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Class Information
Number: 257/E21.508
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo) > Formation of contacts to semiconductor by use of metal layers separated by insulating layers, e.g., self-aligned contacts to source/drain or emitter/base (epo) > Forming solder bumps (epo)
Description: This subclass is indented under subclass E21.507. This subclass is substantially the same in scope as ECLA classification H01L21/60B2.

Patents under this class:

Patent Number Title Of Patent Date Issued
7795074 WLCSP target and method for forming the same Sep. 14, 2010
7791196 Semiconductor device having a smaller electrostatic capacitance electrode Sep. 7, 2010
7790598 System, apparatus, and method for advanced solder bumping Sep. 7, 2010
7781323 Semiconductor device and manufacturing method thereof Aug. 24, 2010
7777333 Structure and method for fabricating flip chip devices Aug. 17, 2010
7776734 Barrier layer for fine-pitch mask-based substrate bumping Aug. 17, 2010
7772105 Semiconductor component with plastic housing, and process for producing the same Aug. 10, 2010
7768125 Multi-chip package system Aug. 3, 2010
7759803 Semiconductor device and method of manufacturing the same Jul. 20, 2010
7759786 Electronic circuit chip, and electronic circuit device and method for manufacturing the same Jul. 20, 2010
7759776 Space transformer having multi-layer pad structures Jul. 20, 2010
7759240 Use of palladium in IC manufacturing with conductive polymer bump Jul. 20, 2010
7750468 Semiconductor device and method for manufacturing the same Jul. 6, 2010
7749887 Methods of fluxless micro-piercing of solder balls, and resulting devices Jul. 6, 2010
7749886 Microelectronic assemblies having compliancy and methods therefor Jul. 6, 2010
7745944 Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts Jun. 29, 2010
7745258 Manufacturing method of semiconductor device Jun. 29, 2010
7741148 Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural support Jun. 22, 2010
7732320 Apparatus and method for semiconductor wafer bumping via injection molded solder Jun. 8, 2010
7727814 Microelectronic package interconnect and method of fabrication thereof Jun. 1, 2010
7727801 Apparatus for improved power distribution in wirebond semiconductor packages Jun. 1, 2010
7723224 Microelectronic assembly with back side metallization and method for forming the same May. 25, 2010
7723158 Method for producing and cleaning surface-mountable bases with external contacts May. 25, 2010
7719120 Multi-component integrated circuit contacts May. 18, 2010
7718523 Solder attach film and method of forming solder ball using the same May. 18, 2010
7718511 Processing method for wafer May. 18, 2010
7714414 Method and apparatus for polymer dielectric surface recovery by ion implantation May. 11, 2010
7713861 Method of forming metallic bump and seal for semiconductor device May. 11, 2010
7713860 Method of forming metallic bump on I/O pad May. 11, 2010
7713859 Tin-silver solder bumping in electronics manufacture May. 11, 2010
7713858 Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same May. 11, 2010
7701056 Redistribution connecting structure of solder balls Apr. 20, 2010
7700406 Methods of assembling integrated circuit packages Apr. 20, 2010
7696082 Semiconductor device manufacturing method, semiconductor device, and wiring board Apr. 13, 2010
7692297 Semiconductor device, semiconductor device module and method of manufacturing the semiconductor device Apr. 6, 2010
7691671 Radiant energy heating for die attach Apr. 6, 2010
7691670 Interconnection of lead frame to die utilizing flip chip process Apr. 6, 2010
7682961 Methods of forming solder connections and structure thereof Mar. 23, 2010
7682960 Method of fabricating a wafer structure having a pad and a first protection layer and a second protection layer Mar. 23, 2010
7682959 Method of forming solder bump on high topography plated Cu Mar. 23, 2010
7666780 Alignment verification for C4NP solder transfer Feb. 23, 2010
7666779 Fabrication method of a semiconductor device Feb. 23, 2010
7662666 Method of processing wafer Feb. 16, 2010
7659192 Methods of forming stepped bumps and structures formed thereby Feb. 9, 2010
7656042 Stratified underfill in an IC package Feb. 2, 2010
7651882 RFID tag circuit die with shielding layer to control I/O bump flow Jan. 26, 2010
7649257 Discrete placement of radiation sources on integrated circuit devices Jan. 19, 2010
7642128 Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP Jan. 5, 2010
7638421 Manufacturing method for semiconductor device and semiconductor device Dec. 29, 2009
7632750 Arrangement for solder bump formation on wafers Dec. 15, 2009

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