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Class Information
Number: 257/E21.508
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo) > Formation of contacts to semiconductor by use of metal layers separated by insulating layers, e.g., self-aligned contacts to source/drain or emitter/base (epo) > Forming solder bumps (epo)
Description: This subclass is indented under subclass E21.507. This subclass is substantially the same in scope as ECLA classification H01L21/60B2.
Patents under this class:
| Patent Number |
Title Of Patent |
Date Issued |
| 7485564 |
Undercut-free BLM process for Pb-free and Pb-reduced C4 |
Feb. 3, 2009 |
| 7485562 |
Method of making multichip wafer level packages and computing systems incorporating same |
Feb. 3, 2009 |
| 7476980 |
Die configurations and methods of manufacture |
Jan. 13, 2009 |
| 7473998 |
Method for forming bump protective collars on a bumped wafer |
Jan. 6, 2009 |
| 7473629 |
Substrate structure having a solder mask and a process for making the same |
Jan. 6, 2009 |
| 7470998 |
Semiconductor device and method of manufacturing the same |
Dec. 30, 2008 |
| 7465653 |
Reliable metal bumps on top of I/O pads after removal of test probe marks |
Dec. 16, 2008 |
| 7462556 |
Method of forming low stress multi-layer metallurgical structures and high reliable lead free solder termination electrodes |
Dec. 9, 2008 |
| 7459785 |
Electrical interconnection structure formation |
Dec. 2, 2008 |
| 7459386 |
Method for forming solder bumps of increased height |
Dec. 2, 2008 |
| 7459373 |
Method for fabricating and separating semiconductor devices |
Dec. 2, 2008 |
| 7456090 |
Method to reduce UBM undercut |
Nov. 25, 2008 |
| 7452799 |
Ball film for integrated circuit fabrication and testing |
Nov. 18, 2008 |
| 7452747 |
Semiconductor package with contact support layer and method to produce the package |
Nov. 18, 2008 |
| 7445958 |
Semiconductor device having a leading wiring layer |
Nov. 4, 2008 |
| 7445957 |
Method for fabricating wafer level semiconductor package with build-up layer |
Nov. 4, 2008 |
| 7427558 |
Method of forming solder ball, and fabricating method and structure of semiconductor package using the same |
Sep. 23, 2008 |
| 7427557 |
Methods of forming bumps using barrier layers as etch masks |
Sep. 23, 2008 |
| 7422973 |
Method for forming multi-layer bumps on a substrate |
Sep. 9, 2008 |
| 7420280 |
Reduced stress under bump metallization structure |
Sep. 2, 2008 |
| 7416980 |
Forming a barrier layer in interconnect joints and structures formed thereby |
Aug. 26, 2008 |
| 7411210 |
Semiconductor probe with resistive tip having metal shield thereon |
Aug. 12, 2008 |
| 7408261 |
BGA package board and method for manufacturing the same |
Aug. 5, 2008 |
| 7405144 |
Method for manufacturing probe card |
Jul. 29, 2008 |
| 7399695 |
Integrated die bumping process |
Jul. 15, 2008 |
| 7396752 |
Method and apparatus for reducing cold joint defects in flip chip products |
Jul. 8, 2008 |
| 7391112 |
Capping copper bumps |
Jun. 24, 2008 |
| 7390697 |
Enhanced adhesion strength between mold resin and polyimide |
Jun. 24, 2008 |
| 7388288 |
Flip chip metallization method and devices |
Jun. 17, 2008 |
| 7375021 |
Method and structure for eliminating aluminum terminal pad material in semiconductor devices |
May. 20, 2008 |
| 7375020 |
Method of forming bumps |
May. 20, 2008 |
| 7372153 |
Integrated circuit package bond pad having plurality of conductive members |
May. 13, 2008 |
| 7364998 |
Method for forming high reliability bump structure |
Apr. 29, 2008 |
| 7358177 |
Fabrication method of under bump metallurgy structure |
Apr. 15, 2008 |
| 7355285 |
Structure of mounting electronic component |
Apr. 8, 2008 |
| 7355280 |
Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument |
Apr. 8, 2008 |
| 7344971 |
Manufacturing method of semiconductor device |
Mar. 18, 2008 |
| 7332424 |
Fluxless solder transfer and reflow process |
Feb. 19, 2008 |
| 7329563 |
Method for fabrication of wafer level package incorporating dual compliant layers |
Feb. 12, 2008 |
| 7329562 |
Process of producing semiconductor chip with surface interconnection at bump |
Feb. 12, 2008 |
| 7326638 |
Method for manufacturing semiconductor device |
Feb. 5, 2008 |
| 7323780 |
Electrical interconnection structure formation |
Jan. 29, 2008 |
| 7323405 |
Fine pitch low cost flip chip substrate |
Jan. 29, 2008 |
| 7314818 |
Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment |
Jan. 1, 2008 |
| 7312142 |
Method for making cable with a conductive bump array, and method for connecting the cable to a task object |
Dec. 25, 2007 |
| 7309647 |
Method of mounting an electroless nickel immersion gold flip chip package |
Dec. 18, 2007 |
| 7307001 |
Wafer repair method using direct-writing |
Dec. 11, 2007 |
| 7304391 |
Modified chip attach process and apparatus |
Dec. 4, 2007 |
| 7303947 |
Source bridge for cooling and/or external connection |
Dec. 4, 2007 |
| 7301244 |
Semiconductor device |
Nov. 27, 2007 |
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