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Class Information
Number: 257/E21.548
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo) > Making of isolation regions between components (epo) > Dielectric regions, e.g., epic dielectric isolation, locos; trench refilling techniques, soi technology, use of channel stoppers (epo) > Using trench refilling with dielectric materials (epo) > Concurrent filling of plurality of trenches having different trench shape or dimension, e.g., rectangular and v-shaped trenches, wide and narrow trenches, shallow and deep trenches (epo)
Description: This subclass is indented under subclass E21.546. This subclass is substantially the same in scope as ECLA classification H01L21/762C4.


Patents under this class:
1 2 3 4 5 6 7 8 9 10 11 12 13

Patent Number Title Of Patent Date Issued
7622369 Device isolation technology on semiconductor substrate Nov. 24, 2009
7622360 Shallow trench isolation region in semiconductor device and method of manufacture Nov. 24, 2009
7618876 Semiconductor device and method of manufacturing the same by filling a trench which includes an additional coating step Nov. 17, 2009
7615493 Method for forming alignment mark Nov. 10, 2009
7598575 Semiconductor die with reduced RF attenuation Oct. 6, 2009
7575968 Inverse slope isolation and dual surface orientation integration Aug. 18, 2009
7563720 Boron doped shell for MEMS device Jul. 21, 2009
7550361 Trench structure and method for co-alignment of mixed optical and electron beam lithographic fabrication levels Jun. 23, 2009
7541298 STI of a semiconductor device and fabrication method thereof Jun. 2, 2009
7538009 Method for fabricating STI gap fill oxide layer in semiconductor devices May. 26, 2009
7521333 Methods of fabricating trench isolation structures having varying depth Apr. 21, 2009
7507663 Fabrication of semiconductor devices Mar. 24, 2009
7501322 Methods of forming non-volatile memory devices having trenches Mar. 10, 2009
7501326 Method for forming isolation layer of semiconductor device Mar. 10, 2009
7456067 Method with high gapfill capability for semiconductor devices Nov. 25, 2008
7456102 Electroless copper fill process Nov. 25, 2008
7439604 Method of forming dual gate dielectric layer Oct. 21, 2008
7420259 Semiconductor device having two-layered charge storage electrode Sep. 2, 2008
7416942 Method for manufacturing semiconductor device Aug. 26, 2008
7407875 Low resistance contact structure and fabrication thereof Aug. 5, 2008
7407897 Capacitor of analog semiconductor device having multi-layer dielectric film and method of manufacturing the same Aug. 5, 2008
7405461 Semiconductor device and method for manufacturing semiconductor device Jul. 29, 2008
7402499 Semiconductor device and method of manufacturing the same Jul. 22, 2008
7393789 Protective coating for planarization Jul. 1, 2008
7393750 Method for manufacturing a semiconductor device Jul. 1, 2008
7393737 Semiconductor device and a method of manufacturing the same Jul. 1, 2008
7390717 Trench power MOSFET fabrication using inside/outside spacers Jun. 24, 2008
7387940 Methods of forming trench isolation in the fabrication of integrated circuitry, methods of fabricating memory circuitry, integrated circuitry and memory integrated circuitry Jun. 17, 2008
7384825 Methods of fabricating phase change memory elements having a confined portion of phase change material on a recessed contact Jun. 10, 2008
7381612 Method for manufacturing semiconductor device with recess channels and asymmetrical junctions Jun. 3, 2008
7375004 Method of making an isolation trench and resulting isolation trench May. 20, 2008
7368800 Methods of forming trench isolation in the fabrication of integrated circuitry, methods of fabricating memory circuitry, integrated circuitry and memory integrated circuitry May. 6, 2008
7368366 Methods of forming trench isolation in the fabrication of integrated circuitry, methods of fabricating memory circuitry, integrated circuitry and memory integrated circuitry May. 6, 2008
7364975 Semiconductor device fabrication methods Apr. 29, 2008
7364981 Methods of forming trench isolation in the fabrication of integrated circuitry, methods of fabricating memory circuitry, integrated circuitry and memory integrated circuitry Apr. 29, 2008
7361546 Method of forming conductive stud on vertical memory device Apr. 22, 2008
7358103 Method of fabricating an imaging device for collecting photons Apr. 15, 2008
7358566 Semiconductor device Apr. 15, 2008
7354818 Process for high voltage superjunction termination Apr. 8, 2008
7323379 Fabrication process for increased capacitance in an embedded DRAM memory Jan. 29, 2008
7314792 Method for fabricating transistor of semiconductor device Jan. 1, 2008
7309640 Method of fabricating an integrated circuit including hollow isolating trenches and corresponding integrated circuit Dec. 18, 2007
7294571 Concave pattern formation method and method for forming semiconductor device Nov. 13, 2007
7282400 Method and apparatus on (110) surfaces of silicon structures with conduction in the <110> direction Oct. 16, 2007
7276411 Trench semiconductor device having gate oxide layer with multiple thicknesses and processes of fabricating the same Oct. 2, 2007
7276426 Methods of forming semiconductor constructions Oct. 2, 2007
7274084 Enhanced PFET using shear stress Sep. 25, 2007
7271107 Reduction of feature critical dimensions using multiple masks Sep. 18, 2007
7271108 Multiple mask process with etch mask stack Sep. 18, 2007
7268057 Methods of filling openings with oxide, and methods of forming trenched isolation regions Sep. 11, 2007

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