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Class Information
Number: 257/E21.568
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo) > Making of isolation regions between components (epo) > Dielectric regions, e.g., epic dielectric isolation, locos; trench refilling techniques, soi technology, use of channel stoppers (epo) > Using semiconductor or insulator technology, i.e., soi technology (epo) > Using bonding technique (epo) > With separation/delamination along ion implanted layer, e.g., "smart-cut", "unibond" (epo)
Description: This subclass is indented under subclass E21.567. This subclass is substantially the same in scope as ECLA classification H01L21/762D8B.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7432532 |
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat |
Oct. 7, 2008 |
| 7416960 |
Method for manufacturing SOI substrate |
Aug. 26, 2008 |
| 7410885 |
Method of reducing contamination by removing an interlayer dielectric from the substrate edge |
Aug. 12, 2008 |
| 7390725 |
Strained silicon on insulator from film transfer and relaxation by hydrogen implantation |
Jun. 24, 2008 |
| 7381629 |
Method of forming through-wafer interconnects for vertical wafer level packaging |
Jun. 3, 2008 |
| 7381624 |
Technique for forming a substrate having crystalline semiconductor regions of different characteristics located above a crystalline bulk substrate |
Jun. 3, 2008 |
| 7378729 |
Recycling a wafer comprising a buffer layer, after having separated a thin layer therefrom |
May. 27, 2008 |
| 7375008 |
Recycling by mechanical means of a wafer comprising a multilayer structure after taking-off a thin layer thereof |
May. 20, 2008 |
| 7375005 |
Method for reclaiming and reusing wafers |
May. 20, 2008 |
| 7375006 |
Peeling method |
May. 20, 2008 |
| 7365729 |
Field sequential LCD device and color image display method thereof |
Apr. 29, 2008 |
| 7361573 |
Method of peeling off and method of manufacturing semiconductor device |
Apr. 22, 2008 |
| 7348260 |
Method for forming a relaxed or pseudo-relaxed useful layer on a substrate |
Mar. 25, 2008 |
| 7348257 |
Process for manufacturing wafers of semiconductor material by layer transfer |
Mar. 25, 2008 |
| 7323398 |
Method of layer transfer comprising sequential implantations of atomic species |
Jan. 29, 2008 |
| 7320929 |
Method of fabricating SOI wafer |
Jan. 22, 2008 |
| 7307006 |
Method of manufacturing semiconductor device |
Dec. 11, 2007 |
| 7300856 |
Process for detaching layers of material |
Nov. 27, 2007 |
| 7297611 |
Method for producing thin layers of semiconductor material from a donor wafer |
Nov. 20, 2007 |
| 7279751 |
Semiconductor laser device and manufacturing method thereof |
Oct. 9, 2007 |
| 7271076 |
Manufacturing method of thin film integrated circuit device and manufacturing method of non-contact type thin film integrated circuit device |
Sep. 18, 2007 |
| 7256075 |
Recycling of a wafer comprising a multi-layer structure after taking-off a thin layer |
Aug. 14, 2007 |
| 7256103 |
Method for manufacturing a compound material wafer |
Aug. 14, 2007 |
| 7253082 |
Pasted SOI substrate, process for producing the same and semiconductor device |
Aug. 7, 2007 |
| 7247545 |
Fabrication of a low defect germanium film by direct wafer bonding |
Jul. 24, 2007 |
| 7217639 |
Method of manufacturing a material compound wafer |
May. 15, 2007 |
| 7195931 |
Split manufacturing method for advanced semiconductor circuits |
Mar. 27, 2007 |
| 7183176 |
Method of forming through-wafer interconnects for vertical wafer level packaging |
Feb. 27, 2007 |
| 7179718 |
Structure and method of manufacturing the same |
Feb. 20, 2007 |
| 7176102 |
Method for producing SOI wafer and SOI wafer |
Feb. 13, 2007 |
| 7176072 |
Strained silicon devices transfer to glass for display applications |
Feb. 13, 2007 |
| 7170098 |
Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat |
Jan. 30, 2007 |
| 7148124 |
Method for forming a fragile layer inside of a single crystalline substrate preferably for making silicon-on-insulator wafers |
Dec. 12, 2006 |
| 7115481 |
Method for concurrently producing at least a pair of semiconductor structures that each include at least one useful layer on a substrate |
Oct. 3, 2006 |
| 7084046 |
Method of fabricating SOI wafer |
Aug. 1, 2006 |
| 7081399 |
Method for producing a high quality useful layer on a substrate utilizing helium and hydrogen implantations |
Jul. 25, 2006 |
| 7074623 |
Methods of forming strained-semiconductor-on-insulator finFET device structures |
Jul. 11, 2006 |
| 7071029 |
Methods for fabricating final substrates |
Jul. 4, 2006 |
| 7067386 |
Creation of high mobility channels in thin-body SOI devices |
Jun. 27, 2006 |
| 7067393 |
Substrate assembly for stressed systems |
Jun. 27, 2006 |
| 7064049 |
Ion implantation method, SOI wafer manufacturing method and ion implantation system |
Jun. 20, 2006 |
| 7060590 |
Layer transfer method |
Jun. 13, 2006 |
| 7057234 |
Scalable nano-transistor and memory using back-side trapping |
Jun. 6, 2006 |
| 7056809 |
Method for ion treating a semiconductor material for subsequent bonding |
Jun. 6, 2006 |
| 7056808 |
Cleaving process to fabricate multilayered substrates using low implantation doses |
Jun. 6, 2006 |
| 7052974 |
Bonded wafer and method of producing bonded wafer |
May. 30, 2006 |
| 7049250 |
Heat treatment for edges of multilayer semiconductor wafers |
May. 23, 2006 |
| 7048867 |
Method of increasing the area of a useful layer of material transferred onto a support |
May. 23, 2006 |
| 7045874 |
Micromechanical strained semiconductor by wafer bonding |
May. 16, 2006 |
| 7033905 |
Recycling of a wafer comprising a buffer layer after having separated a thin layer therefrom by mechanical means |
Apr. 25, 2006 |
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