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Class Information
Number: 257/E21.575
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo) > Interconnections, comprising conductors and dielectrics, for carrying current between separate components within device (epo)
Description: This subclass is indented under subclass E21.536. This subclass is substantially the same in scope as ECLA classification H01L21/768.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7615481 |
Method of manufacturing multilevel interconnect structure and multilevel interconnect structure |
Nov. 10, 2009 |
| 7615486 |
Apparatus and method for integrated surface treatment and deposition for copper interconnect |
Nov. 10, 2009 |
| 7615488 |
Method for forming pattern, thin film transistor, display device and method for manufacturing the same, and television device |
Nov. 10, 2009 |
| 7615489 |
Method for forming metal interconnects and reducing metal seed layer overhang |
Nov. 10, 2009 |
| 7615474 |
Method for manufacturing semiconductor device with reduced damage to metal wiring layer |
Nov. 10, 2009 |
| 7611982 |
Method of forming sheet having foreign material portions used for forming multi-layer wiring board and sheet having foreign portions |
Nov. 3, 2009 |
| 7612453 |
Semiconductor device having an interconnect structure and a reinforcing insulating film |
Nov. 3, 2009 |
| 7608476 |
Electronic device |
Oct. 27, 2009 |
| 7592249 |
Method for manufacturing a semiconductor device |
Sep. 22, 2009 |
| 7592259 |
Methods and systems for barrier layer surface passivation |
Sep. 22, 2009 |
| 7588950 |
Test pattern for reliability measurement of copper interconnection line having moisture window and method for manufacturing the same |
Sep. 15, 2009 |
| 7589011 |
Semiconductor device and method of forming intermetal dielectric layer |
Sep. 15, 2009 |
| 7586192 |
Routing configuration for high frequency signals in an integrated circuit package |
Sep. 8, 2009 |
| 7585768 |
Combined copper plating method to improve gap fill |
Sep. 8, 2009 |
| 7579272 |
Methods of forming low-k dielectric layers containing carbon nanostructures |
Aug. 25, 2009 |
| 7576006 |
Protective self-aligned buffer layers for damascene interconnects |
Aug. 18, 2009 |
| 7569468 |
Method for forming a floating gate memory with polysilicon local interconnects |
Aug. 4, 2009 |
| 7560800 |
Die seal with reduced noise coupling |
Jul. 14, 2009 |
| 7557447 |
Semiconductor device and method for manufacturing same |
Jul. 7, 2009 |
| 7557029 |
Semiconductor device and fabrication process thereof |
Jul. 7, 2009 |
| 7553760 |
Sub-lithographic nano interconnect structures, and method for forming same |
Jun. 30, 2009 |
| 7541278 |
Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment |
Jun. 2, 2009 |
| 7538023 |
Method of manufacturing a semiconductor wafer device having separated conductive patterns in peripheral area |
May. 26, 2009 |
| 7531445 |
Formation of through-wafer electrical interconnections and other structures using a thin dielectric membrane |
May. 12, 2009 |
| 7531439 |
Method for forming an integrated semiconductor circuit arrangement |
May. 12, 2009 |
| 7524758 |
Interconnect structure and method for semiconductor device |
Apr. 28, 2009 |
| 7524759 |
Post passivation interconnection schemes on top of IC chip |
Apr. 28, 2009 |
| 7525174 |
High performance system-on-chip using post passivation process |
Apr. 28, 2009 |
| 7521357 |
Methods of forming metal wiring in semiconductor devices using etch stop layers |
Apr. 21, 2009 |
| 7521351 |
Method for forming a semiconductor product and semiconductor product |
Apr. 21, 2009 |
| 7521349 |
Fundamental cell, semiconductor integrated circuit device, wiring method and wiring apparatus |
Apr. 21, 2009 |
| 7517736 |
Structure and method of chemically formed anchored metallic vias |
Apr. 14, 2009 |
| 7517793 |
Method of forming metal wire in semiconductor device |
Apr. 14, 2009 |
| 7514353 |
Contact metallization scheme using a barrier layer over a silicide layer |
Apr. 7, 2009 |
| 7514793 |
Metal interconnection lines of semiconductor devices and methods of forming the same |
Apr. 7, 2009 |
| 7501342 |
Device having high aspect-ratio via structure in low-dielectric material and method for manufacturing the same |
Mar. 10, 2009 |
| 7498250 |
Shapes-based migration of aluminum designs to copper damascene |
Mar. 3, 2009 |
| 7498254 |
Plating seed layer including an oxygen/nitrogen transition region for barrier enhancement |
Mar. 3, 2009 |
| 7498253 |
Local interconnection method and structure for use in semiconductor device |
Mar. 3, 2009 |
| 7494926 |
Method for forming highly conductive metal pattern on flexible substrate and EMI filter using metal pattern formed by the method |
Feb. 24, 2009 |
| 7495340 |
Metal layer structure of semiconductor device |
Feb. 24, 2009 |
| 7491638 |
Method of forming an insulating capping layer for a copper metallization layer |
Feb. 17, 2009 |
| 7491636 |
Methods for forming flexible column die interconnects and resulting structures |
Feb. 17, 2009 |
| 7488624 |
Techniques for providing decoupling capacitance |
Feb. 10, 2009 |
| 7482272 |
Through chip connection |
Jan. 27, 2009 |
| 7479670 |
Organic electronic component with high resolution structuring, and method of the production thereof |
Jan. 20, 2009 |
| 7476604 |
Aggressive cleaning process for semiconductor device contact formation |
Jan. 13, 2009 |
| 7470968 |
T-coil apparatus and method for compensating capacitance |
Dec. 30, 2008 |
| 7459790 |
Post passivation interconnection schemes on top of the IC chips |
Dec. 2, 2008 |
| 7446037 |
Cladded silver and silver alloy metallization for improved adhesion and electromigration resistance |
Nov. 4, 2008 |
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