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Class Information
Number: 257/E21.547
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo) > Making of isolation regions between components (epo) > Dielectric regions, e.g., epic dielectric isolation, locos; trench refilling techniques, soi technology, use of channel stoppers (epo) > Using trench refilling with dielectric materials (epo) > Dielectric material being obtained by full chemical transformation of nondielectric materials, such as polycrystalline silicon, metals (epo)
Description: This subclass is indented under subclass E21.546. This subclass is substantially the same in scope as ECLA classification H01L21/762C2.

Patents under this class:
1 2 3

Patent Number Title Of Patent Date Issued
8658508 Method for manufacturing SOI substrate Feb. 25, 2014
8647945 Method of forming substrate contact for semiconductor on insulator (SOI) substrate Feb. 11, 2014
8629030 Method for manufacturing SOI substrate Jan. 14, 2014
8603892 Method of manufacturing a semiconductor device Dec. 10, 2013
8586426 Method of forming isolation structures for SOI devices with ultrathin SOI and ultrathin box Nov. 19, 2013
8519403 Angled implantation for deep submicron device optimization Aug. 27, 2013
8486839 Methods and apparatus to improve reliability of isolated vias Jul. 16, 2013
8421137 Magnetic random access memory Apr. 16, 2013
8314005 Homogeneous porous low dielectric constant materials Nov. 20, 2012
8227853 Semiconductor integrated circuit devices having conductive patterns that are electrically connected to junction regions Jul. 24, 2012
8154102 Semiconductor device and manufacturing method thereof Apr. 10, 2012
8143134 Method for manufacturing SOI substrate Mar. 27, 2012
8115254 Semiconductor-on-insulator structures including a trench containing an insulator stressor plug and method of fabricating same Feb. 14, 2012
8080463 Semiconductor device manufacturing method and silicon oxide film forming method Dec. 20, 2011
8062954 Method for manufacturing a field plate in a trench of a power transistor Nov. 22, 2011
8058139 Manufacturing method for semiconductor devices Nov. 15, 2011
7968423 Method for forming isolation layer and method for fabricating nonvolatile memory device using the same Jun. 28, 2011
7968960 Methods of forming strained semiconductor channels Jun. 28, 2011
7847339 Semiconductor integrated circuit devices having conductive patterns that are electrically connected to junction regions Dec. 7, 2010
7807573 Laser assisted chemical vapor deposition for backside die marking and structures formed thereby Oct. 5, 2010
7800203 Method of reducing the surface roughness of spin coated polymer films Sep. 21, 2010
7790632 Methods of forming a phosphorus doped silicon dioxide-comprising layer Sep. 7, 2010
7776623 System and method to fabricate magnetic random access memory Aug. 17, 2010
7745349 Method for fabricating semiconductor transistor Jun. 29, 2010
7723185 Flash memory with recessed floating gate May. 25, 2010
7632736 Self-aligned contact formation utilizing sacrificial polysilicon Dec. 15, 2009
7625805 Passivation of deep isolating separating trenches with sunk covering layers Dec. 1, 2009
7550354 Nanoelectromechanical transistors and methods of forming same Jun. 23, 2009
7538009 Method for fabricating STI gap fill oxide layer in semiconductor devices May. 26, 2009
7521331 High dielectric film and related method of manufacture Apr. 21, 2009
7518214 Semiconductor device and method of fabricating the same Apr. 14, 2009
7485544 Strained semiconductor, devices and systems and methods of formation Feb. 3, 2009
7435684 Resolving of fluorine loading effect in the vacuum chamber Oct. 14, 2008
7425761 Method of manufacturing a dielectric film in a capacitor Sep. 16, 2008
7371655 Method of fabricating low-power CMOS device May. 13, 2008
7339252 Semiconductor having thick dielectric regions Mar. 4, 2008
7307343 Low dielectric materials and methods for making same Dec. 11, 2007
7238586 Seamless trench fill method utilizing sub-atmospheric pressure chemical vapor deposition technique Jul. 3, 2007
7238588 Silicon buffered shallow trench isolation Jul. 3, 2007
7211525 Hydrogen treatment enhanced gap fill May. 1, 2007
7205206 Method of fabricating mobility enhanced CMOS devices Apr. 17, 2007
7199020 Nitridation of STI liner oxide for modulating inverse width effects in semiconductor devices Apr. 3, 2007
7144803 Methods of forming boron carbo-nitride layers for integrated circuit devices Dec. 5, 2006
7056827 Methods of filling trenches using high-density plasma deposition (HDP) Jun. 6, 2006
7049206 Device isolation for semiconductor devices May. 23, 2006
7045437 Method for fabricating shallow trenches May. 16, 2006
7023069 Method for forming thick dielectric regions using etched trenches Apr. 4, 2006
6958112 Methods and systems for high-aspect-ratio gapfill using atomic-oxygen generation Oct. 25, 2005
6855616 Methods for manufacturing semiconductor devices Feb. 15, 2005
6815299 Method for manufacturing silicon carbide device using water rich anneal Nov. 9, 2004

1 2 3

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