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Class Information
Number: 257/E21.511
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo) > Involving soldering or alloying process, e.g., soldering wires (epo) > Mounting on insulating member provided with metallic leads, e.g., flip-chip mounting, conductive die mounting (epo)
Description: This subclass is indented under subclass E21.509. This subclass is substantially the same in scope as ECLA classification H01L21/60C4.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7621044 |
Method of manufacturing a resilient contact |
Nov. 24, 2009 |
| 7619312 |
Method and apparatus for precisely aligning integrated circuit chips |
Nov. 17, 2009 |
| 7615408 |
Method of manufacturing semiconductor device |
Nov. 10, 2009 |
| 7614888 |
Flip chip package process |
Nov. 10, 2009 |
| 7611925 |
Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument |
Nov. 3, 2009 |
| 7579213 |
Modified chip attach process |
Aug. 25, 2009 |
| 7579211 |
Flip-chip semiconductor device utilizing an elongated tip bump |
Aug. 25, 2009 |
| 7572665 |
Microelectronics grade metal substrate, related metal-embedded devices and methods for fabricating same |
Aug. 11, 2009 |
| 7569940 |
Method and device for connecting chips |
Aug. 4, 2009 |
| 7569420 |
Flip-chip packaging method for light emitting diode with eutectic layer not overlapping insulating layer |
Aug. 4, 2009 |
| 7564130 |
Power micro surface-mount device package |
Jul. 21, 2009 |
| 7560302 |
Semiconductor device fabricating method |
Jul. 14, 2009 |
| 7557436 |
Semiconductor device and IC card including supply voltage wiring lines formed in different areas and having different shapes |
Jul. 7, 2009 |
| 7550856 |
Grooved substrates for uniform underfilling solder ball assembled electronic devices |
Jun. 23, 2009 |
| 7547580 |
Method for manufacturing a semiconductor wiring base that includes a wiring base with wiring extending inside and outside of a mounting region |
Jun. 16, 2009 |
| 7547577 |
Method of making circuitized substrate with solder paste connections |
Jun. 16, 2009 |
| 7544538 |
Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same |
Jun. 9, 2009 |
| 7534649 |
Thermoset polyimides for microelectronic applications |
May. 19, 2009 |
| 7531906 |
Flip chip packaging using recessed interposer terminals |
May. 12, 2009 |
| 7528480 |
Circuit board, semiconductor device, and manufacturing method of circuit board |
May. 5, 2009 |
| 7524700 |
Method for manufacturing semiconductor device, and method and structure for implementing semicondutor device |
Apr. 28, 2009 |
| 7521288 |
Stacked chip semiconductor device and method for manufacturing the same |
Apr. 21, 2009 |
| 7518201 |
Method for encapsulating an electrical component, and surface acoustic wave device encapsulated using said method |
Apr. 14, 2009 |
| 7514295 |
Method for processing a base that includes connecting a first base to a second base with an insulating film |
Apr. 7, 2009 |
| 7514276 |
Aligning stacked chips using resistance assistance |
Apr. 7, 2009 |
| 7504271 |
Integrated circuit package substrate having a thin film capacitor structure |
Mar. 17, 2009 |
| 7498192 |
Methods of providing a family of related integrated circuits of different sizes |
Mar. 3, 2009 |
| 7494844 |
Method for manufacturing substrate with cavity |
Feb. 24, 2009 |
| 7485500 |
Chip module and method for producing a chip module |
Feb. 3, 2009 |
| 7485493 |
Singulating surface-mountable semiconductor devices and fitting external contacts to said devices |
Feb. 3, 2009 |
| 7482200 |
Process for fabricating chip package structure |
Jan. 27, 2009 |
| 7473998 |
Method for forming bump protective collars on a bumped wafer |
Jan. 6, 2009 |
| 7470998 |
Semiconductor device and method of manufacturing the same |
Dec. 30, 2008 |
| 7459342 |
Manufacturing method of semiconductor device |
Dec. 2, 2008 |
| 7456047 |
Thermally enhanced electronic flip-chip packaging with external-connector-side die and method |
Nov. 25, 2008 |
| 7456035 |
Flip chip light emitting diode devices having thinned or removed substrates |
Nov. 25, 2008 |
| 7452750 |
Capacitor attachment method |
Nov. 18, 2008 |
| 7452748 |
Strap assembly comprising functional block deposited therein and method of making same |
Nov. 18, 2008 |
| 7449365 |
Wafer-level flipchip package with IC circuit isolation |
Nov. 11, 2008 |
| 7445959 |
Sensor module and method of manufacturing same |
Nov. 4, 2008 |
| 7419852 |
Low temperature methods of forming back side redistribution layers in association with through wafer interconnects, semiconductor devices including same, and assemblies |
Sep. 2, 2008 |
| 7397132 |
Semiconductor device |
Jul. 8, 2008 |
| 7394151 |
Semiconductor package with plated connection |
Jul. 1, 2008 |
| 7391122 |
Techniques for flip chip package migration |
Jun. 24, 2008 |
| 7390735 |
High temperature, stable SiC device interconnects and packages having low thermal resistance |
Jun. 24, 2008 |
| 7378727 |
Memory device and a method of forming a memory device |
May. 27, 2008 |
| 7375422 |
Stacked-type semiconductor package |
May. 20, 2008 |
| 7361530 |
Method of fabricating a semiconductor integrated circuit that includes patterning a semiconductor substrate with a first photomask that uses metal for blocking light and patterning the same su |
Apr. 22, 2008 |
| 7355276 |
Thermally-enhanced circuit assembly |
Apr. 8, 2008 |
| 7341890 |
Circuit board with built-in electronic component and method for manufacturing the same |
Mar. 11, 2008 |
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