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Browse by Category: Main > Physics
Class Information
Number: 257/E21.518
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo) > Involving application of mechanical vibration, e.g., ultrasonic vibration (epo)
Description: This subclass is indented under subclass E21.506. This subclass is substantially the same in scope as ECLA classification H01L21/607.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8609454 Self-assembly apparatus, device self-assembling method, and method of assembling thermoelectric devices Dec. 17, 2013
8604627 Semiconductor device Dec. 10, 2013
8581378 Semiconductor device and method of manufacturing the same Nov. 12, 2013
8569163 Ultrasonic wire bonding method for a semiconductor device Oct. 29, 2013
8569850 Ultra low pressure sensor Oct. 29, 2013
8304874 Stackable integrated circuit package system Nov. 6, 2012
8298947 Semiconductor device having solder-free gold bump contacts for stability in repeated temperature cycles Oct. 30, 2012
8174101 Microelectronic devices and microelectronic support devices, and associated assemblies and methods May. 8, 2012
8129220 Method and system for bonding electrical devices using an electrically conductive adhesive Mar. 6, 2012
8058639 Nitride semiconductor element and method for production thereof Nov. 15, 2011
8049311 Electronic component and method for its production Nov. 1, 2011
7814645 Mounting apparatus mounting surface-mounted device on receiving device using ultrasonic vibration Oct. 19, 2010
7804160 Ultrasonic bonding equipment for manufacturing semiconductor device, semiconductor device and its manufacturing method Sep. 28, 2010
7754529 Flip chip mounting body and method for mounting such flip chip mounting body and bump forming method Jul. 13, 2010
7635913 Stacked integrated circuit package-in-package system Dec. 22, 2009
7612429 Chip resistor, process for producing the same, and frame for use therein Nov. 3, 2009
7456091 Semiconductor device and method of manufacturing the same Nov. 25, 2008
7413935 Semiconductor device and method of fabricating the same Aug. 19, 2008
7371661 Wafer bonding method May. 13, 2008
7348621 Non-volatile memory cells Mar. 25, 2008
7294853 Substrate for mounting a semiconductor Nov. 13, 2007
7241678 Integrated die bumping process Jul. 10, 2007
7229854 Electronic component mounting method and apparatus and ultrasonic bonding head Jun. 12, 2007
7172958 High-frequency wiring structure and method for producing the same Feb. 6, 2007
7071543 Semiconductor device and manufacturing method thereof Jul. 4, 2006
7064433 Multiple-ball wire bonds Jun. 20, 2006
7064425 Semiconductor device circuit board, and electronic equipment Jun. 20, 2006
7056819 Methods and apparatus for determining pad height for a wire-bonding operation in an integrated circuit Jun. 6, 2006
7053489 Arrangement with a semiconductor chip and support therefore and method for a bonded wire connection May. 30, 2006
7049217 Method of forming multi-piled bump May. 23, 2006
7042104 Semiconductor package using flexible film and method of manufacturing the same May. 9, 2006
7038306 Semiconductor integrated circuit device and method of manufacturing the same May. 2, 2006
7032311 Stabilized wire bonded electrical connections and method of making same Apr. 25, 2006
7026190 Method of manufacturing circuit device Apr. 11, 2006
7021520 Stacked chip connection using stand off stitch bonding Apr. 4, 2006
7014095 Wire bonding method, wire bonding apparatus and wire bonding program Mar. 21, 2006
6998295 Method of manufacturing a device package Feb. 14, 2006
6984884 Electric power semiconductor device Jan. 10, 2006
6977214 Die paddle clamping method for wire bond enhancement Dec. 20, 2005
6966480 Concave face wire bond capillary and method Nov. 22, 2005
6956743 Electronic component, in particular regulator for generators in motor vehicles Oct. 18, 2005
6945446 Wire bonding method and apparatus Sep. 20, 2005
6946380 Method for forming bump, semiconductor element having bumps and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic equip Sep. 20, 2005
6933608 Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatus Aug. 23, 2005
6929168 Method for determining optimum bonding parameters for bonding with a wire bonder Aug. 16, 2005
6921016 Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment Jul. 26, 2005
6915795 Method and system for dicing wafers, and semiconductor structures incorporating the products thereof Jul. 12, 2005
6908843 Method and system of wire bonding using interposer pads Jun. 21, 2005
6902101 Bump bonding method apparatus Jun. 7, 2005
6903450 Semiconductor device and method of manufacturing the same Jun. 7, 2005

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