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Class Information
Number: 257/E21.525
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Testing or measuring during manufacture or treatment or reliability measurement, i.e., testing of parts followed by no processing which modifies parts as such (epo) > Procedures, i.e., sequence of activities consisting of plurality of measurement and correction, marking or sorting steps (epo)
Description: This subclass is indented under subclass E21.521. This subclass is substantially the same in scope as ECLA classification H01L21/66P.
Sub-classes under this class:
| Class Number |
Class Name |
Patents |
| 257/E21.528 |
Acting in response to ongoing measurement without interruption of processing, e.g., endpoint detection, in-situ thickness measurement (epo) |
395 |
| 257/E21.526 |
Connection or disconnection of subentities or redundant parts of device in response to measurement, e.g., wafer scale, memory devices (epo) |
199 |
| 257/E21.527 |
Optical enhancement of defects or not directly visible states, e.g., selective electrolytic deposition, bubbles in liquids, light emission, color change (epo) |
136 |
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 8710859 |
Method for testing multi-chip stacked packages |
Apr. 29, 2014 |
| 8647466 |
Combinatorial evaluation of dry semiconductor processes |
Feb. 11, 2014 |
| 8592107 |
Method and apparatus of providing overlay |
Nov. 26, 2013 |
| 8558396 |
Bond pad configurations for semiconductor dies |
Oct. 15, 2013 |
| 8524521 |
Method for making wafer level image module |
Sep. 3, 2013 |
| 8513821 |
Overlay mark assistant feature |
Aug. 20, 2013 |
| 8492175 |
System and method for aligning surface mount devices on a substrate |
Jul. 23, 2013 |
| 8492174 |
Etch tool process indicator method and apparatus |
Jul. 23, 2013 |
| 8481341 |
Epitaxial film growth in retrograde wells for semiconductor devices |
Jul. 9, 2013 |
| 8470691 |
Method for cutting substrate and method for manufacturing electronic element |
Jun. 25, 2013 |
| 8440474 |
Chip quality determination method and marking mechanism using same |
May. 14, 2013 |
| 8420498 |
Alignment method of chips |
Apr. 16, 2013 |
| 8420422 |
Pattern forming method, processing method, and processing apparatus |
Apr. 16, 2013 |
| 8420410 |
Techniques providing fiducial markers for failure analysis |
Apr. 16, 2013 |
| 8372663 |
Good chip classifying method on wafer, and chip quality judging method, marking mechanism, and manufacturing method of semiconductor device using the good chip classifying method |
Feb. 12, 2013 |
| 8350393 |
Apparatus and method for predetermined component placement to a target platform |
Jan. 8, 2013 |
| 8343805 |
Mems device and fabrication method |
Jan. 1, 2013 |
| 8334150 |
Wafer level laser marking system for ultra-thin wafers using support tape |
Dec. 18, 2012 |
| 8329360 |
Method and apparatus of providing overlay |
Dec. 11, 2012 |
| 8324725 |
Stacked die module |
Dec. 4, 2012 |
| 8304264 |
Apparatus and method for monitoring chamber status in semiconductor fabrication process |
Nov. 6, 2012 |
| 8288174 |
Electrostatic post exposure bake apparatus and method |
Oct. 16, 2012 |
| 8268696 |
Alignment mark for opaque layer |
Sep. 18, 2012 |
| RE43652 |
Substrate processing control method and storage medium |
Sep. 11, 2012 |
| 8264092 |
Integrated circuits on a wafer and method of producing integrated circuits |
Sep. 11, 2012 |
| 8257985 |
MEMS device and fabrication method |
Sep. 4, 2012 |
| 8211717 |
SEM repair for sub-optimal features |
Jul. 3, 2012 |
| 8207532 |
Constant and reducible hole bottom CD in variable post-CMP thickness and after-development-inspection CD |
Jun. 26, 2012 |
| 8193006 |
Method of chip repair by stacking a plurality of bad dies |
Jun. 5, 2012 |
| 8183123 |
Method of forming mark in IC-fabricating process |
May. 22, 2012 |
| 8183062 |
Creating metal gate structures using Lithography-Etch-Lithography-Etch (LELE) processing sequences |
May. 22, 2012 |
| 8178876 |
Method and configuration for connecting test structures or line arrays for monitoring integrated circuit manufacturing |
May. 15, 2012 |
| 8163573 |
Method for manufacturing nitride semiconductor element |
Apr. 24, 2012 |
| 8148175 |
Manufacturing apparatus for semiconductor device and manufacturing method for semiconductor device |
Apr. 3, 2012 |
| 8127713 |
Multi-channel developer system |
Mar. 6, 2012 |
| 8114685 |
Method of manufacturing material to be etched |
Feb. 14, 2012 |
| 8097474 |
Integrated circuit chip design flow methodology including insertion of on-chip or scribe line wireless process monitoring and feedback circuitry |
Jan. 17, 2012 |
| 8043927 |
Method of manufacturing a CMOS image sensor |
Oct. 25, 2011 |
| 8026113 |
Method of monitoring a semiconductor processing system using a wireless sensor network |
Sep. 27, 2011 |
| 7998826 |
Method of forming mark in IC-fabricating process |
Aug. 16, 2011 |
| 7993936 |
System and method for controlling an electrochemical etch process |
Aug. 9, 2011 |
| 7981762 |
Method of forming pre-metal dielectric layer of semiconductor device |
Jul. 19, 2011 |
| 7979154 |
Method and system for managing semiconductor manufacturing device |
Jul. 12, 2011 |
| 7973419 |
Semiconductor device and method of fabricating the same |
Jul. 5, 2011 |
| 7972874 |
Semiconductor process evaluation methods including variable ion implanting conditions |
Jul. 5, 2011 |
| RE42481 |
Semiconductor yield management system and method |
Jun. 21, 2011 |
| 7955946 |
Methods of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit, methods of positioning a semiconductor substrate comprising an integrated circuit, |
Jun. 7, 2011 |
| 7919845 |
Formation of a hybrid integrated circuit device |
Apr. 5, 2011 |
| 7865325 |
Test system and failure parsing method thereof |
Jan. 4, 2011 |
| 7858487 |
Method and apparatus for indicating directionality in integrated circuit manufacturing |
Dec. 28, 2010 |
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