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Class Information
Number: 257/E21.569
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo) > Making of isolation regions between components (epo) > Dielectric regions, e.g., epic dielectric isolation, locos; trench refilling techniques, soi technology, use of channel stoppers (epo) > Using semiconductor or insulator technology, i.e., soi technology (epo) > Using bonding technique (epo) > Using silicon etch back technique, e.g., besoi, eltran (epo)
Description: This subclass is indented under subclass E21.567. This subclass is substantially the same in scope as ECLA classification H01L21/762D8D.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8685836 Method for forming a silicon layer on any substrate using light irradiation Apr. 1, 2014
8679946 Manufacturing process for a stacked structure comprising a thin layer bonding to a target substrate Mar. 25, 2014
8551862 Method of manufacturing laminated wafer by high temperature laminating method Oct. 8, 2013
8513092 Method for producing a stack of semi-conductor thin films Aug. 20, 2013
8486814 Wafer backside defectivity clean-up utilizing selective removal of substrate material Jul. 16, 2013
8481409 Manufacturing process for a stacked structure comprising a thin layer bonding to a target substrate Jul. 9, 2013
8476146 Reducing wafer distortion through a low CTE layer Jul. 2, 2013
8394660 Free-standing two-sided device fabrication Mar. 12, 2013
8394703 Manufacturing method of SOI substrate and manufacturing method of semiconductor device Mar. 12, 2013
8357586 Method for manufacturing SOI wafer Jan. 22, 2013
8298915 Method of transferring a circuit onto a ground plane Oct. 30, 2012
8278189 Method for thinning wafer Oct. 2, 2012
8193076 Method for releasing a thin semiconductor substrate from a reusable template Jun. 5, 2012
8003461 Method of fabricating efuse structure, resistor sturcture and transistor sturcture Aug. 23, 2011
7939428 Methods for making substrates and substrates formed therefrom May. 10, 2011
7915079 Method of manufacturing layered chip package Mar. 29, 2011
RE42241 Method of fabricating a semiconductor device Mar. 22, 2011
7910455 Method for producing SOI wafer Mar. 22, 2011
RE42097 Method of fabricating a semiconductor device Feb. 1, 2011
7839001 Methods for making substrates and substrates formed therefrom Nov. 23, 2010
7786587 Semiconductor device and method for manufacturing thereof Aug. 31, 2010
7767494 Method of manufacturing layered chip package Aug. 3, 2010
7691724 Method for manufacturing SOI substrate Apr. 6, 2010
7666781 Interconnect structures with improved electromigration resistance and methods for forming such interconnect structures Feb. 23, 2010
7615468 Methods for making substrates and substrates formed therefrom Nov. 10, 2009
7595259 Method for manufacturing compound semiconductor substrate with pn junction Sep. 29, 2009
7531429 Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices May. 12, 2009
7498234 Method of producing a thin layer of semiconductor material Mar. 3, 2009
7476576 Method of fabricating a semiconductor device Jan. 13, 2009
7473592 Method of fabricating a semiconductor device Jan. 6, 2009
7465647 Manufacturing method of thin film integrated circuit device and manufacturing method of non-contact type thin film integrated circuit device Dec. 16, 2008
7452786 Method for manufacturing thin film integrated circuit, and element substrate Nov. 18, 2008
7436075 Ion beam irradiation apparatus and ion beam irradiation method Oct. 14, 2008
7354863 Methods of selectively removing silicon Apr. 8, 2008
7279751 Semiconductor laser device and manufacturing method thereof Oct. 9, 2007
7273797 Methods of forming semiconductor-on-insulator constructions Sep. 25, 2007
7271076 Manufacturing method of thin film integrated circuit device and manufacturing method of non-contact type thin film integrated circuit device Sep. 18, 2007
7256104 Substrate manufacturing method and substrate processing apparatus Aug. 14, 2007
7235478 Polymer spacer formation Jun. 26, 2007
7229892 Semiconductor device and method of manufacturing the same Jun. 12, 2007
7064391 Bond and back side etchback transistor fabrication process Jun. 20, 2006
7018873 Method of making a device threshold control of front-gate silicon-on-insulator MOSFET using a self-aligned back-gate Mar. 28, 2006
7008860 Substrate manufacturing method Mar. 7, 2006
7001826 Wafer with a relaxed useful layer and method of forming the wafer Feb. 21, 2006
6984570 Wafer bonding method of forming silicon-on-insulator comprising integrated circuitry Jan. 10, 2006
6974757 Method of forming silicon-on-insulator comprising integrated circuitry Dec. 13, 2005
6974759 Method for making a stacked comprising a thin film adhering to a target substrate Dec. 13, 2005
6949164 Direct bonding of articles containing silicon Sep. 27, 2005
6940089 Semiconductor device structure Sep. 6, 2005
6936894 Silicon-on-insulator comprising integrated circuitry Aug. 30, 2005

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