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Class Information
Number: 257/E21.509
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo) > Involving soldering or alloying process, e.g., soldering wires (epo)
Description: This subclass is indented under subclass E21.506. This subclass is substantially the same in scope as ECLA classification H01L21/60C.
Sub-classes under this class:
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7427517 |
Stacking apparatus and method for stacking integrated circuit elements |
Sep. 23, 2008 |
| 7393772 |
Wirebond structure and method to connect to a microelectronic die |
Jul. 1, 2008 |
| 7384818 |
Electronic package for image sensor, and the packaging method thereof |
Jun. 10, 2008 |
| 7368824 |
Diffusion solder position, and process for producing it |
May. 6, 2008 |
| 7355280 |
Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument |
Apr. 8, 2008 |
| 7348215 |
Methods for assembly and packaging of flip chip configured dice with interposer |
Mar. 25, 2008 |
| 7331737 |
Method of forming a semiconductor device having bonding pad of the second chip thinner than bonding pad of the first chip |
Feb. 19, 2008 |
| 7332424 |
Fluxless solder transfer and reflow process |
Feb. 19, 2008 |
| 7300819 |
Semiconductor device, method for mounting the same, and method for repairing the same |
Nov. 27, 2007 |
| 7298049 |
Submount for mounting semiconductor device |
Nov. 20, 2007 |
| 7294906 |
Wiring technique |
Nov. 13, 2007 |
| 7291900 |
Lead frame-based semiconductor device packages incorporating at least one land grid array package |
Nov. 6, 2007 |
| 7276437 |
Semiconductor device and manufacturing method thereof |
Oct. 2, 2007 |
| 7259449 |
Method and system for sealing a substrate |
Aug. 21, 2007 |
| 7253026 |
Ultra-thin semiconductor package device and method for manufacturing the same |
Aug. 7, 2007 |
| 7232740 |
Method for bumping a thin wafer |
Jun. 19, 2007 |
| 7224066 |
Bonding material and circuit device using the same |
May. 29, 2007 |
| 7220663 |
Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby |
May. 22, 2007 |
| 7221055 |
System and method for die attach using a backside heat spreader |
May. 22, 2007 |
| 7214604 |
Method of fabricating ultra thin flip-chip package |
May. 8, 2007 |
| 7164208 |
Semiconductor device and method for manufacturing the same |
Jan. 16, 2007 |
| 7145251 |
Colored conductive wires for a semiconductor package |
Dec. 5, 2006 |
| 7141453 |
Method of mounting wafer on printed wiring substrate |
Nov. 28, 2006 |
| 7119003 |
Extension of fatigue life for C4 solder ball to chip connection |
Oct. 10, 2006 |
| 7087513 |
Method to produce low strength temporary solder joints |
Aug. 8, 2006 |
| 7064566 |
Probe card assembly and kit |
Jun. 20, 2006 |
| 7061257 |
Probe card assembly |
Jun. 13, 2006 |
| 7036216 |
Method and apparatus for connecting at least one chip to an external wiring configuration |
May. 2, 2006 |
| 6956174 |
Tip structures |
Oct. 18, 2005 |
| 6949814 |
Mounting material, semiconductor device and method of manufacturing semiconductor device |
Sep. 27, 2005 |
| 6936500 |
Method for the lateral contacting of a semiconductor chip |
Aug. 30, 2005 |
| 6937037 |
Probe card assembly for contacting a device with raised contact elements |
Aug. 30, 2005 |
| 6919644 |
Semiconductor device manufacturing method and semiconductor device manufactured thereby |
Jul. 19, 2005 |
| 6916739 |
Structural element and process for its production including bonding through an amorphous hard layer |
Jul. 12, 2005 |
| 6913468 |
Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods |
Jul. 5, 2005 |
| 6864579 |
Carrier with a metal area and at least one chip configured on the metal area |
Mar. 8, 2005 |
| 6838893 |
Probe card assembly |
Jan. 4, 2005 |
| 6835898 |
ELECTRICAL CONTACT STRUCTURES FORMED BY CONFIGURING A FLEXIBLE WIRE TO HAVE A SPRINGABLE SHAPE AND OVERCOATING THE WIRE WITH AT LEAST ONE LAYER OF A RESILIENT CONDUCTIVE MATERIAL, METHODS OF M |
Dec. 28, 2004 |
| 6818840 |
Method for manufacturing raised electrical contact pattern of controlled geometry |
Nov. 16, 2004 |
| 6778406 |
Resilient contact structures for interconnecting electronic devices |
Aug. 17, 2004 |
| 6741085 |
Contact carriers (tiles) for populating larger substrates with spring contacts |
May. 25, 2004 |
| 6727579 |
ELECTRICAL CONTACT STRUCTURES FORMED BY CONFIGURING A FLEXIBLE WIRE TO HAVE A SPRINGABLE SHAPE AND OVERCOATING THE WIRE WITH AT LEAST ONE LAYER OF A RESILIENT CONDUCTIVE MATERIAL, METHODS OF M |
Apr. 27, 2004 |
| 6685817 |
Method and apparatus for controlling plating over a face of a substrate |
Feb. 3, 2004 |
| 6669489 |
Interposer, socket and assembly for socketing an electronic component and method of making and using same |
Dec. 30, 2003 |
| 6660563 |
Method and system for assembling a printed circuit board using a land grid array |
Dec. 9, 2003 |
| 6655023 |
Method and apparatus for burning-in semiconductor devices in wafer form |
Dec. 2, 2003 |
| 6653170 |
Semiconductor chip assembly with elongated wire ball bonded to chip and electrolessly plated to support circuit |
Nov. 25, 2003 |
| 6624648 |
Probe card assembly |
Sep. 23, 2003 |
| 6615485 |
Probe card assembly and kit, and methods of making same |
Sep. 9, 2003 |
| 6581820 |
Lead bonding method for SMD package |
Jun. 24, 2003 |
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