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Browse by Category: Main > Physics
Class Information
Number: 257/E21.512
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo) > Involving soldering or alloying process, e.g., soldering wires (epo) > Mounting on insulating member provided with metallic leads, e.g., flip-chip mounting, conductive die mounting (epo) > Right-up bonding (epo)
Description: This subclass is indented under subclass E21.511. This subclass is substantially the same in scope as ECLA classification H01L21/60C4B.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8558396 Bond pad configurations for semiconductor dies Oct. 15, 2013
8557680 Semiconductor wafer-to-wafer bonding for dissimilar semiconductor dies and/or wafers Oct. 15, 2013
8399992 Package-on-package type semiconductor package Mar. 19, 2013
8383461 Method for manufacturing semiconductor package having improved bump structures Feb. 26, 2013
8354298 Semiconductor device and manufacturing method of a semiconductor device Jan. 15, 2013
8263439 Semiconductor device and method of forming an interposer package with through silicon vias Sep. 11, 2012
8242543 Semiconductor wafer-to-wafer bonding for dissimilar semiconductor dies and/or wafers Aug. 14, 2012
8138594 Semiconductor device and manufacturing method of a semiconductor device Mar. 20, 2012
8093104 Multi-chip stacking method to reduce voids between stacked chips Jan. 10, 2012
8048721 Method for filling multi-layer chip-stacked gaps Nov. 1, 2011
8003438 Circuit module and manufacturing method thereof Aug. 23, 2011
8004091 Semiconductor package, method of fabricating the same, and semiconductor package mold Aug. 23, 2011
7993972 Wafer level die integration and method therefor Aug. 9, 2011
7871860 Method of semiconductor packaging Jan. 18, 2011
7863759 Package structure and method for chip with two arrays of bonding pads on BGA substrate for preventing gold bonding wires from collapse Jan. 4, 2011
7847382 Integrated circuit packaging system with package stacking and method of manufacture thereof Dec. 7, 2010
7759221 Methods for packaging microelectronic devices and microelectronic devices formed using such methods Jul. 20, 2010
RE41369 Semiconductor device and method of manufacturing the same Jun. 8, 2010
7691672 Substrate treating method and method of manufacturing semiconductor apparatus Apr. 6, 2010
7601559 Apparatus and method for identifying proper orientation and electrical conductivity between a semiconductor device and a socket or contactor Oct. 13, 2009
7595545 Anodic bonding apparatus, anodic bonding method, and method of producing acceleration sensor Sep. 29, 2009
7582965 Electronic device and method for bonding an electronic device Sep. 1, 2009
7563650 Circuit board and the manufacturing method Jul. 21, 2009
7511365 Thermal enhanced low profile package structure Mar. 31, 2009
7495276 Radio frequency arrangement, method for producing a radio frequency arrangement and use of the radio frequency arrangement Feb. 24, 2009
7456091 Semiconductor device and method of manufacturing the same Nov. 25, 2008
7456502 Wiring board with connection electrode formed in opening and semiconductor device using the same Nov. 25, 2008
7352054 Semiconductor device having conducting portion of upper and lower conductive layers Apr. 1, 2008
7285856 Package for semiconductor devices Oct. 23, 2007
7282395 Method of making exposed pad ball grid array package Oct. 16, 2007
7256496 Semiconductor device having adhesion increasing film to prevent peeling Aug. 14, 2007
7244635 Semiconductor device and method of manufacturing the same Jul. 17, 2007
7199459 Semiconductor package without bonding wires and fabrication method thereof Apr. 3, 2007
7075180 Method and apparatus for applying body bias to integrated circuit die Jul. 11, 2006
7074696 Semiconductor circuit module and method for fabricating semiconductor circuit modules Jul. 11, 2006
7074649 Method for producing an integrated circuit with a rewiring device and corresponding integrated circuit Jul. 11, 2006
7064440 Semiconductor device Jun. 20, 2006
7064566 Probe card assembly and kit Jun. 20, 2006
7061257 Probe card assembly Jun. 13, 2006
7049171 Electrical package employing segmented connector and solder joint May. 23, 2006
7049224 Manufacturing method of electronic components embedded substrate May. 23, 2006
7045391 Multi-chips bumpless assembly package and manufacturing method thereof May. 16, 2006
7042104 Semiconductor package using flexible film and method of manufacturing the same May. 9, 2006
7030490 Structure of multi-tier wire bonding for high frequency integrated circuit Apr. 18, 2006
7011988 Build-up structures with multi-angle vias for Chip to Chip interconnects and optical bussing Mar. 14, 2006
7008493 Method for applying a semiconductor chip to a carrier element Mar. 7, 2006
7002245 Semiconductor package having conductive bumps on chip and method for fabricating the same Feb. 21, 2006
7002249 Microelectronic component with reduced parasitic inductance and method of fabricating Feb. 21, 2006
6995409 Module for high voltage power for converting a base of IGBT components Feb. 7, 2006
6991966 Method for embedding a component in a base and forming a contact Jan. 31, 2006

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