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Browse by Category: Main > Physics
Class Information
Number: 257/E21.517
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo) > Involving use of electron or laser beam (epo)
Description: This subclass is indented under subclass E21.506. This subclass is substantially the same in scope as ECLA classification H01L21/60G.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8710666 Semiconductor device and method for fabricating the same Apr. 29, 2014
8658542 Coarse grid design methods and structures Feb. 25, 2014
8659113 Embedded semiconductor die package and method of making the same using metal frame carrier Feb. 25, 2014
8603859 Integrated circuit packaging system with dual side mold and method of manufacture thereof Dec. 10, 2013
8587104 Wiring board and semiconductor package Nov. 19, 2013
8546805 Two-beam laser annealing with improved temperature performance Oct. 1, 2013
8513057 Integrated circuit packaging system with routable underlayer and method of manufacture thereof Aug. 20, 2013
8481393 Semiconductor substrate and method for manufacturing the same, and method for manufacturing semiconductor device Jul. 9, 2013
8445390 Patterning of antistiction films for electromechanical systems devices May. 21, 2013
8431440 Chip manufacturing method Apr. 30, 2013
8361881 Method for alternately contacting two wafers Jan. 29, 2013
8334169 Integrated circuit packaging system and method of manufacture thereof Dec. 18, 2012
8268669 Laser optical path detection Sep. 18, 2012
8222717 Embedded semiconductor die package and method of making the same using metal frame carrier Jul. 17, 2012
8153511 Method for manufacturing semiconductor device Apr. 10, 2012
7999362 Method and apparatus for making semiconductor devices including a foil Aug. 16, 2011
7985635 Laser process Jul. 26, 2011
7964493 Method of manufacturing semiconductor device Jun. 21, 2011
7955938 Wiring technique Jun. 7, 2011
7952176 Integrated circuit packaging system and method of manufacture thereof May. 31, 2011
7932119 Laser optical path detection in integrated circuit packaging Apr. 26, 2011
7892962 Nail-shaped pillar for wafer-level chip-scale packaging Feb. 22, 2011
7888807 Method of producing wire-connection structure, and wire-connection structure Feb. 15, 2011
7883939 Method for manufacturing semiconductor device Feb. 8, 2011
7851318 Semiconductor substrate and method for manufacturing the same, and method for manufacturing semiconductor device Dec. 14, 2010
7842542 Embedded semiconductor die package and method of making the same using metal frame carrier Nov. 30, 2010
7820489 Method of manufacturing semiconductor apparatus Oct. 26, 2010
7820461 Semiconductor device with vertical electron injection and its manufacturing method Oct. 26, 2010
7795074 WLCSP target and method for forming the same Sep. 14, 2010
7781324 Method of producing wire-connection structure, and wire-connection structure Aug. 24, 2010
7763916 Substrate table Jul. 27, 2010
7754582 Laser processing method Jul. 13, 2010
7696014 Method for breaking adhesive film mounted on back of wafer Apr. 13, 2010
7655540 Method and jig structure for positioning bare dice Feb. 2, 2010
7579215 Method for fabricating a low cost integrated circuit (IC) package Aug. 25, 2009
7550360 Solid electrolytic capacitor manufacturing method capable of easily and properly connecting anode electrode portion Jun. 23, 2009
7498237 Method of manufacturing devices, positioning method, dicing method and dicing apparatus Mar. 3, 2009
7416919 Method for wafer level stack die placement Aug. 26, 2008
7405144 Method for manufacturing probe card Jul. 29, 2008
7348222 Method for manufacturing a thin film transistor and method for manufacturing a semiconductor device Mar. 25, 2008
7294914 Interconnect structure Nov. 13, 2007
7232774 Polycrystalline silicon layer with nano-grain structure and method of manufacture Jun. 19, 2007
7009116 Contact device and a process to facilitate contact of power electronics components and an assembly that consists of one or several power electronics components Mar. 7, 2006
6983539 Method of forming an electrical connection between electrical leads of a tab circuit and electrical contact bumps Jan. 10, 2006
6955943 Method for producing a substrate arrangement Oct. 18, 2005
6717100 Apparatus and method for laser welding of ribbons Apr. 6, 2004
6709967 Laser wire bonding for wire embedded dielectrics to integrated circuits Mar. 23, 2004
6596964 Method of attaching a component to a connection support by welding without the addition of material Jul. 22, 2003
6501043 Apparatus and method for laser welding of ribbons Dec. 31, 2002
6478906 Method for bonding a flexible substrate to a chip Nov. 12, 2002

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