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Class Information
Number: 257/E21.576
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo) > Interconnections, comprising conductors and dielectrics, for carrying current between separate components within device (epo) > Characterized by formation and post treatment of dielectrics, e.g., planarizing (epo)
Description: This subclass is indented under subclass E21.575. This subclass is substantially the same in scope as ECLA classification H01L21/768B.
Sub-classes under this class:
| Class Number |
Class Name |
Patents |
| 257/E21.584 |
Barrier, adhesion or liner layer (epo) |
2,372 |
| 257/E21.589 |
By forming conductive members before deposition of protective insulating material, e.g., pillars, studs (epo) |
571 |
| 257/E21.577 |
By forming via holes (epo) |
1,894 |
| 257/E21.582 |
Characterized by formation and post treatment of conductors, e.g., patterning (epo) |
1,459 |
| 257/E21.581 |
Dielectric comprising air gaps (epo) |
460 |
| 257/E21.585 |
Filling of holes, grooves, vias or trenches with conductive material (epo) |
1,668 |
| 257/E21.59 |
Local interconnects; local pads (epo) |
1,005 |
| 257/E21.591 |
Modifying pattern or conductivity of conductive members, e.g., formation of alloys, reduction of contact resistances (epo) |
311 |
| 257/E21.583 |
Planarization; smoothing (epo) |
743 |
| 257/E21.58 |
Planarizing dielectric (epo) |
562 |
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7605414 |
MOS transistors having low-resistance salicide gates and a self-aligned contact between them |
Oct. 20, 2009 |
| 7601610 |
Method for manufacturing a high integration density power MOS device |
Oct. 13, 2009 |
| 7598166 |
Dielectric layers for metal lines in semiconductor chips |
Oct. 6, 2009 |
| 7595556 |
Semiconductor device and method for manufacturing the same |
Sep. 29, 2009 |
| 7595269 |
Semiconductor device comprising a copper alloy as a barrier layer in a copper metallization layer |
Sep. 29, 2009 |
| 7592269 |
Method and apparatus for depositing charge and/or nanoparticles |
Sep. 22, 2009 |
| 7589028 |
Hydroxyl bond removal and film densification method for oxide films using microwave post treatment |
Sep. 15, 2009 |
| 7585758 |
Interconnect layers without electromigration |
Sep. 8, 2009 |
| 7585757 |
Semiconductor device and method of manufacturing the same |
Sep. 8, 2009 |
| 7585720 |
Dual stress liner device and method |
Sep. 8, 2009 |
| 7582572 |
Method of manufacturing insulating film, method of manufacturing transistor, and method of manufacturing electronic device |
Sep. 1, 2009 |
| 7582560 |
Method for fabricating semiconductor device |
Sep. 1, 2009 |
| 7582555 |
CVD flowable gap fill |
Sep. 1, 2009 |
| 7579271 |
Method for forming low dielectric constant fluorine-doped layers |
Aug. 25, 2009 |
| 7579258 |
Semiconductor interconnect having adjacent reservoir for bonding and method for formation |
Aug. 25, 2009 |
| 7575995 |
Method of forming fine metal pattern and method of forming metal line using the same |
Aug. 18, 2009 |
| 7569467 |
Semiconductor device and manufacturing method thereof |
Aug. 4, 2009 |
| 7566652 |
Electrically inactive via for electromigration reliability improvement |
Jul. 28, 2009 |
| 7563729 |
Method of forming a dielectric film |
Jul. 21, 2009 |
| 7560378 |
Method for manufacturing semiconductor device |
Jul. 14, 2009 |
| 7560377 |
Plasma processes for depositing low dielectric constant films |
Jul. 14, 2009 |
| 7557045 |
Manufacture of semiconductor device with good contact holes |
Jul. 7, 2009 |
| 7557030 |
Method for fabricating a recess gate in a semiconductor device |
Jul. 7, 2009 |
| 7553759 |
Semiconductor device and method of manufacturing a semiconductor device |
Jun. 30, 2009 |
| 7553748 |
Semiconductor device and method of manufacturing the same |
Jun. 30, 2009 |
| 7550397 |
Method of manufacturing a semiconductor device having a pre-metal dielectric liner |
Jun. 23, 2009 |
| 7550376 |
Semiconductor device capable of suppressing current concentration in pad and its manufacture method |
Jun. 23, 2009 |
| 7544614 |
Method of forming a coated film, method of forming an electronic device, and method of manufacturing an electron emission element |
Jun. 9, 2009 |
| 7541297 |
Method and system for improving dielectric film quality for void free gap fill |
Jun. 2, 2009 |
| 7541296 |
Method for forming insulating film, method for forming multilayer structure and method for manufacturing semiconductor device |
Jun. 2, 2009 |
| 7538353 |
Composite barrier/etch stop layer comprising oxygen doped SiC and SiC for interconnect structures |
May. 26, 2009 |
| 7538028 |
Barrier layer, IC via, and IC line forming methods |
May. 26, 2009 |
| 7538023 |
Method of manufacturing a semiconductor wafer device having separated conductive patterns in peripheral area |
May. 26, 2009 |
| 7537971 |
Method for fabricating CMOS image sensor |
May. 26, 2009 |
| 7534717 |
Method of manufacturing semiconductor device |
May. 19, 2009 |
| 7531457 |
Method of fabricating suspended structure |
May. 12, 2009 |
| 7524750 |
Integrated process modulation (IPM) a novel solution for gapfill with HDP-CVD |
Apr. 28, 2009 |
| 7510982 |
Creation of porosity in low-k films by photo-disassociation of imbedded nanoparticles |
Mar. 31, 2009 |
| 7501353 |
Method of formation of a damascene structure utilizing a protective film |
Mar. 10, 2009 |
| 7501326 |
Method for forming isolation layer of semiconductor device |
Mar. 10, 2009 |
| 7498262 |
Method of fabricating a thin film and metal wiring in a semiconductor device |
Mar. 3, 2009 |
| 7473630 |
Semiconductor device and method for manufacturing same |
Jan. 6, 2009 |
| 7459404 |
Adhesion improvement for low k dielectrics |
Dec. 2, 2008 |
| 7456067 |
Method with high gapfill capability for semiconductor devices |
Nov. 25, 2008 |
| 7446058 |
Adhesion enhancement for metal/dielectric interface |
Nov. 4, 2008 |
| 7439173 |
Increasing electromigration lifetime and current density in IC using vertically upwardly extending dummy via |
Oct. 21, 2008 |
| 7427561 |
Method for manufacturing semiconductor device |
Sep. 23, 2008 |
| 7423283 |
Strain-silicon CMOS using etch-stop layer and method of manufacture |
Sep. 9, 2008 |
| 7422975 |
Composite inter-level dielectric structure for an integrated circuit |
Sep. 9, 2008 |
| 7420275 |
Boron-doped SIC copper diffusion barrier films |
Sep. 2, 2008 |
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