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Browse by Category: Main > Physics
Class Information
Number: 257/E21.568
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo) > Making of isolation regions between components (epo) > Dielectric regions, e.g., epic dielectric isolation, locos; trench refilling techniques, soi technology, use of channel stoppers (epo) > Using semiconductor or insulator technology, i.e., soi technology (epo) > Using bonding technique (epo) > With separation/delamination along ion implanted layer, e.g., "smart-cut", "unibond" (epo)
Description: This subclass is indented under subclass E21.567. This subclass is substantially the same in scope as ECLA classification H01L21/762D8B.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8709914 Method for controlled layer transfer Apr. 29, 2014
8703521 Multijunction photovoltaic cell fabrication Apr. 22, 2014
8703580 Silicon on insulator (SOI) wafer and process for producing same Apr. 22, 2014
8664085 Method of manufacturing composite substrate Mar. 4, 2014
8652925 Method of fabricating isolated capacitors and structure thereof Feb. 18, 2014
8648423 Semiconductor devices including buried-channel-array transistors Feb. 11, 2014
8642405 Process for production of SOI substrate and process for production of semiconductor device Feb. 4, 2014
8633090 Method for forming substrate with buried insulating layer Jan. 21, 2014
8623740 Method of detaching semi-conductor layers at low temperature Jan. 7, 2014
8617962 Method for finishing a substrate of the semiconductor-on-insulator type Dec. 31, 2013
8609511 Semiconductor device manufacturing method, semiconductor device, and camera module Dec. 17, 2013
8603896 Method for transferring a monocrystalline semiconductor layer onto a support substrate Dec. 10, 2013
8604545 Semiconductor device having single crystal silicon layer with local maximum of carbon concentration and shoulder peak of hydrogen concentration Dec. 10, 2013
8598013 Method for manufacturing SOI substrate and semiconductor device Dec. 3, 2013
8592291 Fabrication of large-area hexagonal boron nitride thin films Nov. 26, 2013
8586451 Flexible electronic device and method for the fabrication of same Nov. 19, 2013
8574929 Method to form a 3D semiconductor device and structure Nov. 5, 2013
8551862 Method of manufacturing laminated wafer by high temperature laminating method Oct. 8, 2013
8541290 Optoelectronic substrate and methods of making same Sep. 24, 2013
8536629 Semiconductor device and method for manufacturing the same Sep. 17, 2013
8530332 Method for manufacturing SOI substrate and semiconductor device Sep. 10, 2013
8530333 Semiconductor device and manufacturing method thereof Sep. 10, 2013
8530336 Method for manufacturing semiconductor substrate Sep. 10, 2013
8530998 Substrate compositions and methods for forming semiconductor on insulator devices Sep. 10, 2013
8524574 Method for manufacturing solid-state image pickup-device Sep. 3, 2013
8518797 Method of making an SOI substrate by using a separation layer with regions of non-uniform concentration Aug. 27, 2013
8513092 Method for producing a stack of semi-conductor thin films Aug. 20, 2013
8507313 Method of manufacturing photoelectric conversion device Aug. 13, 2013
8497187 Method for manufacturing SOI wafer and SOI wafer Jul. 30, 2013
8486772 Method of manufacturing SOI substrate Jul. 16, 2013
8486804 Semiconductor device Jul. 16, 2013
8481375 Semiconductor device and method for producing the same Jul. 9, 2013
8481409 Manufacturing process for a stacked structure comprising a thin layer bonding to a target substrate Jul. 9, 2013
8482009 Silicon-on-insulator substrate with built-in substrate junction Jul. 9, 2013
8476147 SOI substrate and manufacturing method thereof Jul. 2, 2013
8476146 Reducing wafer distortion through a low CTE layer Jul. 2, 2013
8466041 Method for manufacturing lamination type semiconductor integrated device Jun. 18, 2013
8461014 Methods of fabricating semiconductor structures and devices with strained semiconductor material Jun. 11, 2013
8455331 Manufacturing method of semiconductor device Jun. 4, 2013
8445358 Method for manufacturing semiconductor substrate and method for manufacturing semiconductor device May. 21, 2013
8420503 Method for producing SOI substrate Apr. 16, 2013
8420506 Process for cleaving a substrate Apr. 16, 2013
8421076 Insulating substrate for semiconductor apparatus, semiconductor apparatus, and method for manufacturing semiconductor apparatus Apr. 16, 2013
8415231 Photovoltaic device and method for manufacturing the same Apr. 9, 2013
8409366 Separation method of nitride semiconductor layer, semiconductor device, manufacturing method thereof, semiconductor wafer, and manufacturing method thereof Apr. 2, 2013
8404563 Method for reprocessing semiconductor substrate and method for manufacturing SOI substrate Mar. 26, 2013
8405090 Method of fabricating a semiconductor device Mar. 26, 2013
8394655 Photoelectric conversion device and method for manufacturing the same Mar. 12, 2013
8394703 Manufacturing method of SOI substrate and manufacturing method of semiconductor device Mar. 12, 2013
8389385 Semiconductor material manufacture Mar. 5, 2013

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