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Class Information
Number: 257/E21.536
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Manufacture of specific parts of devices (epo)
Description: This subclass is indented under subclass E21.532. This subclass is substantially the same in scope as ECLA classification H01L21/71.

Sub-classes under this class:

Class Number Class Name Patents
257/E21.575 Interconnections, comprising conductors and dielectrics, for carrying current between separate components within device (epo) 875
257/E21.54 Making of isolation regions between components (epo) 286
257/E21.537 Making of localized buried regions, e.g., buried collector layer, internal connection, substrate contacts (epo) 347

Patents under this class:
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Patent Number Title Of Patent Date Issued
8691658 Orientation of an electronic CMOS structure with respect to a buried structure in the case of a bonded and thinned-back stack of semiconductor wafers Apr. 8, 2014
8633051 Semiconductor device and method for manufacturing semiconductor device Jan. 21, 2014
8536683 System on a chip with on-chip RF shield Sep. 17, 2013
8525354 Bond pad structure and fabricating method thereof Sep. 3, 2013
8513800 Semiconductor device and method for manufacturing the same Aug. 20, 2013
8461021 Multiple seal ring structure Jun. 11, 2013
8435821 Sensor and method for fabricating the same May. 7, 2013
8390117 Semiconductor device and method of manufacturing the same Mar. 5, 2013
8357561 Method of fabricating backside illuminated image sensor Jan. 22, 2013
8349630 Methods for manufacturing thin film transistor array substrate and display panel Jan. 8, 2013
8338296 Method for forming a catalyst suitable for growth of carbon nanotubes Dec. 25, 2012
8338917 Multiple seal ring structure Dec. 25, 2012
8324714 Semiconductor device and method for making the same Dec. 4, 2012
8298919 Manufacturing method of semiconductor device and semiconductor device Oct. 30, 2012
8293549 Method of fabricating a pixel array substrate Oct. 23, 2012
8288211 Wafer level hermetic bond using metal alloy with keeper layer Oct. 16, 2012
8288269 Methods for avoiding parasitic capacitance in an integrated circuit package Oct. 16, 2012
8288841 Handle wafer having viewing windows Oct. 16, 2012
8278696 Semiconductor device and method of manufacturing the same Oct. 2, 2012
8264064 Semiconductor device Sep. 11, 2012
8242603 Chip identification using top metal layer Aug. 14, 2012
8236592 Method of forming semiconductor device Aug. 7, 2012
8236690 Method for fabricating semiconductor package substrate having different thicknesses between wire bonding pad and ball pad Aug. 7, 2012
8187920 Integrated circuit micro-module May. 29, 2012
8183700 Semiconductor device having alignment mark and its manufacturing method May. 22, 2012
8178429 Nanofabrication using dip pen nanolithography and metal oxide chemical vapor deposition May. 15, 2012
8169059 On-chip RF shields with through substrate conductors May. 1, 2012
8163656 Process for adjusting the size and shape of nanostructures Apr. 24, 2012
8163657 Process for adjusting the size and shape of nanostructures Apr. 24, 2012
8148189 Formed ceramic receiver element adhered to a semiconductor lamina Apr. 3, 2012
8148275 Method for forming dielectric films Apr. 3, 2012
8139173 Liquid crystal display Mar. 20, 2012
8110478 Method for manufacturing semiconductor substrate, display panel, and display device Feb. 7, 2012
8110923 Semiconductor device and method of manufacturing the same Feb. 7, 2012
8084310 Self-aligned multi-patterning for advanced critical dimension contacts Dec. 27, 2011
8071403 Method of manufacturing liquid crystal display device Dec. 6, 2011
8048795 Self-assembly pattern for semiconductor integrated circuit Nov. 1, 2011
8017947 Thin film transistor array panel, display device including the same, and method thereof Sep. 13, 2011
7968474 Methods for nanowire alignment and deposition Jun. 28, 2011
7964933 Integrated circuit including power diode Jun. 21, 2011
7960208 Wafer level hermetic bond using metal alloy with raised feature Jun. 14, 2011
7919860 Semiconductor device having wafer level chip scale packaging substrate decoupling Apr. 5, 2011
7901981 Integrated circuit micro-module Mar. 8, 2011
7902661 Integrated circuit micro-module Mar. 8, 2011
7898068 Integrated circuit micro-module Mar. 1, 2011
7879686 Semiconductor device and method for manufacturing Feb. 1, 2011
7851239 Low temperature amorphous silicon sacrificial layer for controlled adhesion in MEMS devices Dec. 14, 2010
7852453 IPS mode liquid crystal display device and method for fabricating thereof Dec. 14, 2010
7842544 Integrated circuit micro-module Nov. 30, 2010
7843045 Thermoplastic resin composition for semiconductor, adhesion film, lead frame, and semiconductor device using the same, and method of producing semiconductor device Nov. 30, 2010

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