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Class Information
Number: 257/E21.519
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo) > Involving application of pressure, e.g., thermo-compression bonding (epo)
Description: This subclass is indented under subclass E21.506. This subclass is substantially the same in scope as ECLA classification H01L21/603.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8633060 Semiconductor device production method and semiconductor device Jan. 21, 2014
8604627 Semiconductor device Dec. 10, 2013
8575005 Method of manufacturing an electronic device having a plastic substrate and corresponding carrier Nov. 5, 2013
8569850 Ultra low pressure sensor Oct. 29, 2013
8497156 Semiconductor device and manufacturing method of the same Jul. 30, 2013
8419888 Method and apparatus for mounting electric component Apr. 16, 2013
8299630 Microstructure with reactive bonding Oct. 30, 2012
8278143 Manufacturing method for electronic devices Oct. 2, 2012
8236666 Semiconductor device and process for producing same Aug. 7, 2012
8193035 Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud bumps Jun. 5, 2012
8174101 Microelectronic devices and microelectronic support devices, and associated assemblies and methods May. 8, 2012
8163598 Clipless integrated heat spreader process and materials Apr. 24, 2012
8143704 Electronic assemblies including mechanically secured protruding bonding conductor joints Mar. 27, 2012
8105933 Localized alloying for improved bond reliability Jan. 31, 2012
8067823 Chip scale package having flip chip interconnect on die paddle Nov. 29, 2011
8063401 Testing for correct undercutting of an electrode during an etching step Nov. 22, 2011
8034659 Production method of semiconductor device and bonding film Oct. 11, 2011
8017446 Method for manufacturing a rigid power module suited for high-voltage applications Sep. 13, 2011
8008164 Wafer bonding method and wafer structure Aug. 30, 2011
8003441 Manufacturing method of semiconductor device Aug. 23, 2011
7977158 Manufacturing method for electronic devices Jul. 12, 2011
7964493 Method of manufacturing semiconductor device Jun. 21, 2011
7947602 Conductive pattern formation method May. 24, 2011
7932590 Stacked-die electronics package with planar and three-dimensional inductor elements Apr. 26, 2011
7879690 Method of fabricating a microelectronic structure of a semiconductor on insulator type with different patterns Feb. 1, 2011
7855103 Wirebond structure and method to connect to a microelectronic die Dec. 21, 2010
7846777 Semiconductor device package and fabricating method thereof Dec. 7, 2010
7791200 Approach to high temperature wafer processing Sep. 7, 2010
7776715 Reverse construction memory cell Aug. 17, 2010
7772032 Manufacturing method for electronic devices Aug. 10, 2010
7723839 Semiconductor device, stacked semiconductor device, and manufacturing method for semiconductor device May. 25, 2010
7713782 Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud-bumps May. 11, 2010
7683472 Power semiconductor modules and method for producing them Mar. 23, 2010
7632749 Semiconductor device having a pad metal layer and a lower metal layer that are electrically coupled, whereas apertures are formed in the lower metal layer below a center area of the pad metal Dec. 15, 2009
7618847 Bonding method of semiconductor and laminated structure fabricated thereby Nov. 17, 2009
7611925 Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument Nov. 3, 2009
7605050 Method of bonding a polymer surface to a conducting or semiconducting surface and application of the same Oct. 20, 2009
7605051 Method for forming internal electrode pattern and method for manufacturing multilayer ceramic electronic component using same Oct. 20, 2009
7572726 Method of forming a bond pad on an I/C chip and resulting structure Aug. 11, 2009
7566575 Mounting circuit and method for producing semiconductor-chip-mounting circuit Jul. 28, 2009
7560303 Method and apparatus for linear die transfer Jul. 14, 2009
7534639 Semiconductor device with a resonator May. 19, 2009
7531426 Approach to high temperature wafer processing May. 12, 2009
7504728 Integrated circuit having bond pad with improved thermal and mechanical properties Mar. 17, 2009
7504330 Method of forming an insulative film Mar. 17, 2009
7495333 Seal cover structure comprising a nickel-tin (Ni--Sn) alloy barrier layer formed between a nickel (Ni) plating layer and a gold-tin (Au--Sn) brazing layer having Sn content of 20.65 to 25 WT % Feb. 24, 2009
7462943 Semiconductor assembly for improved device warpage and solder ball coplanarity Dec. 9, 2008
7445965 Method of manufacturing radiating plate and semiconductor apparatus using the same Nov. 4, 2008
7416922 Heat sink with preattached thermal interface material and method of making same Aug. 26, 2008
7387914 Semiconductor device and process for fabrication thereof Jun. 17, 2008

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