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Browse by Category: Main > Physics
Class Information
Number: 257/E21.538
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo) > Making of localized buried regions, e.g., buried collector layer, internal connection, substrate contacts (epo) > Making of internal connections, substrate contacts (epo)
Description: This subclass is indented under subclass E21.537. This subclass is substantially the same in scope as ECLA classification H01L21/74B.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8674517 Method of assembling two integrated circuits and corresponding structure Mar. 18, 2014
8647945 Method of forming substrate contact for semiconductor on insulator (SOI) substrate Feb. 11, 2014
8637335 Photonic modulator with a semiconductor contact Jan. 28, 2014
8530351 Semiconductor package and fabrication method Sep. 10, 2013
8518823 Through silicon via and method of forming the same Aug. 27, 2013
8435876 Method of manufacturing semiconductor device May. 7, 2013
8394697 Methods of forming capacitors for semiconductor memory devices Mar. 12, 2013
8319264 Semiconductor device and method for manufacturing the same Nov. 27, 2012
8304862 Semiconductor package and manufacturing method of the same Nov. 6, 2012
8268715 Multi-component integrated circuit contacts Sep. 18, 2012
8247291 Methods of forming fine patterns in integrated circuit devices and methods of manufacturing integrated circuit devices including the same Aug. 21, 2012
8198140 Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package Jun. 12, 2012
8193093 Thru silicon enabled die stacking scheme Jun. 5, 2012
8187920 Integrated circuit micro-module May. 29, 2012
8183098 SOI device with contact trenches formed during epitaxial growing May. 22, 2012
8169054 Semiconductor device and method of manufacturing the same May. 1, 2012
8106515 Local metallization and use thereof in semiconductor devices Jan. 31, 2012
8018070 Semiconductor device, method for manufacturing semiconductor devices and mask systems used in the manufacturing of semiconductor devices Sep. 13, 2011
7901981 Integrated circuit micro-module Mar. 8, 2011
7842544 Integrated circuit micro-module Nov. 30, 2010
7838962 Semiconductor device having capacitor, transistor and diffusion resistor and manufacturing method thereof Nov. 23, 2010
7816763 BJT and method for fabricating the same Oct. 19, 2010
7807570 Local metallization and use thereof in semiconductor devices Oct. 5, 2010
7790617 Formation of metal silicide layer over copper interconnect for reliability enhancement Sep. 7, 2010
7786547 Formation of active area using semiconductor growth process without STI integration Aug. 31, 2010
7786587 Semiconductor device and method for manufacturing thereof Aug. 31, 2010
7666755 Method of forming device isolation film of semiconductor device Feb. 23, 2010
7656020 Packaging conductive structure for a semiconductor substrate having a metallic layer Feb. 2, 2010
7642188 Mixed signal integrated circuit with improved isolation Jan. 5, 2010
7635896 SOI device with contact trenches formed during epitaxial growing Dec. 22, 2009
7615480 Methods of post-contact back end of the line through-hole via integration Nov. 10, 2009
7601624 Device comprising an ohmic via contact, and method of fabricating thereof Oct. 13, 2009
7576002 Multi-step barrier deposition method Aug. 18, 2009
7439580 Top drain MOSgated device and process of manufacture therefor Oct. 21, 2008
7413981 Pitch doubled circuit layout Aug. 19, 2008
7410892 Methods of fabricating integrated circuit devices having self-aligned contact structures Aug. 12, 2008
7375019 Image sensor and method for fabricating the same May. 20, 2008
7348263 Manufacturing method for electronic component, electronic component, and electronic equipment Mar. 25, 2008
7332401 Method of fabricating an electrode structure for use in an integrated circuit Feb. 19, 2008
7323389 Method of forming a FINFET structure Jan. 29, 2008
7202155 Method for manufacturing wiring and method for manufacturing semiconductor device Apr. 10, 2007
7122463 Manufacturing method of semiconductor device Oct. 17, 2006
7074678 Method for fabricating a buried bit line for a semiconductor memory Jul. 11, 2006
7049169 Method of fabricating a semiconductor device May. 23, 2006
7037804 Wafer bonding using a flexible bladder press for three dimensional (3D) vertical stack integration May. 2, 2006
6995049 Method for forming semiconductor device Feb. 7, 2006
6987052 Method for making enhanced substrate contact for a semiconductor device Jan. 17, 2006
6979868 Bypass circuits for reducing plasma damage Dec. 27, 2005
6974751 Semiconductor device and method for producing the same Dec. 13, 2005
6975016 Wafer bonding using a flexible bladder press and thinned wafers for three-dimensional (3D) wafer-to-wafer vertical stack integration, and application thereof Dec. 13, 2005

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