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Browse by Category: Main > Physics
Class Information
Number: 257/E21.526
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Testing or measuring during manufacture or treatment or reliability measurement, i.e., testing of parts followed by no processing which modifies parts as such (epo) > Procedures, i.e., sequence of activities consisting of plurality of measurement and correction, marking or sorting steps (epo) > Connection or disconnection of subentities or redundant parts of device in response to measurement, e.g., wafer scale, memory devices (epo)
Description: This subclass is indented under subclass E21.525. This subclass is substantially the same in scope as ECLA classification H01L21/66P2.










Patents under this class:
1 2 3 4

Patent Number Title Of Patent Date Issued
8704226 Three-dimensional integrated circuit having redundant relief structure for chip bonding section Apr. 22, 2014
8686559 Semiconductor chip stacking for redundancy and yield improvement Apr. 1, 2014
8564023 Integrated circuit with MOSFET fuse element Oct. 22, 2013
8513034 Method of manufacturing layered chip package Aug. 20, 2013
8507297 Packaging and testing of multiple MEMS devices on a wafer Aug. 13, 2013
8350393 Apparatus and method for predetermined component placement to a target platform Jan. 8, 2013
8288174 Electrostatic post exposure bake apparatus and method Oct. 16, 2012
8216933 Krypton sputtering of low resistivity tungsten Jul. 10, 2012
8198627 Semiconductor device with test pads and pad connection unit Jun. 12, 2012
8193006 Method of chip repair by stacking a plurality of bad dies Jun. 5, 2012
8187924 Method, design program and design support device for semiconductor integrated circuit, and semiconductor integrated circuit May. 29, 2012
8124429 Reprogrammable circuit board with alignment-insensitive support for multiple component contact types Feb. 28, 2012
8093103 Multiple chip module and package stacking method for storage devices Jan. 10, 2012
8034639 Method for manufacturing solar cell module Oct. 11, 2011
8026523 Nitride semiconductor free-standing substrate and device using the same Sep. 27, 2011
7977159 Memory chip and semiconductor device using the memory chip and manufacturing method of those Jul. 12, 2011
7947514 Semiconductor device production process May. 24, 2011
7932105 Systems and methods for detecting and monitoring nickel-silicide process and induced failures Apr. 26, 2011
7892962 Nail-shaped pillar for wafer-level chip-scale packaging Feb. 22, 2011
7856804 MEMS process and device Dec. 28, 2010
7851898 Multichip package or system-in package Dec. 14, 2010
7842953 Pixel structure and repairing method thereof Nov. 30, 2010
7834350 Semiconductor device with test pads and pad connection unit Nov. 16, 2010
7795045 Trench depth monitor for semiconductor manufacturing Sep. 14, 2010
7785906 Method to detect poly residues in LOCOS process Aug. 31, 2010
7779311 Testing and recovery in a multilayer device Aug. 17, 2010
7754532 High density chip packages, methods of forming, and systems including same Jul. 13, 2010
7749779 Landing pad for use as a contact to a conductive spacer Jul. 6, 2010
7719114 Edit structure that allows the input of a logic gate to be changed by modifying any one of the metal or via masks used to form the metal interconnect structure May. 18, 2010
7579268 Method of manufacturing an integrated circuit Aug. 25, 2009
7547560 Defect identification system and method for repairing killer defects in semiconductor devices Jun. 16, 2009
7541279 Method for manufacturing semiconductor device Jun. 2, 2009
7407822 Method for inspecting insulating film for film carrier tape for mounting electronic components thereon, inspection apparatus for inspecting the insulating film, punching apparatus for punching Aug. 5, 2008
7378288 Systems and methods for producing light emitting diode array May. 27, 2008
7352001 Method of editing a semiconductor die Apr. 1, 2008
7326595 Semiconductor integrated circuit and method of redesigning same Feb. 5, 2008
7271047 Test structure and method for measuring the resistance of line-end vias Sep. 18, 2007
7166915 Multi-chip module system Jan. 23, 2007
7148074 Method and apparatus for using a capacitor array to measure alignment between system components Dec. 12, 2006
7109046 Surface oxide tabulation and photo process control and cost savings Sep. 19, 2006
7101722 In-line voltage contrast determination of tunnel oxide weakness in integrated circuit technology development Sep. 5, 2006
7098051 Structure and method of direct chip attach Aug. 29, 2006
7064445 Wafer level testing and bumping process Jun. 20, 2006
7034560 Device and method for testing integrated circuit dice in an integrated circuit module Apr. 25, 2006
7010766 Parallel design processes for integrated circuits Mar. 7, 2006
6999332 Semiconductor package with a controlled impedance bus and method of forming same Feb. 14, 2006
6972487 Multi chip package structure having a plurality of semiconductor chips mounted in the same package Dec. 6, 2005
6968484 Method for parametrizing an integrated circuit and an integrated circuit therefor Nov. 22, 2005
6946327 Semiconductor device and manufacturing method of that Sep. 20, 2005
6911837 Method and apparatus for evaluating and adjusting microwave integrated circuit Jun. 28, 2005

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