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Class Information
Number: 257/E21.534
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of devices consisting of plurality of solid-state components formed in or on common substrate or of parts thereof; manufacture of integrated circuit devices or of parts thereof (epo) > Of thick- or thin-film circuits or parts thereof (epo) > Of thick-film circuits or parts thereof (epo)
Description: This subclass is indented under subclass E21.533. This subclass is substantially the same in scope as ECLA classification H01L21/70B2.

Patents under this class:

Patent Number Title Of Patent Date Issued
8102005 Wiring substrate, semiconductor device and manufacturing method thereof Jan. 24, 2012
7494923 Manufacturing method of wiring substrate and semiconductor device Feb. 24, 2009
6113836 Method of forming thick film pattern and material for forming thick film pattern Sep. 5, 2000
5593722 Method of producing thick multi-layer substrates Jan. 14, 1997
5580511 Method of forming thick film pattern and material for forming thick film pattern Dec. 3, 1996
5302412 Single atmosphere for firing compatible thick film material Apr. 12, 1994
5239685 Process for fabricating a MMIC hybrid device and a transceiver fabricated thereby Aug. 24, 1993
5206624 Intermediate product for use in the production of thick-film circuits Apr. 27, 1993
5157582 Composite electronic part Oct. 20, 1992
5116641 Method for laser scribing substrates May. 26, 1992
5041191 Diffusion barrier for thin film hybrid circuits Aug. 20, 1991
4991284 Method for manufacturing thick film circuit board device Feb. 12, 1991
4965092 Process for the manufacture of copper thick-film conductors using an infrared furnace Oct. 23, 1990
4914829 Image alignment indicators Apr. 10, 1990
4841275 Thick-film integrated circuit device capable of being manufactured by means of easy-to-perform trimming operation Jun. 20, 1989
4792779 Trimming passive components buried in multilayer structures Dec. 20, 1988
4783642 Hybrid integrated circuit substrate and method of manufacturing the same Nov. 8, 1988
4766671 Method of manufacturing ceramic electronic device Aug. 30, 1988
4756756 Forming of thick-layer, hybrid electronic printed circuits Jul. 12, 1988
4743465 Method and apparatus for drawing thick film circuit May. 10, 1988
4732798 Multilayer ceramic substrate and method of making the same Mar. 22, 1988
4730095 Method of producing planar electrical circuits Mar. 8, 1988
4685203 Hybrid integrated circuit substrate and method of manufacturing the same Aug. 11, 1987
4664945 Method of forming thick film circuits May. 12, 1987
4656048 Method of forming thick film circuit patterns with a sufficiently wide and uniformly thick strip Apr. 7, 1987
4632845 Process for the fabrication of thermal printing boards in multilayer thick-film technology Dec. 30, 1986
4622240 Process for manufacturing thick-film electrical components Nov. 11, 1986
4619836 Method of fabricating thick film electrical components Oct. 28, 1986
4613560 Photosensitive ceramic coating composition Sep. 23, 1986
4522671 Method of applying an electrical conductor pattern on an apertured substrate Jun. 11, 1985
4517448 Infrared furnace with atmosphere control capability May. 14, 1985
4517227 Forming of thick-layer, hybrid electronic printed circuits May. 14, 1985
4508754 Method of adding fine line conductive/resistive patterns to a thick film microcircuit Apr. 2, 1985
4508753 Method of producing fine line conductive/resistive patterns on an insulating coating Apr. 2, 1985
4503090 Thick film resistor circuits Mar. 5, 1985
4464420 Ceramic multilayer circuit board and a process for manufacturing the same Aug. 7, 1984
4392013 Fine-patterned thick film conductor structure and manufacturing method thereof Jul. 5, 1983
4373019 Thick film fine pattern forming method Feb. 8, 1983
4332624 Method of cleaning a fired thick film copper layer Jun. 1, 1982
4303480 Electroplating of thick film circuitry Dec. 1, 1981
4230754 Bonding electronic component to molded package Oct. 28, 1980
4140817 Thick film resistor circuits Feb. 20, 1979
4133910 Thick film deposition of microelectronic circuit Jan. 9, 1979
4119480 Method of manufacturing thick-film circuit devices Oct. 10, 1978
4084314 Producing thick film circuits having terminal elements Apr. 18, 1978
4033831 Method of making a bi-metal screen for thick film fabrication Jul. 5, 1977
3982941 Photopolymerizable paste compositions and their use Sep. 28, 1976
3950597 Powder compositions of polynary oxides and copper Apr. 13, 1976

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