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Class Information
Number: 257/E21.513
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo) > Involving soldering or alloying process, e.g., soldering wires (epo) > Mounting on semiconductor conductive member (epo)
Description: This subclass is indented under subclass E21.509. This subclass is substantially the same in scope as ECLA classification H01L21/60C6.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8664749 Component stacking using pre-formed adhesive films Mar. 4, 2014
8153473 Module having a stacked passive element and method of forming the same Apr. 10, 2012
8110434 Semiconductor device and memory card using the same Feb. 7, 2012
8088647 Bumping free flip chip process Jan. 3, 2012
8080445 Semiconductor device and method of forming WLP with semiconductor die embedded within penetrable encapsulant between TSV interposers Dec. 20, 2011
8076184 Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die Dec. 13, 2011
8072062 Circuit device with at least partial packaging and method for forming Dec. 6, 2011
8048776 Semiconductor device and method of supporting a wafer during backgrinding and reflow of solder bumps Nov. 1, 2011
7998768 Method for forming a light emitting diode Aug. 16, 2011
7993972 Wafer level die integration and method therefor Aug. 9, 2011
7989267 Manufacturing method of semiconductor device and manufacturing method of lead frame Aug. 2, 2011
7943439 Method for manufacturing semiconductor apparatus May. 17, 2011
7906363 Method of fabricating semiconductor device having three-dimensional stacked structure Mar. 15, 2011
7902650 Semiconductor package and method for manufacturing the same Mar. 8, 2011
7901955 Method of constructing a stacked-die semiconductor structure Mar. 8, 2011
7843049 Semiconductor device and manufacturing method thereof Nov. 30, 2010
7799611 Partially patterned lead frames and methods of making and using the same in semiconductor packaging Sep. 21, 2010
7790484 Method for manufacturing laser devices Sep. 7, 2010
7772026 MEMS device package and method for manufacturing the same Aug. 10, 2010
7750469 Insulating layer between bumps of semiconductor chip, and display panel using the same with anisotropic conductive film between semiconductor chip and substrate Jul. 6, 2010
7691671 Radiant energy heating for die attach Apr. 6, 2010
7662661 Method of manufacturing a substrate structure for increasing cutting precision and strength thereof Feb. 16, 2010
7659192 Methods of forming stepped bumps and structures formed thereby Feb. 9, 2010
7652368 Semiconductor device Jan. 26, 2010
7635910 Semiconductor package and method Dec. 22, 2009
7572659 Semiconductor dynamic sensor and method of manufacturing the same Aug. 11, 2009
7566584 Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing method Jul. 28, 2009
7544529 Image sensor packaging structure and method of manufacturing the same Jun. 9, 2009
7507637 Method of manufacturing wafer level stack package Mar. 24, 2009
7494846 Design techniques for stacking identical memory dies Feb. 24, 2009
7488623 Integrated circuit chip packaging assembly Feb. 10, 2009
7479412 Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device Jan. 20, 2009
7452750 Capacitor attachment method Nov. 18, 2008
7449367 Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufacturing semiconductor device Nov. 11, 2008
7374973 Manufacturing method of semiconductor device and manufacturing method of lead frame May. 20, 2008
7361987 Circuit device with at least partial packaging and method for forming Apr. 22, 2008
7259032 Hermetically sealing a package to include a barrier metal Aug. 21, 2007
7186588 Method of fabricating a micro-array integrated circuit package Mar. 6, 2007
6803657 Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components Oct. 12, 2004
6602730 Method for gravitation-assisted control of spread of viscous material applied to a substrate Aug. 5, 2003
6581279 Method of collectively packaging electronic components Jun. 24, 2003
6492713 Gravitationally assisted control of spread of viscous material applied to semiconductor assembly components Dec. 10, 2002
6489681 Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components Dec. 3, 2002
6156621 Method for fabricating direct wafer bond Si/SiO.sub.2 /Si substrates Dec. 5, 2000
6083768 Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components Jul. 4, 2000
6066542 Method for the manufacture of a power semiconductor component May. 23, 2000
5877516 Bonding of silicon carbide directly to a semiconductor substrate by using silicon to silicon bonding Mar. 2, 1999
5336929 Semiconductor structure and method for fabricating the same Aug. 9, 1994
4446478 Assembly in a single case of a main power-switching semiconductor component and a destorage diode May. 1, 1984
4406054 Method of mounting and packaging elongate silicon devices on a ceramic base Sep. 27, 1983

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