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Class Information
Number: 257/E21.525
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Testing or measuring during manufacture or treatment or reliability measurement, i.e., testing of parts followed by no processing which modifies parts as such (epo) > Procedures, i.e., sequence of activities consisting of plurality of measurement and correction, marking or sorting steps (epo)
Description: This subclass is indented under subclass E21.521. This subclass is substantially the same in scope as ECLA classification H01L21/66P.










Sub-classes under this class:

Class Number Class Name Patents
257/E21.528 Acting in response to ongoing measurement without interruption of processing, e.g., endpoint detection, in-situ thickness measurement (epo) 395
257/E21.526 Connection or disconnection of subentities or redundant parts of device in response to measurement, e.g., wafer scale, memory devices (epo) 199
257/E21.527 Optical enhancement of defects or not directly visible states, e.g., selective electrolytic deposition, bubbles in liquids, light emission, color change (epo) 136


Patents under this class:

Patent Number Title Of Patent Date Issued
8710859 Method for testing multi-chip stacked packages Apr. 29, 2014
8647466 Combinatorial evaluation of dry semiconductor processes Feb. 11, 2014
8592107 Method and apparatus of providing overlay Nov. 26, 2013
8558396 Bond pad configurations for semiconductor dies Oct. 15, 2013
8524521 Method for making wafer level image module Sep. 3, 2013
8513821 Overlay mark assistant feature Aug. 20, 2013
8492175 System and method for aligning surface mount devices on a substrate Jul. 23, 2013
8492174 Etch tool process indicator method and apparatus Jul. 23, 2013
8481341 Epitaxial film growth in retrograde wells for semiconductor devices Jul. 9, 2013
8470691 Method for cutting substrate and method for manufacturing electronic element Jun. 25, 2013
8440474 Chip quality determination method and marking mechanism using same May. 14, 2013
8420498 Alignment method of chips Apr. 16, 2013
8420422 Pattern forming method, processing method, and processing apparatus Apr. 16, 2013
8420410 Techniques providing fiducial markers for failure analysis Apr. 16, 2013
8372663 Good chip classifying method on wafer, and chip quality judging method, marking mechanism, and manufacturing method of semiconductor device using the good chip classifying method Feb. 12, 2013
8350393 Apparatus and method for predetermined component placement to a target platform Jan. 8, 2013
8343805 Mems device and fabrication method Jan. 1, 2013
8334150 Wafer level laser marking system for ultra-thin wafers using support tape Dec. 18, 2012
8329360 Method and apparatus of providing overlay Dec. 11, 2012
8324725 Stacked die module Dec. 4, 2012
8304264 Apparatus and method for monitoring chamber status in semiconductor fabrication process Nov. 6, 2012
8288174 Electrostatic post exposure bake apparatus and method Oct. 16, 2012
8268696 Alignment mark for opaque layer Sep. 18, 2012
RE43652 Substrate processing control method and storage medium Sep. 11, 2012
8264092 Integrated circuits on a wafer and method of producing integrated circuits Sep. 11, 2012
8257985 MEMS device and fabrication method Sep. 4, 2012
8211717 SEM repair for sub-optimal features Jul. 3, 2012
8207532 Constant and reducible hole bottom CD in variable post-CMP thickness and after-development-inspection CD Jun. 26, 2012
8193006 Method of chip repair by stacking a plurality of bad dies Jun. 5, 2012
8183123 Method of forming mark in IC-fabricating process May. 22, 2012
8183062 Creating metal gate structures using Lithography-Etch-Lithography-Etch (LELE) processing sequences May. 22, 2012
8178876 Method and configuration for connecting test structures or line arrays for monitoring integrated circuit manufacturing May. 15, 2012
8163573 Method for manufacturing nitride semiconductor element Apr. 24, 2012
8148175 Manufacturing apparatus for semiconductor device and manufacturing method for semiconductor device Apr. 3, 2012
8127713 Multi-channel developer system Mar. 6, 2012
8114685 Method of manufacturing material to be etched Feb. 14, 2012
8097474 Integrated circuit chip design flow methodology including insertion of on-chip or scribe line wireless process monitoring and feedback circuitry Jan. 17, 2012
8043927 Method of manufacturing a CMOS image sensor Oct. 25, 2011
8026113 Method of monitoring a semiconductor processing system using a wireless sensor network Sep. 27, 2011
7998826 Method of forming mark in IC-fabricating process Aug. 16, 2011
7993936 System and method for controlling an electrochemical etch process Aug. 9, 2011
7981762 Method of forming pre-metal dielectric layer of semiconductor device Jul. 19, 2011
7979154 Method and system for managing semiconductor manufacturing device Jul. 12, 2011
7973419 Semiconductor device and method of fabricating the same Jul. 5, 2011
7972874 Semiconductor process evaluation methods including variable ion implanting conditions Jul. 5, 2011
RE42481 Semiconductor yield management system and method Jun. 21, 2011
7955946 Methods of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit, methods of positioning a semiconductor substrate comprising an integrated circuit, Jun. 7, 2011
7919845 Formation of a hybrid integrated circuit device Apr. 5, 2011
7865325 Test system and failure parsing method thereof Jan. 4, 2011
7858487 Method and apparatus for indicating directionality in integrated circuit manufacturing Dec. 28, 2010











 
 
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