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Class Information
Number: 257/E21.515
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo) > Involving use of mechanical auxiliary part without use of alloying or soldering process, e.g., pressure contacts (epo)
Description: This subclass is indented under subclass E21.506. This subclass is substantially the same in scope as ECLA classification H01L21/60E.










Patents under this class:

Patent Number Title Of Patent Date Issued
8604627 Semiconductor device Dec. 10, 2013
8581422 Semiconductor module Nov. 12, 2013
8569850 Ultra low pressure sensor Oct. 29, 2013
8530345 Electrical contact alignment posts Sep. 10, 2013
8524593 Arrangement for solder bump formation on wafers Sep. 3, 2013
8481366 Semiconductor device and manufacturing method therefor Jul. 9, 2013
8415792 Electrical contact alignment posts Apr. 9, 2013
8389328 Method of manufacturing electronic device and electronic device Mar. 5, 2013
8368207 Pressure-contact power semiconductor module and method for producing the same Feb. 5, 2013
8278143 Manufacturing method for electronic devices Oct. 2, 2012
8193092 Semiconductor devices including a through-substrate conductive member with an exposed end and methods of manufacturing such semiconductor devices Jun. 5, 2012
8119427 Light emitting diode die-bonding with magnetic field Feb. 21, 2012
7982320 Arrangement for solder bump formation on wafers Jul. 19, 2011
7977158 Manufacturing method for electronic devices Jul. 12, 2011
7968907 Low capacitance over-voltage protection thyristor device Jun. 28, 2011
7829994 Semiconductor substrate elastomeric stack Nov. 9, 2010
7816793 Apparatus for facilitating proximity communication between chips Oct. 19, 2010
7772026 MEMS device package and method for manufacturing the same Aug. 10, 2010
7772032 Manufacturing method for electronic devices Aug. 10, 2010
7504330 Method of forming an insulative film Mar. 17, 2009
7208839 Semiconductor component assemblies having interconnects Apr. 24, 2007
7138720 Semiconductor component assemblies having interconnects Nov. 21, 2006
7109583 Mounting with auxiliary bumps Sep. 19, 2006
7049693 Electrical contact array for substrate assemblies May. 23, 2006
6975016 Wafer bonding using a flexible bladder press and thinned wafers for three-dimensional (3D) wafer-to-wafer vertical stack integration, and application thereof Dec. 13, 2005
6812560 Press-fit chip package Nov. 2, 2004
6756540 Self-adhering chip Jun. 29, 2004
6733624 Apparatus for holding an object to be processed May. 11, 2004
6601753 Void-free die attachment method with low melting metal Aug. 5, 2003
6580613 Solder-free PCB assembly Jun. 17, 2003
6548890 Press-contact type semiconductor device Apr. 15, 2003
6352436 Self retained pressure connection Mar. 5, 2002
6198161 Semiconductor device Mar. 6, 2001
5053358 Method of manufacturing hermetically sealed compression bonded circuit assemblies Oct. 1, 1991
4830979 Method of manufacturing hermetically sealed compression bonded circuit assemblies May. 16, 1989
4668581 Bonding electrical conductors and bonded products May. 26, 1987
4068368 Closure for semiconductor device and method of construction Jan. 17, 1978
4063348 Unique packaging method for use on large semiconductor devices Dec. 20, 1977











 
 
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