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Class Information
Number: 257/E21.508
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo) > Formation of contacts to semiconductor by use of metal layers separated by insulating layers, e.g., self-aligned contacts to source/drain or emitter/base (epo) > Forming solder bumps (epo)
Description: This subclass is indented under subclass E21.507. This subclass is substantially the same in scope as ECLA classification H01L21/60B2.










Patents under this class:

Patent Number Title Of Patent Date Issued
7064434 Customized microelectronic device and method for making customized electrical interconnections Jun. 20, 2006
7064446 Under bump metallization layer to enable use of high tin content solder bumps Jun. 20, 2006
7064447 Bond pad structure comprising multiple bond pads with metal overlap Jun. 20, 2006
7064566 Probe card assembly and kit Jun. 20, 2006
7060526 Wafer level methods for fabricating multi-dice chip scale semiconductor components Jun. 13, 2006
7060528 Method for mounting a semiconductor element to an interposer by compression bonding Jun. 13, 2006
7060602 Method of manufacturing electronic part and mounting electronic part Jun. 13, 2006
7061257 Probe card assembly Jun. 13, 2006
7056406 Porous adhesive sheet, semiconductor wafer with porous adhesive sheet and method of manufacture thereof Jun. 6, 2006
7056818 Semiconductor device with under bump metallurgy and method for fabricating the same Jun. 6, 2006
7052984 Bump formation method and bump forming apparatus for semiconductor wafer May. 30, 2006
7053479 Package of semiconductor device and its manufacturing method May. 30, 2006
7049217 Method of forming multi-piled bump May. 23, 2006
7049686 Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument May. 23, 2006
7043830 Method of forming conductive bumps May. 16, 2006
7045388 Semiconductor device provided with low melting point metal bumps May. 16, 2006
7045389 Method for fabricating a semiconductor devices provided with low melting point metal bumps May. 16, 2006
7041589 Metal bump with an insulating sidewall and method of fabricating thereof May. 9, 2006
7042089 Group III nitride compound semiconductor device May. 9, 2006
7037759 Semiconductor package and method for manufacturing the same May. 2, 2006
7034394 Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same Apr. 25, 2006
7028879 System for depositing connection sites on micro C-4 semiconductor die Apr. 18, 2006
7029946 Method for manufacturing semiconductor device and semiconductor device Apr. 18, 2006
7029947 Flip chip in leaded molded package with two dies Apr. 18, 2006
7029949 Method for fabricating encapsulated semiconductor components having conductive vias Apr. 18, 2006
7031509 Method and apparatus for correcting inclination of IC on semiconductor wafer Apr. 18, 2006
7026233 Method for reducing defects in post passivation interconnect process Apr. 11, 2006
7026234 Parasitic capacitance-preventing dummy solder bump structure and method of making the same Apr. 11, 2006
7026239 Method for making an anisotropic conductive polymer film on a semiconductor wafer Apr. 11, 2006
7026721 Method of improving copper pad adhesion Apr. 11, 2006
7021521 Bump connection and method and apparatus for forming said connection Apr. 4, 2006
7022548 Method for making a semiconductor die package Apr. 4, 2006
7019405 Terminal, semiconductor device, terminal forming method and flip chip semiconductor device manufacturing method Mar. 28, 2006
7015127 Semiconductor device and a method of manufacturing the same Mar. 21, 2006
7015129 Bond pad scheme for Cu process Mar. 21, 2006
7015130 Method for making UBM pads and bumps on wafer Mar. 21, 2006
7015132 Forming an electrical contact on an electronic component Mar. 21, 2006
7012018 Metallic strain-absorbing layer for improved fatigue resistance of solder-attached devices Mar. 14, 2006
7012333 Lead free bump and method of forming the same Mar. 14, 2006
7012334 Semiconductor chip with bumps and method for manufacturing the same Mar. 14, 2006
7007833 Forming solder balls on substrates Mar. 7, 2006
7007834 Contact bump construction for the production of a connector construction for substrate connecting surfaces Mar. 7, 2006
7008867 Method for forming copper bump antioxidation surface Mar. 7, 2006
7008868 Passivation scheme for bumped wafers Mar. 7, 2006
7009294 Production process for semiconductor device Mar. 7, 2006
7001786 Semiconductor device and method for fabricating the same Feb. 21, 2006
6998335 Structure and method for fabricating a bond pad structure Feb. 14, 2006
6998339 Method of forming conductor wiring pattern Feb. 14, 2006
6998346 Method for the patterned, selective metallization of a surface of a substrate Feb. 14, 2006
6998539 Standoff/mask structure for electrical interconnect Feb. 14, 2006











 
 
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