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Class Information
Number: 257/E21.508
Name: Active solid-state devices (e.g., transistors, solid-state diodes) > Processes or apparatus adapted for manufacture or treatment of semiconductor or solid-state devices or of parts thereof (epo) > Manufacture or treatment of semiconductor device (epo) > Device having at least one potential-jump barrier or surface barrier, e.g., pn junction, depletion layer, carrier concentration layer (epo) > Assembling semiconductor devices, e.g., packaging , including mounting, encapsulating, or treatment of packaged semiconductor (epo) > Attaching or detaching leads or other conductive members, to be used for carrying current to or from device in operation (epo) > Formation of contacts to semiconductor by use of metal layers separated by insulating layers, e.g., self-aligned contacts to source/drain or emitter/base (epo) > Forming solder bumps (epo)
Description: This subclass is indented under subclass E21.507. This subclass is substantially the same in scope as ECLA classification H01L21/60B2.

Patents under this class:

Patent Number Title Of Patent Date Issued
7977157 Methods of forming integrated circuit packages, and methods of assembling integrated circuit packages Jul. 12, 2011
7973391 Tapered dielectric and conductor structures and applications thereof Jul. 5, 2011
7968448 Semiconductor device and manufacturing method thereof Jun. 28, 2011
7968446 Metallic bump structure without under bump metallurgy and manufacturing method thereof Jun. 28, 2011
7968432 Laser processing apparatus and laser processing method Jun. 28, 2011
7964494 Integrated connection arrangements Jun. 21, 2011
7952206 Solder bump structure for flip chip semiconductor devices and method of manufacture therefore May. 31, 2011
7952187 System and method of forming a wafer scale package May. 31, 2011
7932171 Dual metal stud bumping for flip chip applications Apr. 26, 2011
7932170 Flip chip bump structure and fabrication method Apr. 26, 2011
7927997 Flip-chip mounting method and bump formation method Apr. 19, 2011
7923836 BLM structure for application to copper pad Apr. 12, 2011
7923290 Integrated circuit packaging system having dual sided connection and method of manufacture thereof Apr. 12, 2011
7911064 Mounted body and method for manufacturing the same Mar. 22, 2011
7911019 Reflowable camera module with improved reliability of solder connections Mar. 22, 2011
7910471 Bumpless wafer scale device and board assembly Mar. 22, 2011
7910460 Metallic electrode forming method and semiconductor device having metallic electrode Mar. 22, 2011
7906424 Conductor bump method and apparatus Mar. 15, 2011
7901982 Modified chip attach process Mar. 8, 2011
7898083 Method for low stress flip-chip assembly of fine-pitch semiconductor devices Mar. 1, 2011
RE42158 Semiconductor device and manufacturing method thereof Feb. 22, 2011
7888254 Semiconductor device having a refractory metal containing film and method for manufacturing the same Feb. 15, 2011
7875495 Standoff height improvement for bumping technology using solder resist Jan. 25, 2011
7871919 Structures and methods for improving solder bump connections in semiconductor devices Jan. 18, 2011
7867821 Integrated circuit package system with through semiconductor vias and method of manufacture thereof Jan. 11, 2011
7863096 Embedded die package and process flow using a pre-molded carrier Jan. 4, 2011
7859107 Solder attach film and assembly Dec. 28, 2010
7851345 Semiconductor device and method of forming oxide layer on signal traces for electrical isolation in fine pitch bonding Dec. 14, 2010
7851265 Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus Dec. 14, 2010
7843075 Apparatus and methods of forming an interconnect between a workpiece and substrate Nov. 30, 2010
7842542 Embedded semiconductor die package and method of making the same using metal frame carrier Nov. 30, 2010
7838988 Stud bumps as local heat sinks during transient power operations Nov. 23, 2010
7838977 Packages for electronic devices implemented with laminated board with a top and a bottom patterned metal layers Nov. 23, 2010
7838971 Method to provide substrate-ground coupling for semiconductor integrated circuit dice constructed from SOI and related materials in stacked-die packages Nov. 23, 2010
7838954 Semiconductor structure with solder bumps Nov. 23, 2010
7838409 Structures and methods for an application of a flexible bridge Nov. 23, 2010
7838331 Method for dicing semiconductor substrate Nov. 23, 2010
7834454 Electronic structures including barrier layers defining lips Nov. 16, 2010
7829452 Terminal pad structures and methods of fabricating same Nov. 9, 2010
7829378 Method of manufacturing electronic device, substrate and semiconductor device Nov. 9, 2010
7825511 Undercut-free BLM process for Pb-free and Pb-reduced C4 Nov. 2, 2010
7821131 Substrate including barrier solder bumps to control underfill transgression and microelectronic package including same Oct. 26, 2010
7820479 Conductive ball mounting method Oct. 26, 2010
7816277 Method for forming deposit, droplet ejection apparatus, electro-optic device, and liquid crystal display Oct. 19, 2010
7816252 Method for forming bumps on under bump metallurgy Oct. 19, 2010
7812447 Wafer level pre-packaged flip chip Oct. 12, 2010
7811853 Method for avoiding die cracking Oct. 12, 2010
7807560 Solder bump forming method Oct. 5, 2010
7800232 Metallic electrode forming method and semiconductor device having metallic electrode Sep. 21, 2010
7799612 Process applying die attach film to singulated die Sep. 21, 2010

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