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Class Information
Number: 257/E21.514
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo) > Involving use of conductive adhesive (epo)
Description: This subclass is indented under subclass E21.506. This subclass is substantially the same in scope as ECLA classification H01L21/60D.

Patents under this class:
1 2 3 4 5 6 7 8 9 10

Patent Number Title Of Patent Date Issued
8642391 Self-assembly of chips on a substrate Feb. 4, 2014
8633600 Device and method for manufacturing a device Jan. 21, 2014
8598719 Semiconductor element mounting board Dec. 3, 2013
8552543 Semiconductor package Oct. 8, 2013
8524607 Anisotropically conductive member and method of manufacture Sep. 3, 2013
8481370 Semiconductor device and method for manufacturing the same Jul. 9, 2013
8432036 Lead frames with improved adhesion to plastic encapsulant Apr. 30, 2013
8431481 IC device having low resistance TSV comprising ground connection Apr. 30, 2013
8399997 Power package including multiple semiconductor devices Mar. 19, 2013
8400440 Display device Mar. 19, 2013
8319339 Surface-mounted silicon chip Nov. 27, 2012
8252632 Semiconductor device and manufacturing method of the same Aug. 28, 2012
8227297 Method for producing a hermetically sealed, electrical feedthrough using exothermic nanofilm Jul. 24, 2012
8217269 Electrical microfilament to circuit interface Jul. 10, 2012
8207057 Microball assembly methods, and packages using maskless microball assemblies Jun. 26, 2012
8207616 Adhesive film, dicing die bonding film and semiconductor device using the same Jun. 26, 2012
8178371 Solid-state lasers May. 15, 2012
8163598 Clipless integrated heat spreader process and materials Apr. 24, 2012
8153473 Module having a stacked passive element and method of forming the same Apr. 10, 2012
8138589 Semiconductor device and method of fabricating the same Mar. 20, 2012
8129224 Stud bumps as local heat sinks during transient power operations Mar. 6, 2012
8129220 Method and system for bonding electrical devices using an electrically conductive adhesive Mar. 6, 2012
8120189 Wiring terminal-connecting adhesive Feb. 21, 2012
8119427 Light emitting diode die-bonding with magnetic field Feb. 21, 2012
8115322 Adhesive, method of connecting wiring terminals and wiring structure Feb. 14, 2012
8072062 Circuit device with at least partial packaging and method for forming Dec. 6, 2011
8026447 Electrical microfilament to circuit interface Sep. 27, 2011
7989926 Semiconductor device including non-stoichiometric silicon carbide layer and method of fabrication thereof Aug. 2, 2011
7972906 Semiconductor die package including exposed connections Jul. 5, 2011
7944051 Semiconductor device having external connection terminals and method of manufacturing the same May. 17, 2011
7939917 Tape structures, and methods and apparatuses for separating a wafer using the same May. 10, 2011
7923293 Method for manufacturing a semiconductor device wherein the electrical connection between two components is provided by capillary phenomenon of a liquid conductor material in a cavity therebet Apr. 12, 2011
7915743 Adhesive for electronic components, method for manufacturing semiconductor chip laminate, and semiconductor device Mar. 29, 2011
7906857 Molded integrated circuit package and method of forming a molded integrated circuit package Mar. 15, 2011
7888182 Electronic component, production method of electronic component, mounted structure of electronic component, and evaluation method of electronic component Feb. 15, 2011
7888259 Integrated circuit package employing predetermined three-dimensional solder pad surface and method for making same Feb. 15, 2011
7888175 Method and apparatus for facilitating proximity communication and power delivery Feb. 15, 2011
7868467 Semiconductor device Jan. 11, 2011
7851260 Method for manufacturing a semiconductor device Dec. 14, 2010
7838988 Stud bumps as local heat sinks during transient power operations Nov. 23, 2010
7829994 Semiconductor substrate elastomeric stack Nov. 9, 2010
7824960 Method of assembling a silicon stack semiconductor package Nov. 2, 2010
7824950 Semiconductor device and method of fabricating the same Nov. 2, 2010
7820487 Manufacturing method of semiconductor device Oct. 26, 2010
7816793 Apparatus for facilitating proximity communication between chips Oct. 19, 2010
7777335 Wiring structure having a wiring-terminal-connecting adhesive comprising silicone particles Aug. 17, 2010
7772047 Method of fabricating a semiconductor die having a redistribution layer Aug. 10, 2010
7754535 Method of manufacturing chip integrated substrate Jul. 13, 2010
7713782 Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud-bumps May. 11, 2010
7713776 Method of making a light emitting diode May. 11, 2010

1 2 3 4 5 6 7 8 9 10

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