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Class Information
Number: 257/E21.578
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo) > Interconnections, comprising conductors and dielectrics, for carrying current between separate components within device (epo) > Characterized by formation and post treatment of dielectrics, e.g., planarizing (epo) > By forming via holes (epo) > Tapered via holes (epo)
Description: This subclass is indented under subclass E21.577. This subclass is substantially the same in scope as ECLA classification H01L21/768B2B.

Patents under this class:
1 2 3 4 5 6 7 8 9 10

Patent Number Title Of Patent Date Issued
8685861 Integrated circuit system with contact distribution film Apr. 1, 2014
8664114 Image sensor and method for fabricating the same Mar. 4, 2014
8628984 Light-emitting diode (LED) package systems Jan. 14, 2014
8586470 Multilevel interconnect structures and methods of fabricating same Nov. 19, 2013
8569167 Methods for forming a semiconductor structure Oct. 29, 2013
8492274 Metal alloy cap integration Jul. 23, 2013
8450850 Thin-film transistor substrate and method of manufacturing the same May. 28, 2013
8421238 Stacked semiconductor device with through via Apr. 16, 2013
8415804 Semiconductor chip, method of fabricating the same, and stack module and memory card including the same Apr. 9, 2013
8409956 Methods of forming integrated circuit devices using self-aligned contact formation techniques Apr. 2, 2013
8394718 Methods of forming self-aligned through silicon via Mar. 12, 2013
8390120 Semiconductor device and method of fabricating the same Mar. 5, 2013
8372739 Diffusion barrier for integrated circuits formed from a layer of reactive metal and method of fabrication Feb. 12, 2013
8349639 Method for manufacturing image sensor Jan. 8, 2013
8293644 Methods of manufacturing a semiconductor memory device Oct. 23, 2012
8273627 Semiconductor device and method for manufacturing thereof Sep. 25, 2012
8273637 Method for manufacturing semiconductor device Sep. 25, 2012
8211776 Integrated circuit line with electromigration barriers Jul. 3, 2012
8193088 Method of forming metal lines of semiconductor device Jun. 5, 2012
8173461 Process for fabrication of nitride semiconductor light emitting device May. 8, 2012
8119519 Semiconductor device manufacturing method Feb. 21, 2012
8102057 Via design for flux residue mitigation Jan. 24, 2012
8043973 Mask overhang reduction or elimination after substrate etch Oct. 25, 2011
8004090 Semiconductor device and method for manufacturing the same Aug. 23, 2011
7960838 Interconnect structure Jun. 14, 2011
7943505 Advanced VLSI metallization May. 17, 2011
7943487 Method for manufacturing semiconductor device May. 17, 2011
7910983 MOS transistor having an increased gate-drain capacitance Mar. 22, 2011
7906431 Semiconductor device fabrication method Mar. 15, 2011
7884014 Method of forming contact structure with contact spacer and method of fabricating semiconductor device using the same Feb. 8, 2011
7879720 Methods of forming electrical interconnects using electroless plating techniques that inhibit void formation Feb. 1, 2011
7859114 IC chip and design structure with through wafer vias dishing correction Dec. 28, 2010
7851357 Method of forming electrodeposited contacts Dec. 14, 2010
7838994 Semiconductor device and radiation detector employing it Nov. 23, 2010
7838962 Semiconductor device having capacitor, transistor and diffusion resistor and manufacturing method thereof Nov. 23, 2010
7834459 Semiconductor device and semiconductor device manufacturing method Nov. 16, 2010
7807571 Semiconductor device and methods of forming the same Oct. 5, 2010
7807567 Semiconductor device with interconnection structure for reducing stress migration Oct. 5, 2010
RE41670 Sram cell fabrication with interlevel Dielectric planarization Sep. 14, 2010
7790604 Krypton sputtering of thin tungsten layer for integrated circuits Sep. 7, 2010
7750478 Semiconductor device with via hole of uneven width Jul. 6, 2010
7745331 Method for fabricating contact plug in semiconductor device Jun. 29, 2010
7741215 Semiconductor device and method for manufacturing the same Jun. 22, 2010
7713872 Method of manufacturing semiconductor device and semiconductor device May. 11, 2010
7701064 Apparatus for improved power distribution in a three dimensional vertical integrated circuit Apr. 20, 2010
7687395 Contact aperture and contact via with stepped sidewall and methods for fabrication thereof Mar. 30, 2010
7659631 Interconnection between different circuit types Feb. 9, 2010
7655547 Metal spacer in single and dual damascene processing Feb. 2, 2010
7655558 Method and system for determining semiconductor characteristics Feb. 2, 2010
7648909 Method for fabricating semiconductor device with metal line Jan. 19, 2010

1 2 3 4 5 6 7 8 9 10

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