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Class Information
Number: 257/E21.511
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo) > Involving soldering or alloying process, e.g., soldering wires (epo) > Mounting on insulating member provided with metallic leads, e.g., flip-chip mounting, conductive die mounting (epo)
Description: This subclass is indented under subclass E21.509. This subclass is substantially the same in scope as ECLA classification H01L21/60C4.










Sub-classes under this class:

Class Number Class Name Patents
257/E21.512 Right-up bonding (epo) 537


Patents under this class:

Patent Number Title Of Patent Date Issued
8703540 Chip-scale semiconductor die packaging method Apr. 22, 2014
8703534 Semiconductor packages and methods of packaging semiconductor devices Apr. 22, 2014
8691624 Die fixing method and apparatus Apr. 8, 2014
8673684 Semiconductor device and manufacturing method thereof Mar. 18, 2014
8669173 Methods of fluxless micro-piercing of solder balls, and resulting devices Mar. 11, 2014
8664749 Component stacking using pre-formed adhesive films Mar. 4, 2014
8642381 Semiconductor device and method of forming protective layer over exposed surfaces of semiconductor die Feb. 4, 2014
8637391 Flip chip semiconductor assembly with variable volume solder bumps Jan. 28, 2014
8637350 Method of manufacturing chip-stacked semiconductor package Jan. 28, 2014
8633597 Thermal vias in an integrated circuit package with an embedded die Jan. 21, 2014
8633586 Mock bump system for flip chip integrated circuits Jan. 21, 2014
8629567 Integrated circuit packaging system with contacts and method of manufacture thereof Jan. 14, 2014
8623763 Protective layer for protecting TSV tips during thermo-compressive bonding Jan. 7, 2014
8618645 Package process and package structure Dec. 31, 2013
8617923 Semiconductor device manufacturing apparatus and method for manufacturing semiconductor device Dec. 31, 2013
8603859 Integrated circuit packaging system with dual side mold and method of manufacture thereof Dec. 10, 2013
8592255 Method for electrically connecting dual silicon-on-insulator device layers Nov. 26, 2013
8587104 Wiring board and semiconductor package Nov. 19, 2013
8580621 Solder interconnect by addition of copper Nov. 12, 2013
8580620 Method of manufacturing semiconductor device Nov. 12, 2013
8574966 Semiconductor device having a semiconductor chip, and method for the production thereof Nov. 5, 2013
8541259 Semiconductor device and manufacturing method thereof Sep. 24, 2013
8525353 Microspring structures adapted for target device cooling Sep. 3, 2013
8519526 Semiconductor package and fabrication method thereof Aug. 27, 2013
8513823 Semiconductor package having main stamp and sub-stamp Aug. 20, 2013
8513810 Semiconductor device and method of manufacturing same Aug. 20, 2013
8513680 Semiconductor package and method of manufacturing the same Aug. 20, 2013
8513057 Integrated circuit packaging system with routable underlayer and method of manufacture thereof Aug. 20, 2013
8508036 Ultra-thin near-hermetic package based on rainier Aug. 13, 2013
8501545 Reduction of mechanical stress in metal stacks of sophisticated semiconductor devices during die-substrate soldering by an enhanced cool down regime Aug. 6, 2013
8501534 Method for housing an electronic component in a device package and an electronic component housed in the device package Aug. 6, 2013
8492196 Semiconductor device and method of forming prefabricated EMI shielding frame with cavities containing penetrable material over semiconductor die Jul. 23, 2013
8492171 Techniques and structures for testing integrated circuits in flip-chip assemblies Jul. 23, 2013
8486756 Flip chip bonded semiconductor device with shelf and method of manufacturing thereof Jul. 16, 2013
8481364 Flexible micro-system and fabrication method thereof Jul. 9, 2013
8476135 Integrated circuit packaging system with vertical interconnects and method of manufacture thereof Jul. 2, 2013
8466544 Semiconductor device and method of forming interposer and opposing build-up interconnect structure with connecting conductive TMV for electrical interconnect of Fo-WLCSP Jun. 18, 2013
8445329 Circuit board with oval micro via May. 21, 2013
8436478 Methods of fluxless micro-piercing of solder balls, and resulting devices May. 7, 2013
8436439 Semiconductor device and method of forming a shielding layer over a semiconductor die after forming a build-up interconnect structure May. 7, 2013
8435834 Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in FO-WLCSP May. 7, 2013
8426953 Semiconductor package with an embedded printed circuit board and stacked die Apr. 23, 2013
8426255 Chip package structure and method for manufacturing the same Apr. 23, 2013
8421210 Integrated circuit packaging system with dual side connection and method of manufacture thereof Apr. 16, 2013
8409919 Method for manufacturing semiconductor device Apr. 2, 2013
8399300 Semiconductor device and method of forming adjacent channel and DAM material around die attach area of substrate to control outward flow of underfill material Mar. 19, 2013
8399265 Device for releasably receiving a semiconductor chip Mar. 19, 2013
8395269 Method of stacking semiconductor chips including forming an interconnect member and a through electrode Mar. 12, 2013
8394673 Semiconductor device Mar. 12, 2013
8389338 Embedded die package on package (POP) with pre-molded leadframe Mar. 5, 2013











 
 
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