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Class Information
Number: 257/E21.516
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo) > Involving automation techniques using film carriers (epo)
Description: This subclass is indented under subclass E21.506. This subclass is substantially the same in scope as ECLA classification H01L21/60F.

Patents under this class:
1 2 3 4 5

Patent Number Title Of Patent Date Issued
8703585 Adhesive compositions for a semiconductor, an adhesive sheet for a semiconductor and a production method of a semiconductor device Apr. 22, 2014
8637379 Device including a semiconductor chip and a carrier and fabrication method Jan. 28, 2014
8501541 Semiconductor device and method of conforming conductive vias between insulating layers in saw streets Aug. 6, 2013
8502352 Semiconductor device with conductive vias between saw streets Aug. 6, 2013
8466544 Semiconductor device and method of forming interposer and opposing build-up interconnect structure with connecting conductive TMV for electrical interconnect of Fo-WLCSP Jun. 18, 2013
8394673 Semiconductor device Mar. 12, 2013
8232183 Process and apparatus for wafer-level flip-chip assembly Jul. 31, 2012
8212342 Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof Jul. 3, 2012
8154120 Chip-mounted film package Apr. 10, 2012
8030136 Semiconductor device and method of conforming conductive vias between insulating layers in saw streets Oct. 4, 2011
7842548 Fixture for P-through silicon via assembly Nov. 30, 2010
7687318 Extended redistribution layers bumped wafer Mar. 30, 2010
7678608 Process for producing wiring circuit board Mar. 16, 2010
7611968 Wafer laser processing method and laser beam processing machine Nov. 3, 2009
7585774 Method for fabricating metal line of semiconductor device Sep. 8, 2009
7470568 Method of manufacturing a semiconductor device Dec. 30, 2008
7427571 Reactor design for reduced particulate generation Sep. 23, 2008
7405103 Process for fabricating chip embedded package structure Jul. 29, 2008
7382042 COF flexible printed wiring board and method of producing the wiring board Jun. 3, 2008
7282395 Method of making exposed pad ball grid array package Oct. 16, 2007
7262083 Method of manufacturing a semiconductor device Aug. 28, 2007
7198989 Method of producing a COF flexible printed wiring board Apr. 3, 2007
7189600 Methods for fabricating stiffeners for flexible substrates Mar. 13, 2007
7042104 Semiconductor package using flexible film and method of manufacturing the same May. 9, 2006
6991961 Method of forming a high-voltage/high-power die package Jan. 31, 2006
6986197 Method of manufacturing an IC package Jan. 17, 2006
6982190 Chip attachment in an RFID tag Jan. 3, 2006
6982484 Semiconductor joining substrate utilizing a tape with adhesive and copper-clad laminate sheet Jan. 3, 2006
6914196 Reel-deployed printed circuit board Jul. 5, 2005
6911725 Film substrate, semiconductor device, method of manufacturing film substrate, method of manufacturing semiconductor device and method of manufacturing circuit board with semiconductor device Jun. 28, 2005
6898848 Method of bonding inner leads to chip pads May. 31, 2005
6888229 Connection components with frangible leads and bus May. 3, 2005
6867068 Semiconductor device, method of making the same, circuit board, and film carrier tape Mar. 15, 2005
6838753 Lead-frame strip and method of manufacturing semiconductor packages using the same Jan. 4, 2005
6798058 Semiconductor device, mounting and method of manufacturing mounting substrate, circuit board, and electronic instrument Sep. 28, 2004
6735859 Method of manufacturing chip scale package May. 18, 2004
6670220 Semiconductor device and manufacture method of that Dec. 30, 2003
6653169 Packaged semiconductor and process for manufacturing the same Nov. 25, 2003
6627994 Semiconductor device and film carrier tape Sep. 30, 2003
6624007 Method of making leadframe by mechanical processing Sep. 23, 2003
6607940 Method of manufacturing semiconductor devices and semiconductor devices made according to the method Aug. 19, 2003
6605523 Manufacturing method for semiconductor device Aug. 12, 2003
6566739 Dual chip package May. 20, 2003
6565706 Support-frame bonding apparatus May. 20, 2003
6544817 Method for sawing a moulded leadframe package Apr. 8, 2003
6516515 Semiconductor integrated circuit Feb. 11, 2003
6509205 Apparatus and method for providing mechanically pre-formed conductive leads Jan. 21, 2003
6505400 Method of making chip scale package with heat spreader Jan. 14, 2003
6506980 Semiconductor device and tape carrier, and method of manufacturing the same, circuit board, electronic instrument, and tape carrier manufacturing device Jan. 14, 2003
6504257 Apparatus and method for providing mechanically pre-formed conductive leads Jan. 7, 2003

1 2 3 4 5

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