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Class Information
Number: 257/E21.508
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo) > Formation of contacts to semiconductor by use of metal layers separated by insulating layers, e.g., self-aligned contacts to source/drain or emitter/base (epo) > Forming solder bumps (epo)
Description: This subclass is indented under subclass E21.507. This subclass is substantially the same in scope as ECLA classification H01L21/60B2.










Patents under this class:

Patent Number Title Of Patent Date Issued
7632749 Semiconductor device having a pad metal layer and a lower metal layer that are electrically coupled, whereas apertures are formed in the lower metal layer below a center area of the pad metal Dec. 15, 2009
7632709 Method of manufacturing wafer level package Dec. 15, 2009
7632708 Microelectronic component with photo-imageable substrate Dec. 15, 2009
7629687 Semiconductor device and method for manufacturing the same Dec. 8, 2009
7629246 High strength solder joint formation method for wafer level packages and flip applications Dec. 8, 2009
7626275 Semiconductor device Dec. 1, 2009
7625815 Reduced leakage interconnect structure Dec. 1, 2009
7619309 Integrated connection arrangements Nov. 17, 2009
7618847 Bonding method of semiconductor and laminated structure fabricated thereby Nov. 17, 2009
7615865 Standoff height improvement for bumping technology using solder resist Nov. 10, 2009
7615476 Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages Nov. 10, 2009
7615407 Methods and systems for packaging integrated circuits with integrated passive components Nov. 10, 2009
7615405 Method for precision assembly of integrated circuit chip packages Nov. 10, 2009
7612456 Electronic device, semiconductor device using same, and method for manufacturing semiconductor device Nov. 3, 2009
7612450 Semiconductor package including dummy board and method of fabricating the same Nov. 3, 2009
7601628 Wire and solder bond forming methods Oct. 13, 2009
7601612 Method for forming solder joints for a flip chip assembly Oct. 13, 2009
7592707 Method and apparatus for facilitating proximity communication and power delivery Sep. 22, 2009
7589417 Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same Sep. 15, 2009
7585759 Technique for efficiently patterning an underbump metallization layer using a dry etch process Sep. 8, 2009
7579213 Modified chip attach process Aug. 25, 2009
7572673 Wafer level package having a stress relief spacer and manufacturing method thereof Aug. 11, 2009
7569472 Method and apparatus of power ring positioning to minimize crosstalk Aug. 4, 2009
7569471 Method of providing mixed size solder bumps on a substrate using a solder delivery head Aug. 4, 2009
7569467 Semiconductor device and manufacturing method thereof Aug. 4, 2009
7566575 Mounting circuit and method for producing semiconductor-chip-mounting circuit Jul. 28, 2009
7560373 Low temperature solder metallurgy and process for packaging applications and structures formed thereby Jul. 14, 2009
7553751 Method of forming solder bump with reduced surface defects Jun. 30, 2009
7553750 Method for fabricating electrical conductive structure of circuit board Jun. 30, 2009
7550376 Semiconductor device capable of suppressing current concentration in pad and its manufacture method Jun. 23, 2009
7545028 Solder ball assembly for a semiconductor device and method of fabricating same Jun. 9, 2009
7544538 Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same Jun. 9, 2009
7541273 Method for forming bumps Jun. 2, 2009
7541272 Damascene patterning of barrier layer metal for C4 solder bumps Jun. 2, 2009
7538435 Wafer structure and bumping process May. 26, 2009
7538020 Chip packaging process May. 26, 2009
7534715 Methods including fluxless chip attach processes May. 19, 2009
7528478 Semiconductor devices having post passivation interconnections and a buffer layer May. 5, 2009
7521287 Wire and solder bond forming methods Apr. 21, 2009
7517788 System, apparatus, and method for advanced solder bumping Apr. 14, 2009
7514798 Arrangement for the protection of three-dimensional structures on wafers Apr. 7, 2009
7514788 Structure of mounting electronic component Apr. 7, 2009
7514351 Solder ball mounting method and solder ball mounting substrate manufacturing method Apr. 7, 2009
7507655 Method of forming solder connection portions, method of forming wiring substrate and method of producing semiconductor device Mar. 24, 2009
7507654 Method for mounting electronic element on a circuit board Mar. 24, 2009
7501338 Semiconductor package substrate fabrication method Mar. 10, 2009
7501337 Dual metal stud bumping for flip chip applications Mar. 10, 2009
7501311 Fabrication method of a wafer structure Mar. 10, 2009
7494912 Terminal pad structures and methods of fabricating same Feb. 24, 2009
7494844 Method for manufacturing substrate with cavity Feb. 24, 2009











 
 
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