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Class Information
Number: 257/E21.509
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo) > Involving soldering or alloying process, e.g., soldering wires (epo)
Description: This subclass is indented under subclass E21.506. This subclass is substantially the same in scope as ECLA classification H01L21/60C.

Sub-classes under this class:

Class Number Class Name Patents
257/E21.511 Mounting on insulating member provided with metallic leads, e.g., flip-chip mounting, conductive die mounting (epo) 1,691
257/E21.51 Mounting on metallic conductive member (epo) 260
257/E21.513 Mounting on semiconductor conductive member (epo) 57

Patents under this class:
1 2 3 4 5 6 7 8

Patent Number Title Of Patent Date Issued
8710666 Semiconductor device and method for fabricating the same Apr. 29, 2014
8709866 Methods of forming integrated circuit packages Apr. 29, 2014
8679591 Method for reducing voids in a copper-tin interface and structure formed thereby Mar. 25, 2014
8679898 Semiconductor device and production method therefor Mar. 25, 2014
8673684 Semiconductor device and manufacturing method thereof Mar. 18, 2014
8659113 Embedded semiconductor die package and method of making the same using metal frame carrier Feb. 25, 2014
8653668 Copper bonding wire for semiconductor device and bonding structure thereof Feb. 18, 2014
8637394 Integrated circuit package system with flex bump Jan. 28, 2014
8629567 Integrated circuit packaging system with contacts and method of manufacture thereof Jan. 14, 2014
8623754 Repairing anomalous stiff pillar bumps Jan. 7, 2014
8597978 Method for attaching wide bus memory and serial memory to a processor within a chip scale package footprint Dec. 3, 2013
8587104 Wiring board and semiconductor package Nov. 19, 2013
8587098 Integrated circuit protruding pad package system and method for manufacturing thereof Nov. 19, 2013
8586418 Method for the production of an electronic component and electronic component produced according to this method Nov. 19, 2013
8581421 Semiconductor package manufacturing method and semiconductor package Nov. 12, 2013
8569163 Ultrasonic wire bonding method for a semiconductor device Oct. 29, 2013
8569878 Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same Oct. 29, 2013
8558396 Bond pad configurations for semiconductor dies Oct. 15, 2013
8552570 Wiring board, semiconductor device, and method for manufacturing wiring board and semiconductor device Oct. 8, 2013
8541299 Electrical interconnect forming method Sep. 24, 2013
8541259 Semiconductor device and manufacturing method thereof Sep. 24, 2013
8531031 Integrated circuit packages Sep. 10, 2013
8525353 Microspring structures adapted for target device cooling Sep. 3, 2013
8518814 Methods of fabrication of high-density laser diode stacks Aug. 27, 2013
8519537 3D semiconductor package interposer with die cavity Aug. 27, 2013
8513057 Integrated circuit packaging system with routable underlayer and method of manufacture thereof Aug. 20, 2013
8502375 Corrugated die edge for stacked die semiconductor package Aug. 6, 2013
8487424 Routable array metal integrated circuit package fabricated using partial etching process Jul. 16, 2013
8481367 Method of manufacturing circuit device Jul. 9, 2013
8476135 Integrated circuit packaging system with vertical interconnects and method of manufacture thereof Jul. 2, 2013
8471386 Junction body, semiconductor module, and manufacturing method for junction body Jun. 25, 2013
8461657 Methods for forming a micro electro-mechanical device Jun. 11, 2013
8455304 Routable array metal integrated circuit package fabricated using partial etching process Jun. 4, 2013
8450206 Method of forming a semiconductor device including a stress buffer material formed above a low-k metallization system May. 28, 2013
8440472 Stacking apparatus and method for stacking integrated circuit elements May. 14, 2013
8436471 Semiconductor package with its surface edge covered by resin May. 7, 2013
8432024 Integrated circuit including bond wire directly bonded to pad Apr. 30, 2013
8421089 Light emitting device Apr. 16, 2013
8409919 Method for manufacturing semiconductor device Apr. 2, 2013
8409978 Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe Apr. 2, 2013
8395252 Integrated MEMS and CMOS package and method Mar. 12, 2013
8390129 Semiconductor device with a plurality of mark through substrate vias Mar. 5, 2013
8378471 Semiconductor chip bump connection apparatus and method Feb. 19, 2013
8367477 Electronic device package and method for forming the same Feb. 5, 2013
8368216 Semiconductor package Feb. 5, 2013
8354750 Stress buffer structures in a mounting structure of a semiconductor device Jan. 15, 2013
8349660 Cavity closure process for at least one microelectronic device Jan. 8, 2013
8334169 Integrated circuit packaging system and method of manufacture thereof Dec. 18, 2012
8330239 Shielding for a micro electro-mechanical device and method therefor Dec. 11, 2012
8330272 Microelectronic packages with dual or multiple-etched flip-chip connectors Dec. 11, 2012

1 2 3 4 5 6 7 8

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