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Class Information
Number: 257/E21.57
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo) > Making of isolation regions between components (epo) > Dielectric regions, e.g., epic dielectric isolation, locos; trench refilling techniques, soi technology, use of channel stoppers (epo) > Using semiconductor or insulator technology, i.e., soi technology (epo) > Using bonding technique (epo) > With separation/delamination along porous layer (epo)
Description: This subclass is indented under subclass E21.567. This subclass is substantially the same in scope as ECLA classification H01L21/762D8F.










Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
8709914 Method for controlled layer transfer Apr. 29, 2014
8673740 Method for formation of an electrically conducting through via Mar. 18, 2014
8673739 Method of manufacturing semiconductor device Mar. 18, 2014
8664087 Method of manufacturing a semiconductor structure and separating the semiconductor from a substrate Mar. 4, 2014
8653664 Barrier layers for copper interconnect Feb. 18, 2014
8598013 Method for manufacturing SOI substrate and semiconductor device Dec. 3, 2013
8546238 Method for transferring at least one micro-technological layer Oct. 1, 2013
8546242 Hybrid gap-fill approach for STI formation Oct. 1, 2013
8530336 Method for manufacturing semiconductor substrate Sep. 10, 2013
8501587 Stacked integrated chips and methods of fabrication thereof Aug. 6, 2013
8486772 Method of manufacturing SOI substrate Jul. 16, 2013
8476146 Reducing wafer distortion through a low CTE layer Jul. 2, 2013
8470689 Method for forming a multilayer structure Jun. 25, 2013
8470690 Method for producing a multilayer film including at least one ultrathin layer of crystalline silicon, and devices obtained by means of said method Jun. 25, 2013
8372727 Method for fabricating light emitting device Feb. 12, 2013
8367524 Three-dimensional integrated circuit structure Feb. 5, 2013
8367517 Method for manufacturing SOI substrate Feb. 5, 2013
8367440 Semiconductor device and peeling off method and method of manufacturing semiconductor device Feb. 5, 2013
8314006 Method for manufacturing bonded wafer Nov. 20, 2012
8288245 Reprocessing method of semiconductor substrate, manufacturing method of reprocessed semiconductor substrate, and manufacturing method of SOI substrate Oct. 16, 2012
8278189 Method for thinning wafer Oct. 2, 2012
8258043 Manufacturing method of thin film semiconductor substrate Sep. 4, 2012
8242021 Method for manufacturing semiconductor device Aug. 14, 2012
8193076 Method for releasing a thin semiconductor substrate from a reusable template Jun. 5, 2012
8187948 Hybrid gap-fill approach for STI formation May. 29, 2012
8178426 Method for manufacturing a structure of semiconductor-on-insulator type May. 15, 2012
8168481 Method of manufacturing SOI substrate May. 1, 2012
8163599 Flip-chip mounting method, flip-chip mounting apparatus and tool protection sheet used in flip-chip mounting apparatus Apr. 24, 2012
8119499 Semiconductor substrate fabrication by etching of a peeling layer Feb. 21, 2012
8101439 Method of driving a light emitting device Jan. 24, 2012
8097523 Method for manufacturing bonded wafer Jan. 17, 2012
8058146 Peeling method Nov. 15, 2011
8053331 Flexible display substrates Nov. 8, 2011
8048770 Method for manufacturing semiconductor device Nov. 1, 2011
8043936 Method for manufacturing semiconductor device Oct. 25, 2011
8039362 Method for fabricating light emitting device Oct. 18, 2011
RE42830 Method for separating a device-forming layer from a base body Oct. 11, 2011
8021959 Method for the ultrasonic planarization of a substrate, from one surface of which a buried weakened layer has been uncovered by fracture Sep. 20, 2011
8021960 Method for manufacturing semiconductor device Sep. 20, 2011
8021962 Functional film containing structure and method of manufacturing functional film Sep. 20, 2011
8012852 Controlled process and resulting device Sep. 6, 2011
8003491 Methods and apparatus for producing semiconductor on insulator structures using directed exfoliation Aug. 23, 2011
7981754 Manufacturing method of bonded SOI substrate and manufacturing method of semiconductor device Jul. 19, 2011
7977206 Method for manufacturing SOI substrate using the heat treatment apparatus Jul. 12, 2011
7968382 Method of manufacturing semiconductor device Jun. 28, 2011
7951691 Method for producing a thin semiconductor chip comprising an integrated circuit May. 31, 2011
7951692 Method of producing semiconductor substrate having an SOI structure May. 31, 2011
7947572 Method of manufacturing a SOI structure having a SiGe layer interposed between the silicon and the insulator May. 24, 2011
7943485 Composite wafers having bulk-quality semiconductor layers and method of manufacturing thereof May. 17, 2011
7939428 Methods for making substrates and substrates formed therefrom May. 10, 2011

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