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Class Information
Number: 257/E21.508
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo) > Formation of contacts to semiconductor by use of metal layers separated by insulating layers, e.g., self-aligned contacts to source/drain or emitter/base (epo) > Forming solder bumps (epo)
Description: This subclass is indented under subclass E21.507. This subclass is substantially the same in scope as ECLA classification H01L21/60B2.










Patents under this class:

Patent Number Title Of Patent Date Issued
7489037 Semiconductor device and fabrication method thereof Feb. 10, 2009
7485565 Nickel bonding cap over copper metalized bondpads Feb. 3, 2009
7485564 Undercut-free BLM process for Pb-free and Pb-reduced C4 Feb. 3, 2009
7485562 Method of making multichip wafer level packages and computing systems incorporating same Feb. 3, 2009
7476980 Die configurations and methods of manufacture Jan. 13, 2009
7473998 Method for forming bump protective collars on a bumped wafer Jan. 6, 2009
7473629 Substrate structure having a solder mask and a process for making the same Jan. 6, 2009
7470998 Semiconductor device and method of manufacturing the same Dec. 30, 2008
7465653 Reliable metal bumps on top of I/O pads after removal of test probe marks Dec. 16, 2008
7462556 Method of forming low stress multi-layer metallurgical structures and high reliable lead free solder termination electrodes Dec. 9, 2008
7459785 Electrical interconnection structure formation Dec. 2, 2008
7459386 Method for forming solder bumps of increased height Dec. 2, 2008
7459373 Method for fabricating and separating semiconductor devices Dec. 2, 2008
7456090 Method to reduce UBM undercut Nov. 25, 2008
7452799 Ball film for integrated circuit fabrication and testing Nov. 18, 2008
7452747 Semiconductor package with contact support layer and method to produce the package Nov. 18, 2008
7445958 Semiconductor device having a leading wiring layer Nov. 4, 2008
7445957 Method for fabricating wafer level semiconductor package with build-up layer Nov. 4, 2008
7427558 Method of forming solder ball, and fabricating method and structure of semiconductor package using the same Sep. 23, 2008
7427557 Methods of forming bumps using barrier layers as etch masks Sep. 23, 2008
7422973 Method for forming multi-layer bumps on a substrate Sep. 9, 2008
7420280 Reduced stress under bump metallization structure Sep. 2, 2008
7416980 Forming a barrier layer in interconnect joints and structures formed thereby Aug. 26, 2008
7411210 Semiconductor probe with resistive tip having metal shield thereon Aug. 12, 2008
7408261 BGA package board and method for manufacturing the same Aug. 5, 2008
7405144 Method for manufacturing probe card Jul. 29, 2008
7399695 Integrated die bumping process Jul. 15, 2008
7396752 Method and apparatus for reducing cold joint defects in flip chip products Jul. 8, 2008
7391112 Capping copper bumps Jun. 24, 2008
7390697 Enhanced adhesion strength between mold resin and polyimide Jun. 24, 2008
7388288 Flip chip metallization method and devices Jun. 17, 2008
7375021 Method and structure for eliminating aluminum terminal pad material in semiconductor devices May. 20, 2008
7375020 Method of forming bumps May. 20, 2008
7372153 Integrated circuit package bond pad having plurality of conductive members May. 13, 2008
7364998 Method for forming high reliability bump structure Apr. 29, 2008
7358177 Fabrication method of under bump metallurgy structure Apr. 15, 2008
7355285 Structure of mounting electronic component Apr. 8, 2008
7355280 Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument Apr. 8, 2008
7344971 Manufacturing method of semiconductor device Mar. 18, 2008
7332424 Fluxless solder transfer and reflow process Feb. 19, 2008
7329563 Method for fabrication of wafer level package incorporating dual compliant layers Feb. 12, 2008
7329562 Process of producing semiconductor chip with surface interconnection at bump Feb. 12, 2008
7326638 Method for manufacturing semiconductor device Feb. 5, 2008
7323780 Electrical interconnection structure formation Jan. 29, 2008
7323405 Fine pitch low cost flip chip substrate Jan. 29, 2008
7314818 Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment Jan. 1, 2008
7312142 Method for making cable with a conductive bump array, and method for connecting the cable to a task object Dec. 25, 2007
7309647 Method of mounting an electroless nickel immersion gold flip chip package Dec. 18, 2007
7307001 Wafer repair method using direct-writing Dec. 11, 2007
7304391 Modified chip attach process and apparatus Dec. 4, 2007











 
 
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