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Browse by Category: Main > Physics
Class Information
Number: 257/E21.51
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo) > Involving soldering or alloying process, e.g., soldering wires (epo) > Mounting on metallic conductive member (epo)
Description: This subclass is indented under subclass E21.509. This subclass is substantially the same in scope as ECLA classification H01L21/60C2.










Patents under this class:
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Patent Number Title Of Patent Date Issued
8685794 Lead frame land grid array with routing connector trace under unit Apr. 1, 2014
8673689 Single layer BGA substrate process Mar. 18, 2014
8652879 Lead frame ball grid array with traces under die Feb. 18, 2014
8637974 Integrated circuit packaging system with tiebar-less design and method of manufacture thereof Jan. 28, 2014
8633061 Method of fabricating package structure Jan. 21, 2014
8623708 Integrated circuit packaging system with grid-array mechanism and method of manufacture thereof Jan. 7, 2014
8617933 Integrated circuit packaging system with interlock and method of manufacture thereof Dec. 31, 2013
8618641 Leadframe-based semiconductor package Dec. 31, 2013
8609446 Method and apparatus for accurate die-to-wafer bonding Dec. 17, 2013
8610146 Light emitting diode package and method of manufacturing the same Dec. 17, 2013
8603864 Method of fabricating a semiconductor device Dec. 10, 2013
8586475 Semiconductor device including gate electrode for applying tensile stress to silicon substrate, and method of manufacturing the same Nov. 19, 2013
8564124 Semiconductor package Oct. 22, 2013
8564110 Power device with bottom source electrode Oct. 22, 2013
8546160 Method for packaging light emitting diodes Oct. 1, 2013
8492242 Dry flux bonding device and method Jul. 23, 2013
8492883 Semiconductor package having a cavity structure Jul. 23, 2013
8481364 Flexible micro-system and fabrication method thereof Jul. 9, 2013
8460970 Lead frame ball grid array with traces under die having interlocking features Jun. 11, 2013
8431477 Method for joining aligned discrete optical elements Apr. 30, 2013
8426963 Power semiconductor package structure and manufacturing method thereof Apr. 23, 2013
8377797 Method for bonding of semiconductor component to a substrate Feb. 19, 2013
8372747 Semiconductor device including gate electrode for applying tensile stress to silicon substrate, and method of manufacturing the same Feb. 12, 2013
8367472 Method of fabricating a 3-D device Feb. 5, 2013
8368203 Heat radiation member for a semiconductor package with a power element and a control circuit Feb. 5, 2013
8354303 Thermally enhanced low parasitic power semiconductor package Jan. 15, 2013
8350263 Semiconductor package, method of evaluating same, and method of manufacturing same Jan. 8, 2013
8304293 Thermally enhanced semiconductor package Nov. 6, 2012
8278143 Manufacturing method for electronic devices Oct. 2, 2012
8268716 Creation of lead-free solder joint with intermetallics Sep. 18, 2012
8247247 Method of manufacturing LED module Aug. 21, 2012
8247271 Formation of alpha particle shields in chip packaging Aug. 21, 2012
8236610 Forming semiconductor chip connections Aug. 7, 2012
8216880 Wire bonding on reactive metal surfaces of a metallization of a semiconductor device by providing a protection layer Jul. 10, 2012
8207590 Image sensor, substrate for the same, image sensing device including the image sensor, and associated methods Jun. 26, 2012
8198139 Power device package and method of fabricating the same Jun. 12, 2012
8173454 Light emitting diode package and method of manufacturing the same May. 8, 2012
8158459 Substrate bonding method and semiconductor device Apr. 17, 2012
8148253 Electronic component soldering structure and electronic component soldering method Apr. 3, 2012
8129228 Manufacturing method for integrating a shunt resistor into a semiconductor package Mar. 6, 2012
8120148 Package structure with embedded die and method of fabricating the same Feb. 21, 2012
8097484 Solar cell receiver component placement control with positioning receptacles Jan. 17, 2012
8071472 Semiconductor device with solder balls having high reliability Dec. 6, 2011
8071426 Method and apparatus for no lead semiconductor package Dec. 6, 2011
8048692 LED light emitter with heat sink holder and method for manufacturing the same Nov. 1, 2011
8039384 Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces Oct. 18, 2011
8030741 Electronic device Oct. 4, 2011
8026566 Semiconductor device and method for manufacturing semiconductor device Sep. 27, 2011
8008182 Semiconductor device and method for manufacturing semiconductor device Aug. 30, 2011
8004069 Lead frame based semiconductor package and a method of manufacturing the same Aug. 23, 2011

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