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Browse by Category: Main > Physics
Class Information
Number: 257/E21.523
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Testing or measuring during manufacture or treatment or reliability measurement, i.e., testing of parts followed by no processing which modifies parts as such (epo) > Structural arrangement (epo) > Additional lead-in metallization on device, e.g., additional pads or lands, lines in scribe line, sacrificed conductors, sacrificed frames (epo)
Description: This subclass is indented under subclass E21.522. This subclass is substantially the same in scope as ECLA classification H01L21/66A2.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8648444 Wafer scribe line structure for improving IC reliability Feb. 11, 2014
8587037 Test structure to monitor the in-situ channel temperature of field effect transistors Nov. 19, 2013
8575018 Semiconductor device and method of forming bump structure with multi-layer UBM around bump formation area Nov. 5, 2013
8564100 Semiconductor device Oct. 22, 2013
8524594 Solid-state imaging device, method for manufacturing the same, and electronic apparatus Sep. 3, 2013
8513034 Method of manufacturing layered chip package Aug. 20, 2013
8507908 Probe and probe card Aug. 13, 2013
8440272 Method for forming post passivation Au layer with clean surface May. 14, 2013
8354734 Semiconductor device with crack prevention ring Jan. 15, 2013
8349709 Method of layout of pattern Jan. 8, 2013
8350393 Apparatus and method for predetermined component placement to a target platform Jan. 8, 2013
8334201 Semiconductor device and inspection method therefor Dec. 18, 2012
8334582 Protective seal ring for preventing die-saw induced stress Dec. 18, 2012
8330158 Generating an integrated circuit identifier Dec. 11, 2012
8309434 Method for manufacturing semiconductor device including semiconductor elements with electrode formed thereon Nov. 13, 2012
8309451 Semiconductor device and method of providing common voltage bus and wire bondable redistribution Nov. 13, 2012
8288843 Semiconductor light-emitting device and method for manufacturing same Oct. 16, 2012
8274165 Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same Sep. 25, 2012
8264090 Semiconductor device including offset bonding pad and inspection method therefor Sep. 11, 2012
8258587 Transistor performance with metal gate Sep. 4, 2012
8227292 Process for the production of a MWT silicon solar cell Jul. 24, 2012
8206997 Method of manufacturing a semiconductor integrated circuit device and a method of manufacturing a thin film probe sheet for using the same Jun. 26, 2012
8164091 Multi-purpose poly edge test structure Apr. 24, 2012
8110478 Method for manufacturing semiconductor substrate, display panel, and display device Feb. 7, 2012
8093097 Layer sequence and method of manufacturing a layer sequence Jan. 10, 2012
8084279 Method of manufacturing semiconductor device that uses both a normal photomask and a phase shift mask for defining interconnect patterns Dec. 27, 2011
8084343 Semiconductor device Dec. 27, 2011
8072076 Bond pad structures and integrated circuit chip having the same Dec. 6, 2011
8058105 Method of fabricating a packaging structure Nov. 15, 2011
8039277 Providing current control over wafer borne semiconductor devices using overlayer patterns Oct. 18, 2011
8035197 Electronic device and method for fabricating the same Oct. 11, 2011
7994613 Semiconductor device and method for manufacturing the same Aug. 9, 2011
7981727 Electronic device wafer level scale packages and fabrication methods thereof Jul. 19, 2011
7968974 Scribe seal connection Jun. 28, 2011
7960821 Dummy vias for damascene process Jun. 14, 2011
7955952 Crackstop structures and methods of making same Jun. 7, 2011
7952167 Scribe line layout design May. 31, 2011
7923835 Package, electronic device, substrate having a separation region and a wiring layers, and method for manufacturing Apr. 12, 2011
7915141 Deterministic generation of an integrated circuit identification number Mar. 29, 2011
7906836 Heat spreader structures in scribe lines Mar. 15, 2011
7901955 Method of constructing a stacked-die semiconductor structure Mar. 8, 2011
7888776 Capacitor-based method for determining and characterizing scribe seal integrity and integrity loss Feb. 15, 2011
7880273 Method of manufacturing semiconductor device from semiconductor wafer Feb. 1, 2011
7875539 Semiconductor device Jan. 25, 2011
7855436 Semiconductor wafer Dec. 21, 2010
7808117 Integrated circuit having pads and input/output (I/O) cells Oct. 5, 2010
7772686 Memory card fabricated using SiP/SMT hybrid technology Aug. 10, 2010
7757195 Methods and systems for implementing dummy fill for integrated circuits Jul. 13, 2010
7755084 Semiconductor wafer, semiconductor chip and method of manufacturing semiconductor chip Jul. 13, 2010
7749779 Landing pad for use as a contact to a conductive spacer Jul. 6, 2010

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