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Class Information
Number: 257/E21.522
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Testing or measuring during manufacture or treatment or reliability measurement, i.e., testing of parts followed by no processing which modifies parts as such (epo) > Structural arrangement (epo)
Description: This subclass is indented under subclass E21.521. This subclass is substantially the same in scope as ECLA classification H01L21/66A.

Sub-classes under this class:

Class Number Class Name Patents
257/E21.523 Additional lead-in metallization on device, e.g., additional pads or lands, lines in scribe line, sacrificed conductors, sacrificed frames (epo) 85
257/E21.524 Circuit for characterizing or monitoring manufacturing process, e.g., whole test die, wafer filled with test structures, onboard devices incorporated on each die, process/product control monitors or pcm, devices in scribe-line/kerf, drop-in devices (epo) 100

Patents under this class:
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Patent Number Title Of Patent Date Issued
8674355 Integrated circuit test units with integrated physical and electrical test regions Mar. 18, 2014
8647893 Method for post decomposition density balancing in integrated circuit layouts, related system and program product Feb. 11, 2014
8624381 Integrated antennas in wafer level package Jan. 7, 2014
8513034 Method of manufacturing layered chip package Aug. 20, 2013
8507908 Probe and probe card Aug. 13, 2013
8460967 Integrated antennas in wafer level package Jun. 11, 2013
8431458 Methods of forming a nonvolatile memory cell and methods of forming an array of nonvolatile memory cells Apr. 30, 2013
8357935 Electronic component having an authentication pattern Jan. 22, 2013
8350393 Apparatus and method for predetermined component placement to a target platform Jan. 8, 2013
8338828 Semiconductor package and method of testing same Dec. 25, 2012
8329529 Via contact structures and methods for integrated circuits Dec. 11, 2012
8319343 Routing under bond pad for the replacement of an interconnect layer Nov. 27, 2012
8293636 Conductive connection structure with stress reduction arrangement for a semiconductor device, and related fabrication method Oct. 23, 2012
8206997 Method of manufacturing a semiconductor integrated circuit device and a method of manufacturing a thin film probe sheet for using the same Jun. 26, 2012
8193006 Method of chip repair by stacking a plurality of bad dies Jun. 5, 2012
8174010 Unified test structure for stress migration tests May. 8, 2012
8158446 Semiconductor device and method of manufacturing the same Apr. 17, 2012
8159254 Crack sensors for semiconductor devices Apr. 17, 2012
8110905 Integrated circuit packaging system with leadframe interposer and method of manufacture thereof Feb. 7, 2012
8072076 Bond pad structures and integrated circuit chip having the same Dec. 6, 2011
8039277 Providing current control over wafer borne semiconductor devices using overlayer patterns Oct. 18, 2011
8030099 Method for determining time to failure of submicron metal interconnects Oct. 4, 2011
8026113 Method of monitoring a semiconductor processing system using a wireless sensor network Sep. 27, 2011
7973544 Thermal monitoring and management of integrated circuits Jul. 5, 2011
7939823 Method and structures for accelerated soft-error testing May. 10, 2011
7901958 Fabrication method of semiconductor integrated circuit device Mar. 8, 2011
7892962 Nail-shaped pillar for wafer-level chip-scale packaging Feb. 22, 2011
7888672 Device for detecting stress migration properties Feb. 15, 2011
7858406 Semiconductor device test structures and methods Dec. 28, 2010
7834350 Semiconductor device with test pads and pad connection unit Nov. 16, 2010
7830005 Bond pad array for complex IC Nov. 9, 2010
7807552 Method of inspecting defect of semiconductor device Oct. 5, 2010
7785906 Method to detect poly residues in LOCOS process Aug. 31, 2010
7781238 Methods of making and using integrated and testable sensor array Aug. 24, 2010
7755084 Semiconductor wafer, semiconductor chip and method of manufacturing semiconductor chip Jul. 13, 2010
7749779 Landing pad for use as a contact to a conductive spacer Jul. 6, 2010
7741678 Semiconductor substrates having useful and transfer layers Jun. 22, 2010
7709836 Detector arrangement, method for the detection of electrical charge carriers and use of an ONO field effect transistor for detection of an electrical charge May. 4, 2010
7701072 Semiconductor device and manufacturing method therefor Apr. 20, 2010
7678589 Semiconductor device for providing capacitive semiconductor sensor and method for manufacturing capacitive semiconductor sensor Mar. 16, 2010
7670859 Semiconductor device and method for manufacturing the same Mar. 2, 2010
7667477 Circuit for detecting and measuring noise in semiconductor integrated circuit Feb. 23, 2010
7655537 Semiconductor substrates having useful and transfer layers Feb. 2, 2010
7642662 Semiconductor device and method of manufacturing the same Jan. 5, 2010
7635605 Infrared sensor and method of producing the same Dec. 22, 2009
7629185 Semiconductor laser device manufacturing method and semiconductor laser device Dec. 8, 2009
7608470 Interconnection device including one or more embedded vias and method of producing the same Oct. 27, 2009
7602064 Semiconductor device having an inspection hole striding a boundary Oct. 13, 2009
7598100 Manufacturing method of semiconductor integrated circuit device Oct. 6, 2009
7592623 Semiconductor device including wiring connection testing structure Sep. 22, 2009

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