 |
| 6399477 |
Semiconductor devices and methods for manufacturing semiconductor devices |
Jun. 4, 2002 |
| 6399478 |
Method of making a dual damascene structure with modified insulation |
Jun. 4, 2002 |
| 6399483 |
Method for improving faceting effect in dual damascene process |
Jun. 4, 2002 |
| 6399495 |
Copper interconnections for metal-insulator-metal capacitor in mixed mode signal process |
Jun. 4, 2002 |
| 6399511 |
Plasma etch process in a single inter-level dielectric etch |
Jun. 4, 2002 |
| 6399512 |
Method of making metallization and contact structures in an integrated circuit comprising an etch stop layer |
Jun. 4, 2002 |
| 6400023 |
Integration of low-k SiOF for damascene structure |
Jun. 4, 2002 |
| 6395627 |
Semiconductor device a burried wiring structure and process for fabricating the same |
May. 28, 2002 |
| 6395632 |
Etch stop in damascene interconnect structure and method of making |
May. 28, 2002 |
| 6391472 |
Fill material for dual damascene processes |
May. 21, 2002 |
| 6391757 |
Dual damascene process |
May. 21, 2002 |
| 6391761 |
Method to form dual damascene structures using a linear passivation |
May. 21, 2002 |
| 6391766 |
Method of making a slot via filled dual damascene structure with middle stop layer |
May. 21, 2002 |
| 6391785 |
Method for bottomless deposition of barrier layers in integrated circuit metallization schemes |
May. 21, 2002 |
| 6387770 |
Thin-film capacitors and methods for forming the same |
May. 14, 2002 |
| 6387821 |
Method of manufacturing a semiconductor device |
May. 14, 2002 |
| 6387824 |
Method for forming porous forming film wiring structure |
May. 14, 2002 |
| 6387859 |
Method and cleaner composition for stripping copper containing residue layers |
May. 14, 2002 |
| 6384480 |
Formation of electrical contacts to conductive elements in the fabrication of semiconductor integrated circuits |
May. 7, 2002 |
| 6384484 |
Semiconductor device |
May. 7, 2002 |
| 6383907 |
Process for fabricating a semiconductor device |
May. 7, 2002 |
| 6383912 |
Fabrication method of integrated circuits with multiple low dielectric-constant intermetal dielectrics |
May. 7, 2002 |
| 6383913 |
Method for improving surface wettability of low k material |
May. 7, 2002 |
| 6383916 |
Top layers of metal for high performance IC's |
May. 7, 2002 |
| 6383919 |
Method of making a dual damascene structure without middle stop layer |
May. 7, 2002 |
|
|
|
