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Class Information
Number: 257/E21.567
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo) > Making of isolation regions between components (epo) > Dielectric regions, e.g., epic dielectric isolation, locos; trench refilling techniques, soi technology, use of channel stoppers (epo) > Using semiconductor or insulator technology, i.e., soi technology (epo) > Using bonding technique (epo)
Description: This subclass is indented under subclass E21.561. This subclass is substantially the same in scope as ECLA classification H01L21/762D8.

Sub-classes under this class:

Class Number Class Name Patents
257/E21.569 Using silicon etch back technique, e.g., besoi, eltran (epo) 138
257/E21.568 With separation/delamination along ion implanted layer, e.g., "smart-cut", "unibond" (epo) 543
257/E21.57 With separation/delamination along porous layer (epo) 215

Patents under this class:
1 2 3 4 5 6 7 8 9 10 11

Patent Number Title Of Patent Date Issued
8709911 Method for producing SOI substrate and SOI substrate Apr. 29, 2014
8709912 Semiconductor device manufacturing method and device for same Apr. 29, 2014
8685837 Transfer method, method for manufacturing semiconductor device, and semiconductor device Apr. 1, 2014
8673740 Method for formation of an electrically conducting through via Mar. 18, 2014
8669633 Packaged device with an image sensor aligned to a faceplate using fiducial marks and connection bodies registered thereto Mar. 11, 2014
8664081 Method for fabricating 3D integrated circuit device using interface wafer as permanent carrier Mar. 4, 2014
8637381 High-k dielectric and silicon nitride box region Jan. 28, 2014
8633089 Die bonding method utilizing rotary wafer table Jan. 21, 2014
8633570 Method for manufacturing SOI substrate and SOI substrate Jan. 21, 2014
8603896 Method for transferring a monocrystalline semiconductor layer onto a support substrate Dec. 10, 2013
8603897 Method for manufacturing bonded wafer Dec. 10, 2013
8592291 Fabrication of large-area hexagonal boron nitride thin films Nov. 26, 2013
8575005 Method of manufacturing an electronic device having a plastic substrate and corresponding carrier Nov. 5, 2013
8546244 Method of manufacturing semiconductor device Oct. 1, 2013
8546188 Bow-balanced 3D chip stacking Oct. 1, 2013
8530333 Semiconductor device and manufacturing method thereof Sep. 10, 2013
8530336 Method for manufacturing semiconductor substrate Sep. 10, 2013
8513090 Method for manufacturing semiconductor substrate, and semiconductor device Aug. 20, 2013
8501537 Methods for bonding semiconductor structures involving annealing processes, and bonded semiconductor structures formed using such methods Aug. 6, 2013
8497185 Method of manufacturing semiconductor wafer, and composite base and composite substrate for use in that method Jul. 30, 2013
8476146 Reducing wafer distortion through a low CTE layer Jul. 2, 2013
8470648 Method for manufacturing semiconductor device Jun. 25, 2013
8445360 Method for manufacturing semiconductor device May. 21, 2013
8440546 Methods and devices for fabricating and assembling printable semiconductor elements May. 14, 2013
8432021 Manufacturing method of SOI substrate Apr. 30, 2013
8421076 Insulating substrate for semiconductor apparatus, semiconductor apparatus, and method for manufacturing semiconductor apparatus Apr. 16, 2013
8415208 Semiconductor device and peeling off method and method of manufacturing semiconductor device Apr. 9, 2013
8399336 Method for fabricating a 3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer Mar. 19, 2013
8383452 Semiconductor device and method for manufacturing the same Feb. 26, 2013
8367440 Semiconductor device and peeling off method and method of manufacturing semiconductor device Feb. 5, 2013
8357586 Method for manufacturing SOI wafer Jan. 22, 2013
8349703 Method of bonding two substrates Jan. 8, 2013
8338268 Transfer method for thin film nanomembrane structures Dec. 25, 2012
8324075 Methods for recycling substrates and fabricating laminated wafers Dec. 4, 2012
8324013 Method of fabricating organic light emitting diode display device Dec. 4, 2012
8309429 Method for manufacturing semiconductor substrate and semiconductor device Nov. 13, 2012
8309970 Vertical structure LED device and method of manufacturing the same Nov. 13, 2012
8298916 Process for fabricating a multilayer structure with post-grinding trimming Oct. 30, 2012
8247307 Manufacturing method of substrate provided with semiconductor films Aug. 21, 2012
8241932 Methods of fabricating light emitting diode packages Aug. 14, 2012
8237252 Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation Aug. 7, 2012
8211780 Method for manufacturing SOI substrate Jul. 3, 2012
8212338 Manufacturing method of semiconductor device and semiconductor device produced therewith Jul. 3, 2012
8207046 Method for producing semiconductor device and semiconductor device produced by same method Jun. 26, 2012
8173519 Method for manufacturing semiconductor device May. 8, 2012
8173518 Method of wafer bonding May. 8, 2012
8173496 Method for manufacturing semiconductor device May. 8, 2012
8138063 Manufacturing method of a semiconductor device including a single crystal semiconductor film, and a semiconductor film including impurity Mar. 20, 2012
8110478 Method for manufacturing semiconductor substrate, display panel, and display device Feb. 7, 2012
8105852 Method of forming a composite substrate and growing a III-V light emitting device over the composite substrate Jan. 31, 2012

1 2 3 4 5 6 7 8 9 10 11

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