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Class Information
Number: 257/E21.576
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo) > Interconnections, comprising conductors and dielectrics, for carrying current between separate components within device (epo) > Characterized by formation and post treatment of dielectrics, e.g., planarizing (epo)
Description: This subclass is indented under subclass E21.575. This subclass is substantially the same in scope as ECLA classification H01L21/768B.

Sub-classes under this class:

Class Number Class Name Patents
257/E21.584 Barrier, adhesion or liner layer (epo) 2,616
257/E21.589 By forming conductive members before deposition of protective insulating material, e.g., pillars, studs (epo) 612
257/E21.577 By forming via holes (epo) 2,177
257/E21.582 Characterized by formation and post treatment of conductors, e.g., patterning (epo) 1,556
257/E21.581 Dielectric comprising air gaps (epo) 539
257/E21.585 Filling of holes, grooves, vias or trenches with conductive material (epo) 2,071
257/E21.59 Local interconnects; local pads (epo) 1,062
257/E21.591 Modifying pattern or conductivity of conductive members, e.g., formation of alloys, reduction of contact resistances (epo) 337
257/E21.583 Planarization; smoothing (epo) 781
257/E21.58 Planarizing dielectric (epo) 592

Patents under this class:

Patent Number Title Of Patent Date Issued
7727891 Method of manufacturing a semiconductor device using a wet process Jun. 1, 2010
7727862 Semiconductor device including semiconductor constituent and manufacturing method thereof Jun. 1, 2010
7723849 Semiconductor device and manufacturing method thereof May. 25, 2010
7701011 Printed dopant layers Apr. 20, 2010
7693382 Substrate for mounting IC chip, multilayered printed circuit board, and device for optical communication Apr. 6, 2010
7687910 Semiconductor device and method of fabricating the same Mar. 30, 2010
7687359 Method for fabricating flash memory device Mar. 30, 2010
7679192 Semiconductor device including cover layer Mar. 16, 2010
7675178 Stacked structure for forming damascene structure Mar. 9, 2010
7674390 Zeolite--sol gel nano-composite low k dielectric Mar. 9, 2010
7670941 Method for production of semiconductor devices Mar. 2, 2010
7662712 UV blocking and crack protecting passivation layer fabricating method Feb. 16, 2010
7652329 Vertical MOS transistor and method therefor Jan. 26, 2010
7651934 Process for electroless copper deposition Jan. 26, 2010
7649264 Hard mask for low-k interlayer dielectric patterning Jan. 19, 2010
7648905 Flash memory device and a method of manufacturing the same Jan. 19, 2010
7648904 Metal line in semiconductor device and method for forming the same Jan. 19, 2010
7645694 Development or removal of block copolymer or PMMA-b-S-based resist using polar supercritical solvent Jan. 12, 2010
7635644 Semiconductor device including metal interconnection and method for forming metal interconnection Dec. 22, 2009
7632709 Method of manufacturing wafer level package Dec. 15, 2009
7605414 MOS transistors having low-resistance salicide gates and a self-aligned contact between them Oct. 20, 2009
7601610 Method for manufacturing a high integration density power MOS device Oct. 13, 2009
7598166 Dielectric layers for metal lines in semiconductor chips Oct. 6, 2009
7595556 Semiconductor device and method for manufacturing the same Sep. 29, 2009
7595269 Semiconductor device comprising a copper alloy as a barrier layer in a copper metallization layer Sep. 29, 2009
7592269 Method and apparatus for depositing charge and/or nanoparticles Sep. 22, 2009
7589028 Hydroxyl bond removal and film densification method for oxide films using microwave post treatment Sep. 15, 2009
7585758 Interconnect layers without electromigration Sep. 8, 2009
7585757 Semiconductor device and method of manufacturing the same Sep. 8, 2009
7585720 Dual stress liner device and method Sep. 8, 2009
7582572 Method of manufacturing insulating film, method of manufacturing transistor, and method of manufacturing electronic device Sep. 1, 2009
7582560 Method for fabricating semiconductor device Sep. 1, 2009
7582555 CVD flowable gap fill Sep. 1, 2009
7579271 Method for forming low dielectric constant fluorine-doped layers Aug. 25, 2009
7579258 Semiconductor interconnect having adjacent reservoir for bonding and method for formation Aug. 25, 2009
7575995 Method of forming fine metal pattern and method of forming metal line using the same Aug. 18, 2009
7569467 Semiconductor device and manufacturing method thereof Aug. 4, 2009
7566652 Electrically inactive via for electromigration reliability improvement Jul. 28, 2009
7563729 Method of forming a dielectric film Jul. 21, 2009
7560378 Method for manufacturing semiconductor device Jul. 14, 2009
7560377 Plasma processes for depositing low dielectric constant films Jul. 14, 2009
7557045 Manufacture of semiconductor device with good contact holes Jul. 7, 2009
7557030 Method for fabricating a recess gate in a semiconductor device Jul. 7, 2009
7553759 Semiconductor device and method of manufacturing a semiconductor device Jun. 30, 2009
7553748 Semiconductor device and method of manufacturing the same Jun. 30, 2009
7550397 Method of manufacturing a semiconductor device having a pre-metal dielectric liner Jun. 23, 2009
7550376 Semiconductor device capable of suppressing current concentration in pad and its manufacture method Jun. 23, 2009
7544614 Method of forming a coated film, method of forming an electronic device, and method of manufacturing an electron emission element Jun. 9, 2009
7541297 Method and system for improving dielectric film quality for void free gap fill Jun. 2, 2009
7541296 Method for forming insulating film, method for forming multilayer structure and method for manufacturing semiconductor device Jun. 2, 2009

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