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Class Information
Number: 257/E21.521
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Testing or measuring during manufacture or treatment or reliability measurement, i.e., testing of parts followed by no processing which modifies parts as such (epo)
Description: This subclass is indented under subclass E21.001. This subclass is substantially the same in scope as ECLA classification H01L21/66.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7622309 |
Mechanical integrity evaluation of low-k devices with bump shear |
Nov. 24, 2009 |
| 7622736 |
Semiconductor device and method for manufacturing the same |
Nov. 24, 2009 |
| 7618833 |
Method for pre-treating epitaxial layer, method for evaluating epitaxial layer, and apparatus for evaluating epitaxial layer |
Nov. 17, 2009 |
| 7615780 |
DNA biosensor and methods for making and using the same |
Nov. 10, 2009 |
| 7612370 |
Thermal interface |
Nov. 3, 2009 |
| 7595205 |
Using reverse arrangement for trend test in statistical process control for manufacture of semiconductor integrated circuits |
Sep. 29, 2009 |
| 7592623 |
Semiconductor device including wiring connection testing structure |
Sep. 22, 2009 |
| 7588950 |
Test pattern for reliability measurement of copper interconnection line having moisture window and method for manufacturing the same |
Sep. 15, 2009 |
| 7588947 |
Method of evaluating semiconductor device and method of manufacturing semiconductor device |
Sep. 15, 2009 |
| 7553680 |
Methods to provide and expose a diagnostic connector on overmolded electronic packages |
Jun. 30, 2009 |
| 7553681 |
Carbon nanotube-based stress sensor |
Jun. 30, 2009 |
| 7541203 |
Conductive adhesive for thinned silicon wafers with through silicon vias |
Jun. 2, 2009 |
| 7541611 |
Apparatus using Manhattan geometry having non-Manhattan current flow |
Jun. 2, 2009 |
| 7537941 |
Variable overlap of dummy shapes for improved rapid thermal anneal uniformity |
May. 26, 2009 |
| 7521265 |
Method for measuring an amount of strain of a bonded strained wafer |
Apr. 21, 2009 |
| 7521266 |
Production and packaging control for repaired integrated circuits |
Apr. 21, 2009 |
| 7518217 |
Semiconductor device, semiconductor wafer, chip size package, and methods of manufacturing and inspection therefor |
Apr. 14, 2009 |
| 7514278 |
Test-key for checking interconnect and corresponding checking method |
Apr. 7, 2009 |
| 7504270 |
Methods of quantifying variations resulting from manufacturing-induced corner rounding of various features, and structures for testing same |
Mar. 17, 2009 |
| 7488937 |
Method and apparatus for the improvement of material/voltage contrast |
Feb. 10, 2009 |
| 7485493 |
Singulating surface-mountable semiconductor devices and fitting external contacts to said devices |
Feb. 3, 2009 |
| 7482675 |
Probing pads in kerf area for wafer testing |
Jan. 27, 2009 |
| 7482179 |
Method of fabricating a thin film transistor using dual or multiple gates |
Jan. 27, 2009 |
| 7476554 |
Substrate processing method |
Jan. 13, 2009 |
| 7473567 |
Change rate prediction method, storage medium, and substrate processing system |
Jan. 6, 2009 |
| 7468549 |
Method for producing a package for an electronic circuit and a substrate for a package |
Dec. 23, 2008 |
| 7468530 |
Structure and method for failure analysis in a semiconductor device |
Dec. 23, 2008 |
| 7468525 |
Test structures for development of metal-insulator-metal (MIM) devices |
Dec. 23, 2008 |
| 7465590 |
Measurement of a sample using multiple models |
Dec. 16, 2008 |
| 7449349 |
Processing schedule creating method, coating and developing apparatus, pattern forming apparatus and processing system |
Nov. 11, 2008 |
| 7445945 |
Method and apparatus for dynamic adjustment of a sampling plan based on wafer electrical test data |
Nov. 4, 2008 |
| 7435991 |
Micromechanical sensor |
Oct. 14, 2008 |
| 7427774 |
Targets for measurements in semiconductor devices |
Sep. 23, 2008 |
| 7425458 |
Selectable decoupling capacitors for integrated circuits and associated methods |
Sep. 16, 2008 |
| 7423288 |
Technique for evaluating a fabrication of a die and wafer |
Sep. 9, 2008 |
| 7416986 |
Test structure and method for detecting via contact shorting in shallow trench isolation regions |
Aug. 26, 2008 |
| 7408189 |
Method of testing FPC bonding yield and FPC having testing pads thereon |
Aug. 5, 2008 |
| 7407822 |
Method for inspecting insulating film for film carrier tape for mounting electronic components thereon, inspection apparatus for inspecting the insulating film, punching apparatus for punching |
Aug. 5, 2008 |
| 7405089 |
Method and apparatus for measuring a surface profile of a sample |
Jul. 29, 2008 |
| 7405423 |
Random number generating device |
Jul. 29, 2008 |
| 7402443 |
Methods of providing families of integrated circuits with similar dies partially disabled using product selection codes |
Jul. 22, 2008 |
| 7402444 |
Method and apparatus for manufacturing a semiconductor device |
Jul. 22, 2008 |
| 7396694 |
Structure for monitoring semiconductor polysilicon gate profile |
Jul. 8, 2008 |
| 7393702 |
Characterizing the integrity of interconnects |
Jul. 1, 2008 |
| 7390682 |
Method for testing metal-insulator-metal capacitor structures under high temperature at wafer level |
Jun. 24, 2008 |
| 7384803 |
Method of manufacturing nitride semiconductor device including SiC substrate and apparatus for manufacturing nitride semiconductor device |
Jun. 10, 2008 |
| 7381577 |
Early detection test for identifying defective semiconductor wafers in a front-end manufacturing line |
Jun. 3, 2008 |
| 7378290 |
Isolation circuit |
May. 27, 2008 |
| 7378288 |
Systems and methods for producing light emitting diode array |
May. 27, 2008 |
| 7355201 |
Test structure for measuring electrical and dimensional characteristics |
Apr. 8, 2008 |
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